Club 3D unveils today the heir of our first Radeon HD 7990. This card already crushed the competition in terms of sheer power, performance and awesomeness. But now we present its successor, the even faster Club 3D Radeon HD 7990. As the world's fastest and most advanced graphics card, it descends from generations of AMD Radeon Graphics cards that wore the same crown. And with a heritage like that, you know what you're getting: an unparalleled experience wherein gaming is everything… but not the only thing. All hail the new king.

Compared to the previous Club 3D Radeon HD 7990, which was already a stellar performer and has a track record for being the fastest graphics card in the world for some months in 2012 and 2013, the new Club 3D Radeon HD 7990 offers even better performance while being quieter, cooler and more energy efficient. It's almost impossible to imagine but even that top of range product left room for the improvement shown in this iteration. It's clear that these improvements enable better performance than any other graphics card available in the market today and at the same time operates with less noise and using less power.

As a world-renowned market leader, Gainward proudly introduces new GeForce GTX members - Gainward GeForce GTX 650 Ti BOOST. The Gainward GeForce GTX 650 Ti BOOST is base on NVIDIA's Kepler architecture and 28nm ASIC process that offers you high performance operation but less power consuming.

Gainward GeForce GTX 650 Ti BOOST series, leads with award-wining "Golden Samples" version which is cooled by a dual-fan cooler with factory over-clocked speed and standard-clocked version with single-fan cooler, both come with 2GB GDDR5 memory.

AMD, creator of the performance tablet category, today announced a new innovation for hybrid PCs that delivers uncompromised mobile PC experiences when in tablet mode or when connected to its base keyboard. Hybrid PCs are a new market segment between full notebooks and pure tablets that AMD plans to demonstrate, along with stand-alone performance tablets, at Mobile World Congress 2013 in Barcelona, Spain next week.

AMD Turbo Dock technology automatically adjusts performance of the AMD accelerated processing unit (APU) higher while a hybrid PC is docked and being used for more complex tasks like content creation. Likewise, AMD Turbo Dock is designed to lower power consumption when in tablet mode, helping to save battery life and extend movie or video watching, as well as web browsing time.

ASUS today announced global availability of the GeForce GTX 650-E, a motherboard bus-powered DirectX 11.1 graphics card that's ideal for desktop PCs with low-wattage power supplies The GeForce GTX 650-E combines DirectX 11.1 compatibility and 28nm NVIDIA GPU technology with a mere 60W power consumption, making it a very appealing upgrade option for users looking for a high-performance graphics card at an affordable price.

The ASUS GeForce GTX 650-E offers a quick and accessible upgrade for customers interested in affordable NVIDIA 28nm GPU technology. Powered from a PCI Express slot with a modest 60W average power consumption, the ASUS GeForce GTX 650-E is an ideal choice for users looking to upgrade their PCs without investing in a new power supply, making the process much easier and less costly. Available with 1GB or 2GB GDDR5 video memory, the ASUS GeForce GTX 650-E supports medium-to-high detail in current PC games, along with smooth 1080p full HD video playback.

The Club 3D GeForce GTX 650Ti delivers exceptional performance at 35% faster than the GeForce GTX 560Ti reference board and 40% faster than the standard GeForce GTX 650 at only 29% higher price, offering excellent value. Featuring a non-reference design, the 80mm fan keeps the GPU temperature low at 31⁰C under idle and operate stable at 53⁰C under load (3DMARK 11 under Extreme preset settings). The aerofoil turboblades and dust repelling bearings designed to operate under extreme load conditions, provide a consistent 31.3dBA under load or idle.

With the short 146mm PCB size, this graphic card is designed for smaller system chassis, making it ideal for users who do not want to replace their computer case and convenient for HTPC users and boosting up the performance by up to 35% compared to previous generation GeForce graphics card*. The GeForce GTX 650Ti embodies the maturity of the 28nm NVIDIA Kepler architecture and offers support for the the PCI Express 3.0 bus interface allowing for the highest data transfer speeds.

Eurocom, is launching two new NVIDIA GeForce based graphics cards in its High Performance Notebooks, the NVIDIA GeForce GTX 675MX and 670MX. The NVIDIA GeForce GTX 675MX and 670MX are kepler based cards and have 4 GB and 3GB GDDR5 memory respectively. Eurocom is launching the NVIDIA GeForce GTX 675MX and 670MX in the EUROCOM Scorpius, Panther Series, Neptune 2.0 and Racer 2.0 high performance, fully upgradeable and customizable notebooks.

NVIDIA GeFore GTX 675MX and 670MX graphics are manufactured on the newest 28nm kepler based GPU architecture from NVIDIA. This technology allows for improved performance, power efficiency and manageability. Featuring a long list of technologies such as PhysX, CUDA, DirectX 11 and OpenCL, the NVIDIA GeForce GTX 675MX and 670MX will offer next generation graphics performance for Eurocom notebooks.

Samsung Electronics, Co., Ltd., a world leader in advanced semiconductor technology solutions, announced foundry production of STMicroelectronics’ leading products using 32/28nm High-K Metal Gate (HKMG) process technology. Samsung Electronics’ foundry business has been selected by STMicroelectronics to provide it with products at the 32/28nm process node. The relationship has already resulted in taping-out of a dozen ST advanced system-on-chip (SoC) devices for mobile, consumer and network applications.

“We have successfully started production of STMicroelectronics’ new-generation 32/28nm SoC products,” said Kwang-Hyun Kim, executive vice president of Foundry business, Device Solutions, Samsung Electronics. “A foundry relationship with ST demonstrates our commitment to advanced process technology and our 32/28nm HKMG process-technology leadership. We have aggressively ramped 32/28nm capacity and will continue to deliver the most advanced process solutions to our customers.”

GLOBALFOUNDRIES and ARM today announced a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM processor designs on GLOBALFOUNDRIES’ 20-nanometer (nm) and FinFET process technologies. The new agreement also extends the long-standing collaboration to include graphics processors, which are becoming an increasingly critical component in mobile devices. As part of the agreement, ARM will develop a full platform of ARM Artisan Physical IP, including standard cell libraries, memory compilers and POP IP solutions. The results will help enable a new level of system performance and power-efficiency for a range of mobile applications, from smartphones to tablets to ultra-thin notebooks.

The companies have been collaborating for several years to jointly optimize ARM Cortex-A series processors, including multiple demonstrations of performance and power-efficiency benefits on 28nm as well as a 20nm test-chip implementation currently running through GLOBALFOUNDRIES fab in Malta, N.Y. This agreement extends the prior efforts by driving production IP platforms that will enable customer designs on 20nm and promote rapid migration to three-dimensional FinFET transistor technology. This joint development will enable a faster time to delivering SoC solutions for customers using next-generation ARM CPUs and GPUs in mobile devices.

AMD today announced that it has agreed to sell $500 million aggregate principal amount of its 7.50% Senior Notes due 2022 in a private offering. AMD intends to close the transaction on or around August 15, 2012. AMD estimates that the net proceeds from the issuance and sale of the senior notes will be approximately $491 million after deducting the initial purchasers’ discounts and estimated offering expenses.

AMD intends to use the net proceeds for general corporate purposes and working capital, which may include the following: (i) the repayment or repurchase of some or all of its outstanding 5.75% Convertible Senior Notes due 2012, (ii) repayment or repurchase of some or all of its outstanding 6.00% Convertible Senior Notes due 2015, (iii) cash payments to GLOBALFOUNDRIES related to the 28nm product limited waiver of exclusivity, or (iv) potential strategic transactions.

Advanced Micro Devices, Inc. (NYSE: AMD) today announced that it intends to commence a private offering, subject to market and other conditions, of $300 million aggregate principal amount of senior notes due 2022. AMD intends to use the net proceeds for general corporate purposes and working capital, which may include the following: (i) the repayment or repurchase of some or all of its outstanding 5.75% Convertible Senior Notes due August 2012, (ii) repayment or repurchase of some or all of its outstanding 6.00% Convertible Senior Notes due 2015, (iii) cash payments to GLOBALFOUNDRIES related to the 28nm product limited waiver of exclusivity, or (iv) potential strategic transactions.

The new senior notes have not been registered under the Securities Act of 1933, as amended, or applicable state securities laws, and will be offered only to qualified institutional buyers in reliance on Rule 144A and in offshore transactions pursuant to Regulation S under the Securities Act of 1933, as amended. Unless so registered, the new senior notes may not be offered or sold in the United States except pursuant to an exemption from the registration requirements of the Securities Act and applicable state securities laws.

TSMC today announced consolidated revenue of NT$128.06 billion, net income of NT$41.81 billion, and diluted earnings per share of NT$1.61 (US$0.27 per ADR unit) for the second quarter ended June 30, 2012.

Year-over-year, second quarter revenue increased 15.9% while both net income and diluted EPS increased 16.3%. Second quarter results included an impairment charge of NT$2.68 billion, equivalent to NT$0.09 EPS, of our holding of 5.6% stake of SMIC common stocks. Compared to first quarter of 2012, second quarter of 2012 results represent a 21.4% increase in revenue, and a 24.9% increase in both net income and diluted EPS. All figures were prepared in accordance with R.O.C. GAAP on a consolidated basis.

Club 3D takes a giant leap and destroys the competition with the release of the most quiet, cool and brutally fast Club 3D Radeon HD 7970 royalAce graphic card, the latest addition to the PokerSeries family.

Get the best of the best with Club 3D's PokerSeries, the Radeon HD 7970 royalAce offers great performance by breaking the GHz barrier on the GPU, clocking at 1050MHz, making it amazingly fast, up to 7% faster in games when compared to the reference HD 7970 GHz Edition. The Radeon HD 7970 royalAce is a quiet card, achieving 31.5 dB on idle, 38 dB at load, making it the ideal choice for gaming and multimedia. By utilizing a custom cooler design with a dual fan and four high performance heatpipes it ensures the card to remain cool at 71 °C on average when gaming. A Dual BIOS toggle switch offers overclocking potential for the most demanding gamer and overclocking enthusiast.

GLOBALFOUNDRIES today announced it is moving forward with the final construction for the extension of Module 1 at the Fab 8 campus in New York. The project will add 90,000 square feet of manufacturing capacity, bringing the total capacity for Fab 8 Module 1 to 300,000 square feet. Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.

“During the construction of Fab 8, we extended the shell of the Module 1 building with the expectation that our business would continue to grow. Today we see increasingly strong demand from our customers, especially at the 28nm node, and we are excited to be moving forward with this next phase in the development of the Fab 8 campus,” said Eric Choh, vice president and general manager, Fab 8, GLOBALFOUNDRIES. “By continuing to expand our investment in the project, GLOBALFOUNDRIES is delivering more options to our global customers, while helping to redefine upstate New York as a premier hub of the global semiconductor industry, creating thousands of new advanced manufacturing jobs, and contributing billions of dollars to the regional economy.”

AMD (NYSE:AMD) today announced revenue for the second quarter of 2012 of $1.41 billion, net income of $37 million, or $0.05 per share, and operating income of $77 million. The company reported non-GAAP net income of $46 million, or $0.06 per share, and non-GAAP operating income of $86 million.

“Overall weakness in the global economy, softer consumer spending and lower channel demand for our desktop processors in China and Europe made the closing weeks of the quarter challenging,” said Rory Read, AMD president and CEO. “We are taking definitive steps to improve our performance and correct the issues within our control as we expect headwinds will continue in the third quarter as the industry sets a new baseline. We remain optimistic about our core businesses as well as future opportunities with our competitively differentiated next-generation Accelerated Processor Units (APUs). Our recently launched Trinity APU continues to gain traction with customers. We are committed to driving profitable growth.”

Eurocom Corporation (eurocom.com), a developer of long lifespan, high performance, fully upgradable Notebooks and Mobile Workstations has been testing and benchmarking and is now launching the NVIDIA Quadro K5000M GPU with 1344 CUDA cores and 4GB GDDR5 graphics memory in its Panther 3.0 Mobile Workstation.

NVIDIA Quadro K5000M graphics are manufactured on the newest 28nm kepler based GPU architecture from NVIDIA. Featuring a long list of technologies such as PhysX, CUDA, DirectX 11 and OpenCL, the NVIDIA Quadro K5000M will offer next generation graphics performance for the EUROCOM Panther 3.0 Mobile Workstation.

A leading brand of graphics card maker - VTX3D, today adds three new models, HD7870/7850/7770 into X-Edition series, which make this series more completed for OC enthusiast to choose. Being self-designed of VTX3D, these three models are designed to provide gamers the most extreme performance at its same class, also bring unbeatable HD gaming experience with DirectX 11 support.

Equipped with 2GB of GDDR5 memory, the HD7870 X-Edition clocks at 1100MHz for core and 1225MHz of memory speed. There are two types of memory size, 1GB and 2GB of GDDR5 for HD7850 X-Edition, and both with 860MHz/1200MHz for core and memory respectively. HD7770 X-Edition is fitted with 1GB of DDR5 memory clocked at 1150MHz of core and 1250MHz of memory speed.

AMD today announced immediate availability of the AMD FirePro W600 professional graphics card, the company’s first professional graphics card to leverage AMD’s Graphics Core Next architecture and 28nm production technology, for use in high-resolution, content-rich, multi-screen display wall environments. With this launch, AMD is addressing a growing need for large, dynamic screens that are easily updated with new content.

“Whether we are checking flight times at the airport or watching the latest ads on massive screens in city squares, digital signage has quickly become an important and ubiquitous part of our lives,” said Matt Skynner, corporate vice president and general manager of AMD Graphics. “To enable these displays, the digital signage industry demands technology that can be regularly refreshed with new, feature-rich content. With the launch of the AMD FirePro W600 professional graphics card, AMD is helping advance the digital display wall industry by providing suppliers and developers with impressive display density, performance and exceptional value.”

PNY Technologies, Inc. ("PNY") today announced the release of the Verto GeForce GT 640 1024MB DDR3 graphics card. This new entry-level NVIDIA 28nm Kepler card features dedicated graphics performance from this powerful next-generation GeForce architecture.

The GT 640 delivers premium multimedia performance and reliable entry-level gaming, for a faster, more immersive experience. Harnessing PhysX technology, bring your HD videos, photos, web, and games to life; edit your photos and videos; or play the latest DirectX 11 games with GPU-accelerated tessellation. Accelerate your desktop's performance with cutting-edge features, such as CUDA technology to handle the most demanding system tasks -- such as photo editing -- and delivering incredible performance improvements over traditional CPUs. Adding to the incredible performance and power efficiency of the GT 640 is the new -- built from the ground up -- SMX unit, available only on Kepler. The revolutionary Kepler GPU has taken graphics to the next level and allows the GT 640 to simultaneously run up to three monitors with NVIDIA Surround technology -- expanding your viewing perspective and increasing productivity.

At next week’s Design Automation Conference (DAC) in San Francisco, Calif., GLOBALFOUNDRIES plans to demonstrate an enhanced silicon-validated design flow for its 28nm Super Low Power (SLP) technology with Gate First High-k Metal Gate (HKMG). The flow provides proven and complete front-to-back support for advanced analog/mixed-signal (AMS) design using the industry’s latest design automation technology. In addition, the company will reveal jointly developed design flows with its EDA partners in certifying both analog and digital “double patterning aware” flows for its 20nm process, with silicon validation expected in early 2013 at that technology node.

As a result of GLOBALFOUNDRIES’ commitment to silicon validation of flows before releasing them, customers have the confidence to produce signoff-ready 28nm digital and analog designs using the industry's most advanced set of design tools, tool scripts, and methodologies from the leading EDA suppliers. The company’s tight collaboration with the design tool and IP ecosystem also accelerates its ability to develop working flows for advanced nodes such as 20nm, providing their advantages in gate density, performance, and lower power to customers ahead of other foundries.

Mentor Graphics Corp. today announced that GLOBALFOUNDRIES is helping its customers improve reliability checking by adding Calibre PERC to select 28nm bulk CMOS design enablement flows. Calibre PERC will give designers access to the new reliability verification rules developed by the IBM Semiconductor Development Alliance (ISDA), augmented with GLOBALFOUNDRIES specific checks to help prevent external latch-up. Using Calibre PERC’s unique architecture, complex reliability rules that require the integration of logical (net list) and layout (GDS) information can be fully automated, eliminating manual spreadsheet-based efforts and reducing the chances of design errors.

“In the past, verification of latch-up immunity depended on manual layout checks and rough approximations of device and interconnect resistance using traditional mechanisms,” said Bill Liu, vice president of design enablement at GLOBALFOUNDRIES. “Now our customers can perform accurate measurements and analysis automatically using Calibre PERC’s data integration capability. For example, some of our customers are currently using PERC to accurately determine the resistance of the paths in complex output driver arrays as a function of device spacing. This allows them to easily and accurately detect points in the circuit where latch-up could be an issue and to make appropriate improvements.”

Eurocom Corporation, a developer of long lifespan, fully upgradable Notebooks and Mobile Workstations has been testing the AMD Radeon HD 7970M in its new line of 3rd Generation Intel Core i7 (Ivy Bridge) powered notebooks. Eurocom technicians achieved a score of P22111 in 3DMark Vantage in the EUROCOM Racer and a score of P5848 in 3DMark 11.

The AMD Radeon HD 7970M is currently the highest performing mobile GPU by AMD, giving Eurocom customers a superior choice of video processor options to configure into their new Eurocom system or upgrade into their existing system. The addition of the AMD Radeon 7970M GPU offers customers a greater selection of video processor options to fit any preference or performance level

Today leading international mainboard and graphics card maker MSI officially announces the new GeForce GTX 670 graphics card featuring the latest 28nm GeForce GTX 670 GPU and 2GB GDDR5 memory; supports PCI Express 3.0 standard to provide better performance and power efficiency than previous generation. The GeForce GTX 670 graphics card features NVIDIA’s GPU Boost technology which allows the core clock to be automatically adjusted on the fly for optimal in-game performance.

When used with the MSI Afterburner overclocking utility, the power limit and clock offset can be adjusted as well for better overclocking capability; GPU overvoltage function to boost overclocking potential up to 22%! A single card is able to also support NVIDIA 3DVision Surround technology for up to four monitors to give gamers the best in-game experience.

Leading international graphics card and mainboard maker MSI today announced MSI R7870 Hawk, equipped with AMD's 28nm Radeon HD 7870 GPU. MSI introduce the flagship design concept of Lightning series into R7870 Hawk, adopting UnlockedDigitalPower that incorporates an Unlocked BIOS, DigitalPWM Controller, and Enhanced Power Design to boost overclocking potential and make overclocking easier than ever. With the industry first "GPU Reactor" power panel, it reduces power supply noise as well as increases overclocking stability. As for thermal solution, MSI R7870 Hawk utilizes the latest Twin Frozr IV Thermal Design with Dust Removal Technology.

The dual 8cm fan setup with PropellerBlade Technology generate massive airflow for fast heat dissipation while remaining whisper silent. The two form-in-one heatsinks improve cooling for memory and the power module as well ensure structural integrity. The R7870 Hawk uses Military Class III components which have passed rigorous testing to meet MILSTD810G standards, guaranteeing the card's stability and reliability under actual use conditions. Moreover, the "3X3 OC Kits" are designed to simplify overclocking, which makes it easier for users to fine-tune their graphics cards. Competing with flagship design of Lightning series, R7870 Hawk absolutely stands out on top among the industry's HD 7870 based graphics cards.

Despite the fact that NVIDIA is frantically seeking out other semiconductor foundries for high-volume manufacturing its 28 nm chip designs, and despite some looming irritants, NVIDIA appears to value its relationship with TSMC highly. NVIDIA's senior vice president for Advanced Technology Group Joe Greco, in a recent company blog post, credited close collaboration with TSMC for the stellar energy-efficiency (performance/Watt) figures NVIDIA's Kepler architecture has been able to achieve.

"The advancement that TSMC offered was a new optimized process technology. Kepler is manufactured using TSMC’s 28nm high performance (HP) process, the foundry’s most advanced 28nm process which uses their first-generation high-K metal gate (HKMG) technology and second generation SiGe (Silicon Germanium) straining," read the blog post. "Using TSMC’s 28nm HP process enabled us to reduce active power by about 15 percent and leakage by about 50 percent compared to 40nm, resulting in an overall improvement in power efficiency of about 35 percent (see charts)."

GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company’s leading-edge 20nm technology platform. The TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding requirements of tomorrow’s electronic devices.

Essentially vertical holes etched in silicon and filled with copper, TSVs enable communication between vertically stacked integrated circuits. For example, the technology could allow circuit designers to place stacks of memory chips on top of an application processor, which can dramatically increase memory bandwidth and reduce power consumption—a key challenge for designers of the next generation of mobile devices such as smartphones and tablets.