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Intel Launches Low-Power, High-Performance Silvermont Microarchitecture

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

Advantech Launches ATX Intel Xeon E5 Industrial Serverboard

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

IDF 2013 Transforming Computing Experiences from the Device to the Cloud

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Thecus Announces High Performance 64-bit Rackmount and Tower NVR Systems

Definitely, 2013 starts with a big boom at Thecus. After the launch of the N12000PRO and N16000PRO, the announcement of the 64 bit ThecusOS 6.0, the unveiling of the N2520/N4520 and Intelligent NAS utility at CeBIT 2013, it's time for the NVR family to impress the world with 7 new devices with updated architecture to offer superior performances.

We here by present you in tower format the V2510, V4510, V5510 and V6810; and for the rackmount category, we have the new V4510U, V8810U and V16810U. All equipped with the VisoGuard security system management software developed in partnership with Netavis, these new NVR will offer better performances than ever for all type of users with needs of 2, 4, 5, 6, 8 or 16 bays of storage.

TYAN Showcases Cutting-edge GPU Platforms at GTC 2013

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, will present its cutting-edge GPU supporting platform during the NVIDIA GTC 2013. Ranging from 2U to 4U and compatible with1 to 8 GPUs. TYAN offers a full product portfolio to customers which are compatible with NVIDIA Tesla K Series GPU Accelerators. The TYAN S7055 and S7056 motherboard will be showcased as well as TYAN TA77-B7061 and FT48-B7055 barbones at TYAN's booth (#503) during the GTC 2013.

Targeting from mainstream applications to the most complicated high performance computing, TYAN develops a rich product portfolio of GPU based platforms. These products offer flexible and scalable performance as well as maximum efficiency in order to help customers deploying an ideal GPU cluster solutions. All the TYAN GPU platforms are under-validation with industry-leading companies' GPU products. The TYAN TA77-B7061, FT48-B7059 and FT77-B7059 GPU platforms passed the validation and are fully compatible with NVIDIA Tesla K Series GPU Accelerators. The bundled product portfolios of TYAN GPU platforms and NVIDIA Tesla K Series will be widely available in Q2.

TYAN's New 1U Server and 4 GPU Compatible 2U Server Announced

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

Mac Pro Gets Updated This Spring, Powered by Ivy Bridge-EP Xeon

Apple's high-performance desktop Mac Pro will get its long overdue specifications overhaul this spring. The Mac Pro is being pulled off shelves in Europe due to lack of compliance with local regulations; but a French retailer believes the pull out is temporary, and that a new, rehashed Mac Pro will be reintroduced in Spring (March-April). The new Mac Pro pole-vaults Sandy Bridge-EP Xeon processor line to Intel's next-generation Xeon "Ivy Bridge-EP" dual-socket processors, SSDs being standard equipment, and the latest generation NVIDIA GeForce or AMD Radeon graphics cards. It's also quite likely that Apple to refresh its display lineup to support higher resolutions.

Source: X-bit Labs

GIGABYTE Announces New Server and Workstation Motherboards

GIGABYTE is proud to announce two new models of workstation motherboards and one new model dedicated to mission critical server applications. All of them being based on the Intel Xeon processors E5-2600 product family, these new models are designed to answer demanding needs for computing resources across various usage models, form factors and scales. While these products have been naturally thought for scenarios requiring heavy computing power through GPUs or GPGPU / co-processors cards, from CAD/CAE to rendering, simulation and modeling, their most notable advantage relies in their unique memory performance capability. GIGABYTE motherboards support DDR3-1600 MHz speeds with 16 GB 1.35V RDIMMs.

Achieved through GIGABYTE's capabilities in design, PCB layout and BIOS fine-tuning, this feature will be most appreciated in the many workstation applications where improvements in memory frequency result in speeding up the user's productivity and in all the industries relying on server applications where each incremental improvement in memory performance results in significant benefits, such as in finance.

Global Micro Servers Market Worth $26.55 Billion by 2018

According to a new market research report, "Global Micro Servers Market (2013 - 2018), By Processor Type (Intel, Arm, Amd), Component (Hardware, Software, Operating System), Application (Media Storage, Data Centers, Analytics, Cloud Computing) & Geography (North America, Europe, Asia Pacific, Row)", published by MarketsandMarkets, the total market for next generation memory is expected to reach $26.55 billion by 2018 at an estimated CAGR of 62.3% from 2013 to 2018.

In a simpler terminology, micro servers can be termed as servers that multiple mobile processor chips, consume low power, use less space and are specifically used by small to medium - sized businesses. Micro servers find their major application in media storage and internet data centre especially for applications like lightweight web serving, simple content delivery nodes and low end dedicated hosting. It was identified that cloud computing and analytics are some other applications of micro servers which are growing rapidly. Micro servers presently account for 2.3% of the total server sales however looking at the current growth rate, in the next five years it is expected to reach 25 to 30% per cent of the global server market.

Intel, Facebook Collaborate on Future Data Center Rack Technologies

Intel Corporation announced a collaboration with Facebook to define the next generation of rack technologies used to power the world's largest data centers. As part of the collaboration, the companies also unveiled a mechanical prototype built by Quanta Computer* that includes Intel's new, innovative photonic rack architecture to show the total cost, design and reliability improvement potential of a disaggregated rack environment.

"Intel and Facebook are collaborating on a new disaggregated, rack-scale server architecture that enables independent upgrading of compute, network and storage subsystems that will define the future of mega-datacenter designs for the next decade," said Justin Rattner, Intel's chief technology officer during his keynote address at Open Computer Summit in Santa Clara, Calif. "The disaggregated rack architecture includes Intel's new photonic architecture, based on high-bandwidth, 100 Gbps Intel Silicon Photonics Technology, that enables fewer cables, increased bandwidth, farther reach and extreme power efficiency compared to today's copper based interconnects."

Intel Could Find a Way to Keep LGA CPUs: ASUS

In an interview with DigiTimes, ASUS general manager of motherboard business Joe Hsieh commented on reports of Intel abandoning CPU sockets in favor of processors being hardwired to motherboards in BGA packages. Hsieh said that the issue will not be as bad as people think and Intel could find a strategy that allows both soldered and socketed processors to be sold, which is much like today, except that hardwired processors are limited to notebooks (Core i3 and i5 processors in the BGA1224 package) and low-end Atom-driven desktop motherboards.

What lends Hsieh's statement weight, apart from the fact that he leads the biggest PC motherboard design team, is that Intel recently denied those reports, saying it would provide socketed CPUs for "the foreseeable future." Last month, Japanese publication PC Watch, credited for generally accurate tech predictions based on information at hand, reported that following its 22 nm Core "Haswell" CPU family, Intel could transform its entry-, mainstream-, and performance-segment client CPUs to hardwired BGA packages, probably leaving socketed CPUs only to HEDT (high-end desktop) and enterprise Xeon processor lines. Other PC motherboard vendors DigiTimes spoke with echoed ASUS' opinion, they don't believe Intel could "suddenly" completely change the way processors are sold to consumers.

Source: DigiTimes

Intel Delivers the World's First 6-Watt Server-Class Processor

Intel Corporation introduced the Intel Atom processor S1200 product family today, delivering the world's first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

"The data center continues to evolve into unique segments and Intel continues to be a leader in these transitions," said Diane Bryant, vice president and general manager of the Datacenter and Connected Systems Group at Intel. "We recognized several years ago the need for a new breed of high-density, energy-efficient servers and other datacenter equipment. Today, we are delivering the industry's only 6-watt SoC that has key datacenter features, continuing our commitment to help lead these segments."

Eurocom Ships First 8-core Xeon E5-2690 Based Laptop

EUROCOM Panther 4.0 supercomputer laptop delivers unmatched 2D/3D capabilities for heavy duty 3D and 2D applications, like CAD (Computer-Aided Design), CAE (Computer-Aided Engineering), DCC (Digital Content Creation), visualization, and simulation. It is ideal for Engineering on the Go, Rapid Engineering Deployment Teams and for Server on the Go applications.

Intel Delivers New Architecture for Discovery with Intel Xeon Phi Coprocessors

Marking a new era in high-performance computing, Intel Corporation introduced the Intel Xeon Phi coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.

Future Itanium and Xeon Processors Socket-Intercompatible

In what could be the very first time two different machine architectures share a platform, future versions of Intel's Xeon and Itanium processors could be socket-compatible. Intel Itanium is based on the Itanium64 (IA64) machine architecture, while Xeon is x86-64 based. Intel plans to implement its common platform strategy with the next generation models of the two, that's "Kittson" Itanium, and "Haswell" Xeon.

This level of convergence could make it easier for companies to deploy select amounts of Itanium and Xeon processors in their data-centers, to suit specific tasks, and save money on buying common platforms for both. Itanium processors are typically preferred for in mission-critical environments, where there's close to zero margin for error (think military, medical, and space-exploration); while Xeon is good at handling heavy serial processing loads (think servers, database management, cloud). Introduction of the converged platform is expected in the 2013-2015 time range, using Xeon "Haswell" launch as a point of reference.

Source: X-bit Labs

Cray Unveils the Cray XC30 Supercomputer

Global supercomputer leader Cray Inc. (NASDAQ: CRAY) today announced the launch of the Company's next generation high-end supercomputing systems -- the Cray XC30 supercomputer. Previously code-named "Cascade," the Cray XC30 supercomputer is the Company's most-advanced high performance computing system ever built. The Cray XC30 combines the new Aries interconnect, Intel Xeon processors, Cray's powerful and fully-integrated software environment, and innovative power and cooling technologies to create a production supercomputer that is designed to scale high performance computing (HPC) workloads of more than 100 petaflops.

Lenovo Introduces Tower ThinkServer to Power Back-End Processing

Lenovo today announced the availability of ThinkServer TD330, designed to handle behind-the-scenes IT tasks for small-and-medium-sized organizations – from schools deploying virtual desktop sessions or blackboard applications, to retail deployments, to distributed environments like banks with multiple locations. Supporting up to 16 cores based on the Intel Xeon E5-2400 processor family, the TD330 does the heavy-lifting, running line-of-business applications that support business processing and collaborative efforts.

ThinkServer TD330 is the first product introduced by Lenovo's new Enterprise Product Group, a dedicated business unit that will expand the Company's server, storage, networking and software offerings. It will be led by Roy Guillen, vice president and general manager, Enterprise Product Group, Lenovo.

Iomega Announces Availability of StorCenter px12-450r Network Storage Array

Iomega, a global leader in data protection, today announced the worldwide availability this month of the new Iomega StorCenter px12-450r Network Storage Array, multi-protocol networked data storage for small and medium business, remote office/branch office installations and distributed enterprises. The StorCenter px12-450r features the new Intel Xeon Processor E3-1200 v2 Product Family, 8GB RAM, improved user supportability and the option of 4TB hard disk drives (HDD). Additionally, the StorCenter px12-450r utilizes the latest version of the EMC LifeLine software, an advanced operating system that makes EMC's enterprise class expertise and cloud capabilities available to a broad range of users.

Intel Xeon Processors and Xeon Phi Powers World's Most Efficient HPC Data Center

Signaling its commitment to energy-efficient high- performance computing, Intel Corporation today announced that it will work with HP to help design and provide the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) with a supercomputing system that will drive research across a number of energy-related initiatives, including renewable energy and energy-efficient technologies. The new High Performance Computer (HPC) data center promises to become one of the world's most efficient installations.

The system is scheduled to deliver full compute capacity in the summer of 2013 and will feature approximately 3,200 Intel Xeon processors including current-generation Intel Xeon processor E5-2670, future 22nm Ivy Bridge based processors and approximately 600 new Intel Xeon Phi co-processors. The total peak performance of the system is expected to exceed 1 Petaflop (equivalent to a thousand trillion floating point operations per second) and it will be the largest supercomputer dedicated solely to renewable energy and energy efficiency research. Leading energy-efficient capabilities of Intel Xeon processors and Intel Xeon Phi co-processors combined with the new HP warm water cooling solution and innovative data center design will result in this facility likely being the world's most efficient data center with a power usage effectiveness (PUE) rating of 1.06 or better.

Intel Reveals Architecture Details of Intel Xeon Phi Co-Processor

During HotChips symposium, George Chrysos, the leading architect of Intel Xeon Phi co-processor shared the new architecture details of upcoming Intel's HPC powerhouse. Designed for highly-parallel applications, Intel Xeon Phi co-processor based on Intel Mani Integrated Core architecture will deliver the combination of industry leading performance per watt with the ability to re-use the existing code and applications without necessity of re-writing them.

Equipped with more than 50 cores and built using Intel's latest 22nm 3D Tri-gate transistor technology, new co-processors will be in production this year with first supercomputers from top500 list already taking advantage of this technology. In his blog here, George shares his aspirations and goals during designing the co-processor and summarizes all new disclosed information. The HotChips presentation is also available below.

Intel Federal LLC to Propel Supercomputing Advancements for the U.S. Government

With the U.S. Government increasingly using high- performance computing (HPC) to address current and future national challenges, Intel Corporation today announced it has been awarded two subcontracts totaling $19 million with the U.S. Department of Energy (DOE). As part of these two awards, Intel Federal LLC, a wholly owned subsidiary, will be a major participant in the Lawrence Livermore National Security, LLC (LLNS) managed Extreme-Scale Computing Research and Development "FastForward" program aimed at driving advancements in exascale computing.

The DOE has been a leading developer of supercomputing technology for a broad range of critical applications in the space of national security, economy, energy resources and consumption. The "FastForward" program will harness the talents of the national laboratories, academia and U.S. industry to develop the next generation of HPC technologies.

AVADirect Now Offers Personal Supercomputer

AVADirect, a leading provider of custom computer systems, offers the first personal supercomputer workstation with Dual 8-Core Xeon CPUs, 192GB Memory and Four Graphics Cards. Because of the close partnership with EVGA, AVADirect now offers ground breaking capabilities based on new EVGA SR-X motherboard with wide variety of component combinations to meet the needs of the most demanding professionals or enthusiasts.

Within the past month, manufacturers began to release new motherboards based on the E5 2600 XEON processors. End-users have seen them offered in rackmount and tower configurations from Supermicro, Asus, and Intel. Now, AVADirect is proud to announce that EVGA has released an enthusiast series motherboard that AVADirect offers in a custom configuration. Supported by the EVGA Classified SR-X dual-socket 2011 motherboard, the configuration boasts a whole new level of performance and expandability, including 7x PCI e expansion slots (with PCI-E 16x 3.0 support), 6x USB 3.0 ports, and 8x internal SATA ports; 4 being SATA III 6Gb/s. More importantly, the system will support up to 192GB of certified, Quad-Channel ECC RAM.

GIGABYTE Introduces its Line of Barebone Rack Servers Based on the Intel Xeon E5

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of server hardware, today announced the launch of its complete line of barebone rack servers based on the Intel Xeon processor E5 family.

This refresh in GIGABYTE’s server hardware offering includes a large choice of dual socket systems based on the Intel Xeon processor E5-2600 and E5-2400 product families. Customers can therefore narrow down their processor and system choice according to their specific needs in computing power and energy consumption.

Intel Reveals 22nm "Avoton" SoC for Micro Servers in 2013

Today during the Structure Conference in San Francisco, Jason Waxman, GM of the Cloud Infrastructure Group outlined Intel’s vision and roadmap for microservers and discussed how they best suited to handle emerging “scale-out” applications. Waxman provided an update on Intel's roadmap for microservers including new generations of Intel Xeon processors and Intel Atom architecture based 22nm SoC chips codenamed "Avoton", both scheduled for 2013. In his blog Jason also talks about why within the new segment of servers it is the application that will decide which core – Intel Atom or Xeon - will be the optimal solution. Waxman's presentation can be found here.

Intel Xeon Processors E5 Achieve Fastest Adoption, Announcing Xeon Phi Co-Processors

The Intel Xeon processor E5-2600 product family reached a new supercomputing milestone as the fastest adopted new processing technology to power 44 systems, including 3 Petascale-class supercomputers on the 39th edition of the Top500 list announced today.

The "SuperMUC" supercomputer at LRZ in Germany, which ranked fourth on the list, delivers 2.9 PetaFLOPs of performance, making it the most powerful in Europe, as well as the largest installation based on the new Intel Xeon processors E5 family.
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