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Icy Dock Announces MB080U3S-1SB Blizzard Tool-Less HDD Enclosure

External enclosures are a great way to have high capacity data storage on the go. Data can also be a critical factor for users in the media business or who work with data centers. Some of the top tier hard drive companies have made their own all in one enclosure with hard drive included. However, one of the known major causes of hard drive failure is due to excessive heat buildup caused by a lack of a proper cooling system.

Also, a majority of hard drive manufactures only allow a 1 year warranty on their all in one external hard drives. This can be fatal for someone who has just lost their data and has to spend a significant amount of money in order to recover their data. There are other external enclosures in the market that provide a cooling system to help prevent this, but the physical placement of the cooling system does not always allow for the optimal airflow to cool the hard drive. Going above and beyond, the MB080U3S-1SB Blizzard is the next generation of external enclosures dedicated for maximum performance in cooling.

JEDEC Updates Universal Flash Storage (UFS) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.

MIPI Alliance and USB 3.0 PG Announce Availability of USB Inter-Chip Specification

MIPI Alliance and the USB 3.0 Promoter Group today announced the completion of the SuperSpeed USB Inter-Chip (SSIC) specification. The specification defines a chip-to-chip USB based internal interconnect for mobile devices as well as other platforms. SSIC offers MIPI Alliance’s M-PHY high bandwidth and low power capabilities combined with SuperSpeed USB performance enhancements.

The M-PHYSM interface, a high speed serial interface, targets up to 2.9 Gbps per lane with scalability up to 5.8 Gbps per lane and offers a low pin count and exceptional power efficiency. SuperSpeed USB offers a 5 Gbps signaling rate, up to 10 times faster than Hi-Speed USB (USB 2.0), enhanced protocol and power management and backward compatibility with the existing USB device and software model.

German Scientists Tap NVIDIA GPUs To Unlock Secrets Of The Brain

NVIDIA today announced that its GPUs will be used by scientists at Germany's Forschungszentrum Jülich, which hosts the Jülich Supercomputing Centre, one of Europe's largest and most powerful supercomputing resources, to accelerate advanced neurological research targeted at unlocking secrets of the human brain.

NVIDIA also announced a new, multiyear collaboration with the center to drive the next generation of GPU-accelerated scientific research in neuroscience and a range of other fields, including astronomy, astrophysics, material science, particle physics, and protein folding. Together the two organizations are launching the "NVIDIA Application Lab," a jointly run and staffed resource for the European scientific community located at the center's facilities in Jülich.

Noctua Unveils Noise-Canceling Fan, and More Innovations at Computex

Noctua's booth at last week's Computex Taipei not only hosted world's first public demonstration of a PC fan with integrated Active Noise Cancellation (ANC) but also gave a stage to upcoming Noctua products such as the new A-series fans, third generation NF-S12 fan and 37mm low profile CPU coolers. In addition to these upcoming products, Noctua also gave an exclusive insight on some of its current development projects for its D-, U-, C- and L-series heatsinks.

Firstly, Noctua has displayed its completely new A-series fans that feature a novel aerodynamic design measure called Flow Acceleration Channels to reduce boundary layer separation as well as Noctua's AAO (Advanced Acoustic Optimisation) frames. The new A-series fans are scheduled for launch in September/October and will come in square 140mm, round 140mm, slim 92mm plus 60 and 40mm sizes.

NETGEAR Showcases Industry's First 802.11ac Cable Gateway

NETGEAR, Inc., a global networking company that delivers innovative products to consumers, businesses and service providers, today announced that it will showcase several innovative solutions for cable operators, including a groundbreaking DOCSIS3.0 gateway integrated with 802.11ac wireless technology, at the ANGA Cable show taking place June 12- 14 in Cologne, Germany. In addition, NETGEAR will also demonstrate its 24 x 8 channel bonded DOCSIS/Euro-DOCSIS gateway to support up to 1.2Gbps downstream and 320Mbps upstream data rate.

The NETGEAR 802.11ac DOCSIS3.0 gateway supports wireless connectivity that is up to three times faster than today's 802.11n routers. With multiple antennae and dual band WiFi, the cable gateway increases the coverage area for HD streaming in the home while enabling consumers to download web content from any device in the home significantly faster than it would take on a similar 802.11n device.

SK Hynix and IBM Sign Joint Development for PCRAM

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or ‘PCRAM’) technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM’s expertise in such disciplines with SK Hynix’s cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

Wave of Innovation Coming from Microsoft and its Partners This Year

Today during a keynote address at COMPUTEX, Steven Guggenheimer, corporate vice president of the original equipment manufacturer (OEM) division at Microsoft Corp., demonstrated the breadth of innovation happening across Windows and the Windows ecosystem. He announced the second community technology preview (CTP) for Windows Embedded Standard 8, unveiled Quanta's new private cloud server solution, highlighted Ford's launch of its award-winning SYNC in-car connectivity system for Taiwan, and showed off some of the latest Windows devices.

When it comes to delivering Windows technologies across PCs, servers, phones and specialized devices, Microsoft is taking a holistic approach by providing familiar tools and technologies that enable customers and partners to maximize their investments. To that end, Microsoft today announced the second CTP for Windows Embedded Standard 8, which delivers the power of Windows for specialized devices running line-of-business applications within intelligent systems. Windows Embedded Standard 8 encompasses tools for natural, immersive user experiences and the ability for OEMs to define and control the device capabilities, with additional technologies that extend the power of Windows on industry devices. The CTP is available immediately for download by visiting this page.

New Toshiba Business-Class Laptops Take Power and Patch Management to the Next Level

Toshiba’s Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its enhanced business laptops product line with 3rd generation Intel Core processors and new technology developed with IBM that enables IT professionals to better control the security and power management across enterprise deployments. The new models include the Portégé Z930 Ultrabook and the Portégé R930 ultraportable, as well as upgrades to its Tecra line of laptops, business workhorses with enhanced durability, security and reliability.

SanDisk Uses 19 nm Process To Manufacture iNAND Extreme

SanDisk Corporation, a global leader in flash memory storage solutions, today announced it is using the world’s most advanced semiconductor manufacturing process to produce SanDisk’s highest performing embedded memory products.

iNAND Extreme is now being built on SanDisk’s 19 nanometer (nm)* process technology to enable the large-capacity, high-performance embedded NAND flash memory products that are ideally suited for high-end tablets and smartphones. Products running the Android operating system as well as the upcoming Microsoft Windows RT version of the Windows 8 operating system can benefit from iNAND Extreme capacity, performance and small size.

Cougar Announces Challenger Case, Platinum PTX PSU, Vortex Fan

As every year, COUGAR, leading German PC case and power supply brand, will be showing a strong presence at the Computex 2012 Tech Fair in Taipei, Taiwan. At booth J0409a, Floor 1 in the Nangang Exhibition Hall from June 5 through June 9, COUGAR will be challenging serious gamers with their latest high-end PC equipment line-up. Prominently on the floor ground will be the long-awaited Challenger ultimate gaming case, the most power efficient 80 Plus Platinum certified PC power supply Platinum PTX, as well as the patented and award-winning Vortex series of PC case fans.

GIGABYTE is First with Validated 7.032 GHz CPU Clock World Record on Ivy Bridge

GIGABYTE TECHNOLGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced the record highest validated CPU clock speed on the Intel Core i7 3770K processor using a GIGABYTE Z77X-UD3H motherboard, as well as the new world record highest DDR3 memory speed using the GIGABYTE Z77X-U5H motherboard.

The 7.0 GHz milestone was surpassed using an Intel 3rd generation Core i7 3770k processor (aka Ivy Bridge) by renowned overclocker HiCookie, pushing the GIGABYTE Z77X-UD3H motherboard to a fully validated 7.03 GHz using liquid nitrogen cooling. This is regarded as the current #1 highest Ivy Bridge CPU frequency and a world record according to respected global overclocking website HWBot.org.

Super Micro Intros X9 5X GPU Workstation with NVIDIA Maximus Certification

Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, now offers NVIDIA Maximus technology in its latest high-end, enterprise-class X9 SuperWorkstation (7047GR-TRF), allowing users to simultaneously design, render and simulate on the same workstation, avoiding traditional, time-consuming and costly processing downtime. Supermicro's NVIDIA Maximus certified solution integrates an NVIDIA Quadro series graphics processing unit (GPU) dedicated for design and visualization tasks with four NVIDIA Tesla C2075 co-processors dedicated to handling compute-intensive tasks like simulation—an industry-first configuration of NVIDIA Maximus technology.

Iomega Announces New Flagship NAS for Small and Medium Business

Iomega, an EMC company and a global leader in data protection, today announced the new Iomega StorCenter px12-450r Network Storage Array, multi-protocol networked data storage for small and medium business, remote office/branch office installations and distributed enterprises. The StorCenter px12-450r features the new Intel Xeon Processor E3-1200 v2 Product Family, 8GB RAM, improved user supportability and is ready for 4TB* hard disk drives (HDD) and 10 gigabit Ethernet (10GbE) networks. Additionally, the StorCenter px12-450r utilizes the latest version the EMC LifeLine software, an advanced operating system that makes EMC's enterprise class expertise and cloud capabilities available to a broad range of users.

Point of View GeForce GTX 670 Launched

Point of View, a premier NVIDIA graphics partner and manufacturer of Android tablets, notebooks and other hardware, launches today the first card of the GeForce 600 family: the POV GeForce GTX 670. The GeForce GTX 670 is a DirectX 11 and shader model 5.0 supporting graphics card with of course existing NVIDIA features such as NVIDIA 3-way SLI Technology, PhysX, PureVideo HD and CUDA being present!

However, the real reason to upgrade to the GeForce GTX 670 is the huge jump in raw processing power. Crush all your previous performance records with an all-new monster card! The GeForce GTX 670 definitely walks in the footsteps of its’ GTX 680 and 690 brothers; performance wise and feature wise.

Cisco Reports Third Quarter Earnings

Cisco, the worldwide leader in networking that transforms how people connect, communicate and collaborate, today reported its third quarter results for the period ended April 28, 2012. Cisco reported third quarter net sales of $11.6 billion, net income on a generally accepted accounting principles (GAAP) basis of $2.2 billion, or $0.40 per share, and non-GAAP net income of $2.6 billion, or $0.48 per share.

"We delivered solid results this quarter with record revenue and non-GAAP earnings per share," said John Chambers, Cisco chairman and CEO. "We are successfully executing against our long-term strategic plan of growing profit faster than revenue, and in a cautious IT spending environment, we continue to outperform our competitors."

GLOBALFOUNDRIES Fab 8 Adds Tools to Enable 3D Chip Stacking at 20nm and Beyond

GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company’s leading-edge 20nm technology platform. The TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding requirements of tomorrow’s electronic devices.

Essentially vertical holes etched in silicon and filled with copper, TSVs enable communication between vertically stacked integrated circuits. For example, the technology could allow circuit designers to place stacks of memory chips on top of an application processor, which can dramatically increase memory bandwidth and reduce power consumption—a key challenge for designers of the next generation of mobile devices such as smartphones and tablets.

Broadcom Introduces Industry's First 100 Gbps Full Duplex Network Processor

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first 100 Gbps full duplex network processor unit (NPU). Enabling the next wave of 100GbE optimized switches and routers for service provider networks, the fully programmable BCM88030 family features 64 custom processors running at 1GHz, delivering more than 2X the throughput of any NPU on the market. With the industry's highest level of integration, the BCM88030 solution eliminates costly external components, dramatically reducing system cost and power by up to 80 percent per 10 GbE port.

In 2012, the number of connected devices is set to exceed the world's population with an estimated 7 billion devices connected to the network(1). By 2015, 90 percent of content viewed on mobile devices will be streaming video and application downloads are expected to reach 47 billion per year(1). To satisfy this overwhelming appetite for bandwidth, service providers around the globe are racing to transform their networks by adopting higher bandwidth links. Analysts estimate a compound annual growth rate (CAGR) of more than 170 percent from 2011 to 2016 for 100G Ethernet ports as service providers rush to meet this demand(2).

Dell Revolutionizes Design and Performance with New Line of Precision Workstations

Dell’s newly redesigned portfolio of Dell Precision tower workstations announced today delivers superb performance, accessibility and best-in-class¹ chassis design to help creative and design professionals deliver results faster. Dell engineered its tower workstations to enable engineering, product design, animation, and other graphics and compute intensive professionals increased productivity and minimized downtime so they can focus on their innovations.

From creating the 854 stereo 3D VFX shots featured in the award-winning movie “Hugo” to designing unique architectural spaces to analyzing seismic data to accelerate exploration of natural reserves, companies around the world rely on Dell Precision workstations to design and deliver superb results fast.

MSI Launches GE60 and GE70 Gaming Notebooks

MSI has received high marks from all quarters for its high-end gaming laptops, including being selected for Innovations Honorees at the CES 2012, the IT industry's equivalent of an Oscar. Now, MSI is introducing the GE60 and GE70—the ultimate in next generation gaming notebooks. They feature Intel's latest quad core processor and new generation NVIDIA GeForce GT 650M discrete graphics card. Specially designed to meet the extreme demands of extreme gamers around the world. These killer notebooks also boast awesome peripherals.

PNY Speeds Up with the Bar Attaché USB Flash Drive

PNY worldwide leader in USB flash drives, PNY technologies, the leading manufacturer in memory products has introduced the new fast paced Bar Attaché USB flash drive. Its high speed 3.0 data transmission surpasses the standard USB 2.0 drives and accelerates data transfer making it less time consuming to access your digital files and media.

Specially designed to deliver the next generation in high speed connection, the Bar Attaché USB offers read and write speeds up to 44 MB and 65 MB respectively. Encased in metallic bronze finish, it conveys class and sophistication to perfection demanding respect and complementing the personal taste of the user. The cap on design can be attached to the rear end of the drive thus eliminating any worries of misplacing it.

PowerColor Introduces Ultra High-end VORTEX II Series

TUL Corporation, a leading manufacturer of AMD graphic cards, today announced a gaming graphics series designed for enthusiasts only: the PowerColor PCS+ Vortex II series. The latest patent cooling series released with HD7970 and HD7870; by taking advantage of the deluxe “Platinum Power Kit” design, allowing the best power efficiency and enhancing stability at overclocking mode.

The latest series armed with patent “Vortex” II cooling technology, featuring an adjustable and perforated fan design, gamers can manually adjust the fan and its physical attribute, optimizing the air flow and dissipating the excessive heat efficiently, providing no-compromise cooling effect with silent gaming environment.

ECS Z77 Black Extreme Series Boards Put Gold in the Desktop

Elitegroup Computer Systems (ECS), the world's top 3 motherboard maker, today reveals their first production of Z77 Black Extreme Series - Golden Limited Edition. Available in two models, Z77H2-AX and Z77H2-A2X, they are the top-of-the-line motherboards in the ECS Black Extreme Series, which enriches the series' themed slogan -- 'My Game, My Rules'.

The ECS Z77 Black Extreme Series - Golden Limited Edition features triple-thickness gold plated connectors and has passed the strictest quality tests, giving power users the security that the gold plating won't wear out after extensive component upgrades, safe guarding the board from the threat of corrosion.

Eurocom Adds NVIDIA GeForce GTX 675M, GTX 670M, GTX 660M and GT 650M To Its Lineup

Eurocom is supporting the new line of high performance GeForce GPUs from NVIDIA including the NVIDIA GeForce GTX 675M, 670M and 660 in single and SLI configurations in select models. Eurocom will also be supporting the NVIDIA GeForce GT 650M in select Optimus models.

The addition of the NVIDIA GeForce GTX and GT series GPU offers users new levels of high performance GPUs for computing in single and SLI (dual) configurations in new Eurocom notebooks based on next generation Intel technology. The new NVIDIA 600 series GPUs will complement the NVIDIA Quadro GPUs, already offered by Eurocom to its professional clients. NVIDIA GeForce GTX 675M comes with 2 GB of DDR5 memory, 384 CUDA cores with the GPU running at 620 Mhz for the utmost in graphics performance. Eurocom will be utilizing NVIDIA 3D technology in single and SLI configurations to improve overall graphics and 3D professional capability with enhanced performance. The NVIDIA GeForce GTX 670M comes with 1.5 GB DDR5 memory, 336 CUDA cores with the GPU running at 598 MHz. NVIDIA's GeForce GTX 660M comes with 1.5 GB DDR5 memory, 384 CUDA cores, with the GPU running at 835 MHz.
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