News Posts matching "Xeon Phi"

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Intel Reveals Details for Future HPC System Building Blocks

Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

Puget Systems Launches New Quad CPU Workstations

Puget Systems has been providing quad socket workstations for years now. Today, we refresh that product with a new duo of quad socket workstations that offer even more capacity, better cooling, and quieter operation. The new Peak Quad CPU workstations come in both Intel and AMD varieties. Our intention with this refresh is to take some of the highest performance workstation configurations available today and make them something you can put in your lab or office. Most workstations and servers of this caliber come with a prohibitive noise level but the Peak line of workstations solves this problem while still providing excellent cooling and long component lifespan.

In addition to supporting four CPUs, these workstations also support other high performance options such as large SSD arrays and accelerator cards including Intel Xeon Phi and NVIDIA Tesla. Most importantly, we have designed these workstations to be flexible. With systems at this level, it is typical for us to plan, design, implement and test a custom solution for each customer and use case. If you are unsure whether Peak is right for you, just ask! We have dedicated staff on hand for HPC, parallel and cluster computing.

Micron Collaborates With Intel to Enhance "Knights Landing"

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Details Its Next-Gen Xeon Phi Processor

Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

NCKU Develops World's First Switchless Cluster Supercomputer

The National Cheng Kung University (NCKU) Supercomputing Research Center (RSC) has built the world's first switchless cluster computer. Known as the "CK-Star", this computer connects eight computers without switch control, thus breaking Intel's performance record. Together with the computer systems provided by Acer, the CK-Star is jointly built by NCKU RSC Director Dr. Chi-Chuan Hwang and Dr. Yuefan Deng of Mainland China's National Supercomputing Center in Jinan (NSCCJN), who is also a Distinguished Professor at the State University of New York (SUNY).

NCKU RSC Director Dr. Chi-Chuan Hwang added that CK-Star is the most unique switchless cluster supercomputer compared to traditional cluster supercomputer which requires switch control to control interaction between nodes. He explained that the weakness of the traditional one is that switches will become performance bottlenecks when the number of nodes is large. Besides, switches also consume large amount of power, estimated to be 50% of the total power consumption. With the introduction of the CK-Star which allows the unrestricted expansion of supercomputers, these problems can be overcome.

Intel Brings Supercomputing Horsepower to Big Data Analytics

Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

"In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

Cray XC30 Supercomputers Added NVIDIA Tesla GPUs and Intel Xeon Phi Coprocessors

Global supercomputer leader Cray Inc. today announced the Company has broadened its support for accelerators and coprocessors, and is now selling the Cray XC30 series of supercomputers with NVIDIA Tesla K20X GPU accelerators and Intel Xeon Phi coprocessors. This marks the latest step in Cray's Adaptive Supercomputing vision, which is focused on delivering innovative systems that integrate diverse technologies like multi-core and many-core processing into a unified architecture.

"Our first experience with climate and materials science applications showed that replacing one of the multi-core processors in the XC30 with an NVIDIA Tesla GPU boosts application performance and disproportionally reduced energy to solution," said Thomas Schulthess, professor at ETH Zurich and director of the Swiss National Supercomputing Center, which was one of the first Cray customers to order a hybrid Cray XC30 system. "This provides necessary proof of principle in favor of hybrid compute nodes as a promising solution to the energy challenges we face in supercomputing."

Intel Powers the World's Fastest Supercomputer, Reveals New HPC Technologies

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Intel Releases SDK with OpenCL 1.2 Support for Intel Xeon Phi Coprocessors

Intel has announced the production release of the Intel SDK for Open CL Applications XE 2013 that launched as a beta program in December. The new SDK broadens options for developers on Intel architecture and includes tools, optimization guides and training.

The SDK helps OpenCL developers improve performance and efficiency on Intel Xeon Phi coprocessors and Intel Xeon processors as well as create highly parallel applications for high performance computing workstations, data analytics and other uses. Download the Intel SDK for OpenCL Applications XE 2013 here.

TYAN's New 1U Server and 4 GPU Compatible 2U Server Announced

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

GIGABYTE Announces New Server and Workstation Motherboards

GIGABYTE is proud to announce two new models of workstation motherboards and one new model dedicated to mission critical server applications. All of them being based on the Intel Xeon processors E5-2600 product family, these new models are designed to answer demanding needs for computing resources across various usage models, form factors and scales. While these products have been naturally thought for scenarios requiring heavy computing power through GPUs or GPGPU / co-processors cards, from CAD/CAE to rendering, simulation and modeling, their most notable advantage relies in their unique memory performance capability. GIGABYTE motherboards support DDR3-1600 MHz speeds with 16 GB 1.35V RDIMMs.

Achieved through GIGABYTE's capabilities in design, PCB layout and BIOS fine-tuning, this feature will be most appreciated in the many workstation applications where improvements in memory frequency result in speeding up the user's productivity and in all the industries relying on server applications where each incremental improvement in memory performance results in significant benefits, such as in finance.

Intel Promotes Five Corporate Officers, Elects Three New Corporate Vice Presidents

Intel Corporation today announced that its board of directors promoted five corporate officers and elected three new corporate vice presidents. William M. Holt, 60, was elevated from senior vice president to executive vice president. He is general manager of the Technology and Manufacturing Group and jointly oversees all technology development and manufacturing activities across the company. Holt joined Intel in 1974, was named a senior vice president in 2006, and is based in Hillsboro, Ore.

Thomas M. Kilroy, 55, was promoted from senior vice president to executive vice president. He is general manager of Intel's Sales and Marketing Group and is responsible for all of the company's sales and marketing efforts worldwide. Kilroy joined Intel in 1990, was named a senior vice president in 2010, and is based in Hillsboro, Ore.

ASUS Unveils Server with Intel Xeon Phi and NVIDIA Tesla K20/K20X

ASUS servers have proven their capabilities as part of the MOGON supercomputer project, which was co-developed by ASUS and Megware for Johannes Gutenberg University Mainz and ranked 81 on the prestigious TOP500 supercomputer list in June 2012. ASUS now presents one of the world's first servers to support the Intel Xeon Phi 5110P coprocessor and NVIDIA next-gen Kepler-based Tesla K20/K20X GPUs, unveiled at the 2012 Supercomputing Conference, held November 10-16 in Salt Lake City, Utah.

The ASUS ESC4000 G2 Series provides up to 4TFLOPS peak computing power, delivering extreme hybrid performance as demanded by HPC customers. ASUS also offers ESC2000 G2 and ESC1000 G2 Series servers and workstations with ASUS SSD technology that accelerates storage by up to three times in workstation-related tasks.

HP Delivers Industry's First Purpose-Built Server for Big Data

HP today unveiled the industry's first server built to help clients operationalize Big Data, drive new business opportunities and save up to $1 million over three years.

With the advent of Big Data software and the promise that it brings, many organizations have tried to deploy these solutions on existing architectures not designed to handle the specific needs of these workloads. As a result, the outcomes from these early deployments have been suboptimal from a performance and cost perspective.

Supermicro New 4U FatTwin Supports 12x Intel Xeon Phi Coprocessors

Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, has readied a wide selection of server platforms for Intel Xeon Phi coprocessors based on Intel Many Integrated Core (MIC) architecture in form-factors ranging from 1U-3U rack mount systems to 4U Tower servers.

Supermicro's 4-node FatTwin platform has a new model which supports up to 3 Intel Xeon Phi Coprocessor cards per U for a total of 12 coprocessors in 4U. With dual Intel Xeon processor E5-2600 and up to 512 GB of memory support per node this hybrid SuperServer offers an amazing amount of parallel processing power to accelerate research while simplifying development of highly-parallel applications. A key advantage of the FatTwin platform is its shared resource, power saving architecture with high-efficiency 8 cm heavy-duty cooling fans, optimized airflow and Platinum Level (94%+) power supplies, which combined provide up to 16% greater efficiency over similar server systems.

Intel Delivers New Architecture for Discovery with Intel Xeon Phi Coprocessors

Marking a new era in high-performance computing, Intel Corporation introduced the Intel Xeon Phi coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.

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