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AMD Announces the A8-7670K Desktop APU

AMD announced availability of its newest budget socket FM2+ APU, the A8-7670K. This part, like the recently-launched A10-7870K, is based on the company's new 28 nm "Godavari" silicon. It combines a quad-core x86-64 CPU based on the "Excavator" micro-architecture, with an integrated Radeon R7 series graphics core, featuring six Graphics CoreNext 1.2 compute units amounting to 384 stream processors; a dual-channel DDR3 integrated memory controller, with native support for DDR3-2133 MHz memory; and a PCI-Express gen 3.0 root complex.

The CPU cores on the AMD A8-7670K are clocked at 3.60 GHz, with maximum TurboCore frequency of 3.90 GHz. The CPU features unlocked base-clock multipliers, enabling CPU overclocking. The four CPU cores are spread across two "Excavator" modules, with a total of 4 MB of cache between them. The GPU is clocked at 757 MHz, and offers native support for DirectX 12 (feature level 12_0). It offers Dual-Graphics support, letting you pair it with select discrete GPUs from AMD's lineup. With the advent of DirectX 12, it should also support asynchronous multi-GPU. The A8-7670K is available now, and is priced at US $117.99 in its retail package.

ASUS Intros N3150-C and N3050-C Celeron "Braswell" Mini-ITX Motherboards

ASUS introduced the N3150-C and N3050-C, two mini-ITX motherboards based on the Intel Celeron quad-core N3150 and N3050 SoCs, respectively. The two SoCs are based on the "Braswell" silicon, embedding quad-core or dual-core CPUs based on the 64-bit x86 "Airmont" CPU micro-architecture. The dual-core N3050 features HyperThreading, enabling four logical CPUs, while the quad-core N3150 lacks it. Both chips also embed dual-channel DDR3L IMCs, supporting up to 8 GB of memory; 8th generation Intel graphics with 12 execution units, and TDPs under 6W.

The N3150-C and N3050-C from ASUS feature a common PCB design, with 24+4 pin power inputs, two full-size DDR3 DIMM slots, a single open-ended PCI-Express 2.0 x4 expansion slot, an mPCIe slot, two each of SATA 6 Gb/s, USB 3.0, and USB 2.0 ports, 6-channel HD audio, gigabit Ethernet, HDMI and D-Sub display outputs; and legacy connectivity that includes two PS/2 ports, and a serial (RS-232) port.

Source: FanlessTech

AMD Embedded G-Series SoC Powers New Line of Samsung All-in-One Thin Client

AMD today announced that Samsung Electronics Co., Ltd. selected the AMD Embedded G-Series SoC (system on chip) for a new line of all-in-one cloud monitors featuring integrated thin client technology. The Samsung 21.5-inch TC222W and 23.6-inch TC242W are powered by AMD Embedded G-Series SoCs that couple high-performance compute and graphics capability in a highly integrated, low power design. The AMD SoC improves data transfer rates and saves space on the motherboard, which makes it a perfect fit for the compact form factors required by thin clients.

"Thin client is a key market for AMD Embedded Solutions and we're thrilled that Samsung has chosen to partner with us for their newest line of products," said Scott Aylor, vice president and general manager, Embedded Solutions, AMD. "The collaboration with Samsung builds on the number one position AMD holds in a market that continues to grow, becoming more and more prevalent in commercial installations that serve a broad range of markets."

Planned availability starting in Q3 2015, the Windows-supported Samsung cloud monitors will provide customers with expanded choice, capability and configuration flexibility. Complete with Samsung's professional-grade display panel, the cloud monitors will create a superior user experience through easy connectivity and high-quality reliability. As a superior option for effective desktop virtualization, Samsung's thin-client monitors will also enable improved productivity and optimized end-to-end performance.

AMD Announces Five New Products Based on the Fiji Silicon

AMD announced no less than five new products based on its swanky new 28 nm "Fiji" silicon, the company's most powerful GPU, packing over 8 TFLOP/s of raw compute power, and the first GPU to feature stacked HBM (high-bandwidth memory), moved to the GPU package, and communicating with the GPU die over a special silicon substrate called the interposer. The "Fiji" silicon will enable AMD to target NVIDIA's entire high-end GPU lineup.

The first product is Project Quantum. This is a console-sized SFF gaming desktop designed by AMD, which will be sold by the company's add-in board partners. Despite its diminutive size, the desktop packs two "Fiji" GPUs in AMD CrossFireX, and an AMD 64-bit x86 machine driving the rest. All main components (the CPU, the chipset, and the two GPUs), are liquid-cooled. This desktop will enable smooth 4K/5K gaming in the living room.

AMD's Excavator Core is Leaner, Faster, Greener

AMD gave us a technical preview of its next-generation "Carrizo" APU, which is perhaps the company's biggest design leap since "Trinity." Built on the 28 nm silicon fab process, this chip offers big energy-efficiency gains over the current-generation "Kaveri" silicon, thanks to some major under-the-hood changes.

The biggest of these is the "Excavator" CPU module. 23 percent smaller in area than "Steamroller," (same 28 nm process), Excavator features a new high-density library design, which reduces die-area of the module. Most components are compacted. The floating-point scheduler is 38% smaller, fused multiply-accumulate (FMAC) units compacted by 35%, and instruction-cache controller compacted by another 35%. The "Carrizo" silicon itself uses GPU-optimized high-density metal stack, which helps with the compaction. Each "Excavator" module features two x86-64 CPU cores, which are structured much in the same way as AMD's previous three CPU core generations.

AMD Mobile "Carrizo" Family of APUs Arrive in 2015

AMD (NYSE: AMD) today at its Future of Compute event announced the addition of its first high performance system-on-a-chip (SoC), codenamed "Carrizo", and a mainstream SoC codenamed "Carrizo-L" as part of the company's 2015 AMD Mobile APU family roadmap. In collaboration with hardware and software partners, these new 2015 AMD Mobile APUs are designed as complete solutions for gaming, productivity applications, and ultra high-definition 4K experiences. With support for Microsoft DirectX 12, OpenCL 2.0, AMD's Mantle API, AMD FreeSync and support for Microsoft's upcoming Windows 10 operating system, the 2015 AMD Mobile APU family enables the experiences consumers expect.

"We continue to innovate and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Computing and Graphics business group, AMD. "AMD's commitment to graphics and compute performance, as expressed by our goal to improve APU energy efficiency 25x by 2020, combines with the latest industry standards and fresh innovation to drive the design of the 2015 AMD Mobile APU family. We are excited about the experiences these new APUs will bring and look forward to sharing more details in the first half of next year."

AMD Demos First Network Function Virtualization on 64-Bit AMD and ARM Technology

AMD today demonstrated the first network function virtualization (NFV) solution on AMD's 64-bit ARM-based SoC and announced that it is now sampling to AMD's embedded customers. The NFV demonstration is powered by a 64-bit ARM-based AMD Embedded R-Series SoC, codenamed "Hierofalcon," supported with technology from two key ecosystem partners -- Aricent for the networking software stack and Mentor Graphics for embedded Linux and tools. NFV is an innovative solution that simplifies deployment and management for network and telecommunications service providers with a fully virtualized communications infrastructure that helps maximize performance, while working to reduce costs.

At ARM TechCon, AMD specifically showcased the capabilities of an ARM-based NFV solution, virtualizing the functionality of a packet data network gateway, serving gateway, and a mobility management entity. In addition to virtualizing hardware components, AMD showcased a live traffic migration between the ARM-based AMD Embedded R-Series SoC and the x86-based second generation AMD R-Series APU. AMD's ARM-based NFV solution will be especially valuable for telecommunications network infrastructure providers interested in a flexible software-defined networking (SDN) implementation to manage networking services with configurable hardware to help reduce complexity and cost. NFV is the abstraction of numerous network devices such as routers and gateways, to enable relocation of network functions from dedicated hardware appliances to generic servers. With NFV, much of the intelligence currently built into proprietary, specialized hardware is accomplished with software running on general purpose hardware. The resulting solution is a fully virtualized communications infrastructure -- including virtual servers, storage and networks -- that simplifies deployment and management for network and telecommunications service providers. AMD is paving the way for both new and established service providers to design and deploy either x86 or ARM-based NFV infrastructure which meets their performance, cost and complexity requirements.

Lenovo Completes Initial Closing for Acquisition of IBM's x86 Server Business

Lenovo and IBM today announced that they have completed the initial closing for Lenovo's acquisition of IBM's x86 server business under the terms described in their announcement on Monday, September 29, 2014. Lenovo is acquiring System x, BladeCenter and Flex System blade servers and switches, x86-based Flex integrated systems, NeXtScale and iDataPlex servers and associated software, blade networking and maintenance operations. IBM retains its System z mainframes, Power Systems, Storage Systems, Power-based Flex servers, and PureApplication and PureData appliances.

As part of the agreement, Lenovo and IBM have also established a strategic alliance where Lenovo will serve as an Original Equipment Manufacturer (OEM) to IBM and will resell select products from IBM's industry-leading storage and software portfolio. These include IBM's entry and midrange Storwize storage product family, Linear Tape Open (LTO) products, and elements of IBM's system software portfolio, including Smart Cloud software, General Parallel File System and Platform Computing solutions.

First ARM Cortex-A57-Based Hadoop Demonstration Achieved on AMD Opteron A-Series

AMD (NYSE: AMD) today will make the first public demonstration of Apache Hadoop running on an ARM Cortex-A57-based AMD Opteron A-Series processor. In a technical session at the JavaOne conference to be delivered this afternoon by AMD corporate fellow Leendert van Doorn, the company will show how the expanding AMD Opteron A-Series server software ecosystem now includes Hadoop, the Java-based framework for storage and large-scale data processing. In addition, Henrik Stahl, vice president, Java product management and Internet of Things at Oracle, will join van Doorn on stage to discuss Oracle's support for AMD's 64-bit ARM server architecture.

Hadoop, a distributed processing technology used primarily for big data analysis, is a rapidly expanding market expected to reach upward of $50 billion by 2020. The combination of 64-bit ARM-based servers and Hadoop is designed to accelerate the changing economics of large-scale computing by enabling distributed processing across clusters of ARM-based servers. Running on the recently announced AMD Opteron A1100 development platform, the demonstration will feature Apache Hadoop running on the Oracle JDK. Leendert will also show multiple nodes running the same demonstration using Linux environments based on Fedora technology from the Red Hat-sponsored Fedora community and the community supported OpenSUSE Project.

Lenovo Set to Close Acquisition of IBM's x86 Server Business

Lenovo announced today that conditions for Lenovo's acquisition of IBM's x86 server business have been satisfied and the parties anticipate they will begin closing the transaction effective on October 1, 2014. The acquisition will make Lenovo the third-largest player in the $42.1 billion global x86 server market. Lenovo is acquiring System x, BladeCenter and Flex System blade servers and switches, x86-based Flex integrated systems, NeXtScale and iDataPlex servers and associated software, blade networking and maintenance operations. IBM will retain its System z mainframes, Power Systems, Storage Systems, Power-based Flex servers, PureApplication and PureData appliances.

"With the close of the x86 acquisition, Lenovo will add a world-class business that extends our capabilities in enterprise hardware and services, immediately making us a strong number three in the global server market," said Yang Yuanqing, chairman and CEO of Lenovo. "Now, our priorities are to ensure a smooth integration and deliver a seamless transition for customers. By combining Lenovo's global reach, efficiency and operational excellence with IBM's legendary quality, innovation and service, I am confident that we will have competitive advantages to help us drive profitable growth and build Lenovo into a global enterprise leader."

JPR Reports AMD Jumps 11% in GPU Shipments in Q2, Intel up 4%, NVIDIA Slips

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2014 2Q.

Graphics chips are without doubt one of the most powerful, exciting, and essential components in tech today: not only does every computer require one (or more), but the technology is entering into major new markets like supercomputers, remote workstations, and simulators almost on a daily basis. New technologies and compute programs are taking advantage of the ability of GPU power to scale. On top of that, PC gaming momentum continues to build. It would be no exaggeration to say that GPUs are becoming the 800-pound gorilla in the room.

VIA Readying New 64-bit x86 Processor to Take on Intel Bay Trail and AMD Kabini

Only the third active licencee of Intel's x86 machine architecture, VIA Technology, is readying its first x86 processor in years, codenamed Isaiah II. This chip is based on a brand new 64-bit x86 core design by VIA and the engineering team it acquired from Centaur Technology, another erstwhile x86 licencee, and features modern instruction sets such as AVX 2.0. VIA began sampling a quad-core processor based on Isaiah II, which was put to live test by the company, at its InfoComm 2014 booth. It was compared to Intel's "Bay Trail" Atom and AMD's "Kabini" Athlon chips. It turns out that the Isaiah II is pretty good, if it comes out soon enough.

The Isaiah II based quad-core chip, featuring 2.00 GHz clock speeds, and 2 MB of L2 cache, was put through SANDRA. The BGA chip was running on a VIA-made motherboard, with its own VIA VX11H chipset. It was compared to AMD Athlon 5350 (quad-core "Jaguar" with 2.05 GHz clocks), and Intel Atom Z3770 (quad-core "Silvermont" with 2.40 GHz clocks). The results are tabulated below. At 2.00 GHz, armed with the latest multimedia and cryptography instruction-sets, VIA's chip is faster than Intel's in most tests, despite lower clocks. It trades blows - and wins - against AMD's chip, in most tests. VIA is expected to launch the first chips based on Isaiah II in late-August, 2014. VIA is hedging its bets with efficient compact PCs, kiosks, and digital signage, with its new chip.


Sources: 3DCenter.org, ExtraHardware.cz

AMD Announces Ambidextrous Computing Roadmap

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

AMD's Lisa Su Named UBM Executive of the Year

AMD Senior Vice President and General Manager, Global Business Units, Lisa Su has been named a winner in the EE Times and EDN 2014 UBM Tech ACE Awards in the Executive of the Year category. The awards program honors the people and companies behind the technologies and products that are changing the world of electronics.

The winners were announced at an awards ceremony Tuesday, April 1, at The Fairmont San Jose, during EE Live! "I am flattered and honored to be selected for the UBM 'Executive of the Year' award. When I look at the list of this year's nominees and past winners, it is a who's who of the industry's leaders," said Su. "AMD is in the middle of an important and comprehensive transformation, but it is very much a team effort. On behalf of the entire AMD team, we very much appreciate the recognition for the work."

Intel Rolls Out Celeron "Bay Trail" Based NUC

Intel is ready with an NUC form-factor system based on its Atom "Bay Trail" SoC. Called the NUC DN2820FYKH, the system runs a Celeron N2820 SoC, which integrates a dual-core 64-bit x86 CPU clocked at 2.40 GHz, and a TDP of under 7.5W. Its board features a single DDR3L SO-DIMM slot, a single SATA 3 Gb/s port, a single USB 3.0 SuperSpeed port, two USB 2.0 ports, HDMI display output, and stereo audio. Network connectivity includes gigabit Ethernet, 802.11 b/g/n WLAN, IrDA, and Bluetooth 4.0. The unit measures 116.6 x 112 x 55 mm, and features a VESA wall-mount, letting you latch it onto your monitor. Intel plans to sell it for US $139.

Source: FanlessTech

AMD A10-7700K "Kaveri" De-lidded

Here are the first pictures of an AMD A10-7700K "Kaveri" APU with its integrated heat-spreader (IHS, or 'lid') removed. Put next to its predecessors, "Richland," "Trinity," and "Llano," AMD's new APU silicon is its biggest for the DIY PC market, more so because it's built on the 28 nm silicon fab process, compared to its predecessors being built on 32 nm. The die measures roughly 245 mm², and packs a staggering 2.41 billion transistors.

Under the IHS, AMD is using a thermal paste to transport heat from the die, and not a solder. The chip should be easy to de-lid, if you know what you're doing. Kaveri integrates two "Steamroller" x86-64 CPU modules with two cores each, a total of 4 MB of L2 cache, a massive on-die GPU with 512 stream processors based on the Graphics CoreNext micro-architecture, a dual-channel DDR3 IMC with hUMA and DDR3-2400 native support; and a PCI-Express 3.0 root complex.

Source: Akiba PC Hotline

AMD Inching Towards an Increasingly ARM-based Future with "Seattle"

AMD is inching toward a possible post-x86 future for itself, beginning with its enterprise product stack. In a blog-post, the company outlined a landmark product bearing its enterprise Opteron branding, codenamed "Seattle," which will be designed for scalar data-centers. Based on the 64-bit ARMv8 architecture by ARM, the chip will feature either four or eight cores based on AMD's own implementation of ARMv8, and a high-bandwidth integrated memory controller with support for up to 128 GB of system memory with ECC.

Since ARM-based processors are traditionally part of heavily integrated systems on chips (SoCs), "Seattle" will be an SoC, and among other things, will integrate a 10 Gb/s Ethernet controller, with support for AMD's FreedomFabric technology. Linux kernel 3.7 and above will come with ARMv8 architecture support, and Microsoft is already developing a Windows kernel with ARMv8 support that will be implemented on both its client (Windows RT, Windows Phone) product lines, and a future version of Windows Server. That said, AMD won't give up on x86. As the only active x86 licensee apart from VIA, AMD will continue to make APUs with 64-bit x86 cores for as far as the eye can see (in other words 2015). Future of its client CPU (non-APU) lineup based on the AM3+ socket, however, appears bleak.Source: AMD

Xi3 Taps "Black Friday" as General Availability Date for its PISTON Console

Xi3 Corporation today announced that its PISTON Console will be available for purchase beginning on Black Friday: November 29, 2013. Xi3 customers who pre-ordered a PISTON Console during or before the SXSW 2013 Gaming Expo will receive their PISTON Consoles on or before November 15, 2013.

"The PISTON Console is just Xi3's first step in what we believe will be a transformative technology revolution for the Living Room," said Jason A. Sullivan, Xi3's founder, president and CEO. "Unfortunately, I can't tell you what I know is coming because it's not time to tell you. But I will say this: the bar has been raised. PISTON is smaller, lighter, and will last longer, provide more gaming options and be more powerful than any other gaming console on the planet. The reason I feel confident in saying this is because we started with a clean slate, unlike competing manufacturers. And that Tabula Rasa approach is what sets PISTON apart from other gaming systems today and what will set us apart tomorrow.

AMD Expands Elite Mobility APU Line-Up With New Quad-Core Processor

AMD (NYSE: AMD) today announced a new addition to its 2013 Elite Mobility processor family, expanding the options available for anyone seeking crystal-clear HD entertainment, power efficiency, and accelerated performance in small screen touch notebooks, tablets, and hybrids. The AMD Elite Quad-Core A4-1350 accelerated processor is the second quad-core accelerated processing pnit (APU) in this category, with an estimated average power at or below 3 watts for many common use cases. The new APU is expected to begin shipping to customers in October, 2013. Other AMD Elite Mobility APUs are available in systems today, including the HP Pavilion11 TouchSmart and the Acer Aspire V5.

"Following the tremendous reception from customers to the launch of our 2013 Elite Mobility APUs, we are excited to strengthen our portfolio with the addition of the A4-1350," said Bernd Lienhard, corporate vice president, AMD Client Business Unit. "With quad-core performance, AMD Radeon HD graphics and long battery life, the A4-1350 is an ideal solution for new form factors like hybrid and convertible PCs."

AMD Offers New Multi-Core R-Series CPUs and Discrete AMD Radeon GPU Bundle

AMD today announced new CPU offerings for the AMD Embedded R-Series high-performance computing platform, along with the introduction of a discrete GPU promotional program to provide embedded designers more choices for meeting demanding performance requirements.

The new options include quad-core and dual-core CPUs scaling from 2.2 GHz to 3.2 GHz with Thermal Design Power (TDP) ranging from 17 to 35 watts for applications that require high performance x86 compute such as network attached storage (NAS). To address high-end visual needs for applications like digital gaming and signage that require high-performance x86 compute coupled with industry-leading discrete graphics, AMD is introducing a new discrete GPU promotional program that provides customers with both a CPU and discrete GPU for savings of up to 20 percent.

AMD Winner in Q2, Intel Up, NVIDIA Down, According to Jon Peddie Research

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2013 2Q. While the news was disappointing year-to-year, the news was encouraging quarter-to-quarter. AMD overall unit shipments increased 10.9%, quarter-to-quarter, Intel increased 6.2%, and Nvidia decreased by 8%. The overall PC market declined 2.5% quarter-to-quarter while the graphics market increased 4.6%. Overall this net 7.1% increase reflects an interest on the part of consumers for double-attach-the adding of a discrete GPU to a system with integrated processor graphics, and to a lesser extent dual AIBs in performance desktop machines.

On a year-to-year basis we found that total graphics shipments during Q2'13 dropped 6.8% while PC shipments which declined by at a faster rate of 11.2% overall. GPUs are traditionally a leading indicator of the market, since a GPU goes into every system before it is shipped and most of the PC vendors are guiding down to flat for Q3'13. The popularity of tablets and the persistent economic slowness are the most often mentioned reasons for the decline in the PC market and the CAGR for PC graphics from 2012 to 2016 is -1.4%; we expect the total shipments of graphics chips in 2016 to be 319 million units.

AMD Extends Embedded SoC Leadership by Lowering G-Series Energy Consumption

AMD today announced a new low-power Accelerated Processing Unit (APU) in the award-winning AMD G-Series SOC family with the GX-210JA, further reducing x86 power requirements for embedded designs. The new GX-210JA APU, a full System-on-Chip (SoC) design, uses one third less energy than the previous low-power Embedded G-Series SOC product while providing industry-leading graphics capabilities.

At only 6 watts maximum thermal design power (TDP), and approximately 3 watts expected average power, this new member of the G-Series SOC family will enable additional fanless designs for a variety of applications ranging from industrial controls and automation, digital gaming, communications infrastructure and visual embedded products including thin client, digital signage and medical imaging.

AMD Kaveri APU Successor Named, Carizo Coming In 2015

Even though AMD's next-generation Kaveri APU, based on the Steamroller x86 CPU, GCN (Graphics Core Next) GPU, and HUMA memory architecture might not arrive until late in 1H of 2014, its successor is already named and being worked on by AMD. Carizo, successor to Kaveri, will arrive sometime in 2015, we are betting before the end of 1H 2015, and will feature further improvements in AMD's big APU push.

While nothing is confirmed, Carizo most probably packs AMD's next-in-line Excavator CPU core and perhaps an improved GCN based GPU core. Memory architecture will undoubtedly feature further improvements, in line with AMD's big push for heterogeneous computing and unified memory.

Acer C7 Chromebook Line Expanded for Education, Business Customers

Acer America today announced that it has expanded its line of Acer C7 Chromebook models for its commercial customers, including schools and businesses that need reliable, fast and affordable technology for their students and work forces. The two new models both have a fast 16GB Solid State Drives (SSDs), which enhance boot times and access to apps, as well as a 6-cell battery that delivers up to 6-hour battery life for all-day learning and productivity. Customers have the choice of two new models -- the Acer C710-2826 with 2GB of DDR3 RAM, and the Acer C710-2815 with 4GB DDR3 RAM.

Our new Acer C7 Chromebooks deliver exactly what the K-12 education market and so many businesses require -- solid performance at an affordable price with up to 6-hours of battery life," said Gregg Prendergast, vice president, U.S. Commercial Sales, Acer America. "Acer C7 Chromebooks will help our customers at schools -- students, teachers and administrators -- as well as our business customers, get to work and be productive right away for longer."

Kingston Technology Ships Memory Solutions for Growing Microserver Market

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping server memory solutions for microservers, a new and growing segment of the server market. Kingston has both 1.35v low-voltage ECC SO-DIMMs and unregistered DIMMs in 1600MHz and 1333MHz frequencies to support both x86 or ARM-based processors and system-on -chip (SoC) designs.

Microservers are quickly gaining in popularity as companies seek powerful, yet more energy- and physical-space efficient solutions that serve specific data center needs or cloud applications. Examples include web and cloud hosting, and big data where terabytes or petabytes of information sets are analyzed per second. Kingston's low-voltage, high-performing microserver memory modules are the perfect match to help accomplish these tasks.
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