News for "40nm"

Hynix Semiconductor, Inc. has announced the Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.

Hynix's newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.

The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. The productivity of Hynix's 40nm class 2Gb DDR3 is increased by more than 60% over 50nm class process technology.

Club 3D, European market leader for graphics cards, today announced the release of its new 40nm process technology based HD5970 graphics card. Equipped with two ATI Hemlock graphics processing units. The fastest graphics card on the planet has been developed.

Engineered for speed, the Club 3D HD5970 delivers an unrivaled HD gaming experience so you can play the latest, most demanding HD titles like never before. Featuring cutting-edge graphic, display and memory technology, this next-generation powerhouse delivers unprecedented performance straight out of the box. Unlocked, this graphics card has massive headroom, so you can take control and push your hardware to its full potential!

Club 3D, European market leader for graphics cards, today introduces with the Club 3D GT 240 graphics card the next GPU manufactured in 40nm process technology. Your perfect choice for professional graphics and also suitable as dedicated PhysX graphics card to run your games 50% faster. Turn your photos and home videos into materspieces at the clock of a button, view flawless Adobe Flash 10.1 video in full screen HD. Energize your multimedia with Club 3D GT 240 graphics and equip your PC for the digital world. Enjoy 3D Vision and 3D Photos to play your games and view your photos in 3D.

World renowned graphics card and mainboard brand and manufacturer, MSI, captured the hearts of powerful performance enthusiasts after unveiling its all-new R5800, R5700 series of graphics cards. Today, MSI unveils its top model, the R5970-P2D2G graphics card, which not only equips two advanced 40nm GPUs, but also utilizes 3200 stream processors (SPs)*, and 2 GB 512 bit** GDDR5 graphics memory, making it the best performing card on the planet today!

Additionally, MSI's R5970-P2D2G graphics card features ATI Eyefinity triple-display output technology, allowing gamers to get fully immersed in the latest DirectX 11 environments. The card also offers PowerPlay power-saving functionality that shows remarkable power-saving when the machine is in stand-by. Equally noteworthy is MSI's own "Afterburner" overclocking software that allows the user to adjust both the voltage and overclocking settings for better performance. With CrossFire X enabled, the dual GPUs offer outstanding, stable performance that redefines fast. Without a doubt, this card will be the first choice of performance enthusiasts.

AMD today announced the flagship installment in the award-winning line of graphics cards, the ATI Radeon HD 5970, the fastest card ever created. The new ultra high-end model joins a growing list of the world's first and only graphics cards to fully support Microsoft DirectX 11 technology and ATI Eyefinity multi-display technology.

Designed to support the most demanding PC games at ultra-high resolutions and image quality settings, the ATI Radeon HD 5970 has unlocked overclocking potential, granting access to every bit of power the card has to offer through ATI Overdrive technology. Now shipping from retailers and available in the channel, the ATI Radeon HD 5970 also launches today in new Alienware Area-51, Area-51 ALX and Aurora desktop PCs.

World renowned graphics card and mainboard manufacturer, MSI, today formally releases the world's first graphics card to support over voltage function - the N240GT series. Including the N240GT-MD512-OC/D5 and N240GT-MD1G, this series allows the user to adjust both the voltage and the overclocking configurations via the Afterburner overclocking software to increase GPU clock up to 30%. Additionally, this series utilizes an advanced 40nm GPU, supports the DirectX 10.1 gaming standard, and offers an native HDMI output for awesome 3D support and high-definition entertainment. The N240GT-MD512-OC/D5 uses extremely fast 512 MB GDDR5 graphic memory, and implements military class components to offer an incredible cost-performance value to customers.

MSI's all new N240GT series of graphics cards supports over voltage function of GPU and overclocking configuration adjusting functionality. Accessible through MSI's Afterburner overclocking software, the user can quickly adjust the GPU's voltage to improve overclocking potential, and the GPU clock can be up to 30%. Without a doubt, this new graphics card series offers users an impressive overclocking experience.

POINT OF VIEW, premier NVIDIA partner for GeForce Graphics cards, is launching today the first GDDR5 GeForce graphics card, the GeForce GT240. Built from the ground up, the latest GeForce 200 series graphics card is a big step forward. Built on 40nm the GPU will consume less energy and have less heat production. This allows better clock speeds, a higher overclocking potential and lower temperatures. The smaller die-size together with the support for DirectX 10.1 and Shader model 4.1 really adds a future proof coating to the GT240.

Another major improvement is the support of GDDR5 which literally multiplies the possible memory clock by two! The new PCB design also has integrated HDMI audio so no additional SPDIF cable is required for rerouting the sound to the HDMI cable.

TUL Corporation, a leading manufacturer of AMD graphics cards, today introduces a passive cooling solution into the HD5700 family: SCS3 HD5750. The PowerColor SCS3 HD5750 features an effective passive cooling solution dissipating excessive heat with minimal noise. The copper base, which fully covers, the GPU through 4 copper heat pipes and 32 piece heat sink offers outstanding cooling performance in a quite setting.

While running passively, the PowerColor SCS3 HD5750 maintains the original specifications with core engine of 700MHz, 1150 MHz memory speed. This model takes advantage of the latest 40nm technology, providing better performance while using less power and offering an excellent balance between a superior gaming experience and power efficiency.

HIS unleashed the revolutionary new HIS Radeon HD 5770 & HD 5750 1GB GDDR5. Loaded with innovative DirectX 11 and Eyefinity support, these GPUs have the power and premium features you need for fully immersive gameplay.

HIS Radeon HD 5770 1GB GDDR5 accelerates PC gaming with 1 teraFLOPS computing power! Running at 850MHz core clock speed and 4.8 Gbps memory clock speed, the HIS Radeon HD 5770 ensure extreme game play at high resolutions and maximum settings. The HIS Radeon HD 5750 supplies with the same 1GB GDDR5 with memory running at 4.6Gbps and core clock at 700MHz. You can now experience the speed, responsiveness and performance of ultra-high bandwidth GDDR5 memory.

Now, more people than ever can experience real innovation in DirectX 11 gaming with the Club 3D HD5700 graphics card series. Loaded with advanced technology, this graphics card has the power and premium features you need for fully immersive gameplay. Expand your visual real estate across up to three displays and get lost in the action with revolutionary ATI Eyefinity technology. Using ATI Stream technology, accelerate even the most demanding applications and do more then ever with our PC. Enable realistic visual effects and an explosive HD gaming performance to dominate the competition.

Enjoy an incredibly immersive HD gaming/computing experience with ATI Eyefinity Technology. This revolutionary multi-display technology allows you to expand your visual real estate across up to three displays with innovative "wrap around" capabilities to maximize your field of view with incredible sharpness and clarity. Perform tasks on a PC faster with ATI Stream technology, speed up demanding everyday applications and get more done in less time. The first fully Microsoft DirectX 11-compatible GPUs, Club 3D HD5800 Series is designed to deliver ultimate HD gaming performance for the latest games and DirectX 11 applications so you can dominate the competition.

After launching the powerful R5800 series graphics card which successfully get global overclocking enthusiasts' attention, MSI, leading graphics cards and mainboard brand-manufacturer, today introduces the latest R5700 series graphics card, MSI R5770-PM2D1G and R5750-PM2D1G. With the advanced 40nm GPU, DirectX 11 support, high speed GDDR5 video memory, and ATi Eyefinity technology, the MSI R5700 series graphics card can fully provide stunning gaming experience by DirectX 11 to gamers. In addition to better performance/power ratio compared to popular HD 4870 of last generation product, MSI R5700 is the premium high performance graphics card that you must have! Now get it with a free DirectX 11 support racing game "Dirt2" and MSI exclusive VGA overclocking utility "Afterburner"!

The brand new MSI R5700 series is the same as its R5800 series, using the advanced 40nm GPU to implement decisively more transistors within the same amount of space and thereby reaching a new level of performance. In addition the modern 40nm process reduces power consumption and brings about a more efficient overall electrical utilization. Compared to popular HD 4870 of last generation product, the power consumption of MSI R5770-PM2D1G is significantly improved. The performance per watt result is 20% better than last generation.

The new ZOTAC GeForce GT 220 and 210-based graphics cards take 3D performance and home theater integration to a whole new level with new technologies for superior performance, visuals and audio. 3D performance is enhanced with support for DirectX 10.1 and OpenGL 3.1 technologies for realistic visuals and unmatched performance.

ZOTAC GeForce GT 220 graphics cards feature 48 lightning-fast processing cores while the more affordable ZOTAC GeForce 210 features 16 processing cores. Despite the high-performance of the new ZOTAC GeForce GT 220 and 210 series graphics cards, the new graphics cards are energy efficient and consume little energy thanks to a new manufacturing process.

MSI, leading global graphics card and motherboard manufacturer, just announced the launch of the N220GT/N210 graphics cards series to meet users' demands for top-notch quality at an ideal price-performance level. These all-new graphics cards series implement advanced 40nm GPUs with full support for the latest DirectX 10.1 multimedia gaming standard, sport MSI Military Class components for greatest stability and even support native HDMI output offering the most crisp audio-visual experience available on the market today. This is the ideal solution for price-performance conscience users with high demands.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had finished development of the smallest high-speed low-power 40nm 2-gigabit DDR3 SDRAM in the DRAM industry.

The new 2-gigabit DDR3 SDRAM uses a smaller chip size to achieve a 44% higher chip yield per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6Gbps, the highest speed standard for current DDR3. Compared with 50nm products, it uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, thus reducing power consumption by as much as 45%.

GLOBALFOUNDRIES today announced a strategic customer relationship with STMicroelectronics. One of the world's leading suppliers of semiconductor solutions, ST will partner with GLOBALFOUNDRIES to produce products based on 40nm Low Power (LP) bulk silicon technology. The 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require excellent performance and long battery life. First tape out and production of ST products by GLOBALFOUNDRIES is planned to start in 2010.

"When we launched GLOBALFOUNDRIES, our long-term vision was to bring a new business model to the foundry market and to become the partner of choice for the largest and most innovative semiconductor design and manufacturing companies," said Doug Grose, Chief Executive Officer, GLOBALFOUNDRIES. "With the addition of an industry-leader in low-power technology like STMicroelectronics we now begin to deliver on this vision. We look forward to harnessing our full capabilities for ST to provide best-in-class service in bringing their 40nm design innovation to life in high volumes and at mature yields."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first two gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.

"We see market adoption to DDR3 picking up steam and are accommodating that with early entry of 2Gb DDR3 using the most efficient DRAM manufacturing technology available today," said Jim Elliott, Vice President, Memory Marketing, Samsung Semiconductor, Inc. "This will set the pace for a new standard in premium, eco-friendly DRAM solutions offering the most advanced, low power RDIMM for servers anywhere."

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNAND, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory improves the performance of high-end phones and other mobile consumer electronics when processing and storing large amounts of multimedia content such as videos, video games and TV broadcasts.

The 32 GB moviNAND is the first embedded memory card to use 32 Gigabit (Gb) NAND devices produced with 30nm-class process technology. The new Samsung card doubles the density of the previous generation of moviNAND that is now being produced with 16 Gb 40nm-class NAND chips.

UMC, a leading global semiconductor foundry, today announced that it has delivered customer ICs produced on its High Performance (HP) 40 nm process technology. The products were manufactured with excellent cycle time and yields for the large die-size programmable logic chips, which leveraged the foundry's triple-gate oxide, 12 metal layers and copper/low-k technology to enable 65% reduced power consumption and more than twice the density improvement over previous 65nm generation products. The advanced 40 nm ICs have already begun shipping in volume to the customer's end users for product sampling.

S.C. Chien, vice president of advanced technology development at UMC, said, "UMC continues to remain at the forefront of semiconductor foundry technology through the timely delivery of leading-edge processes that meet the demanding requirements of today's advanced applications. The delivery of these 40 nm customer products underscores this technology commitment, we look forward to bringing the performance advantages of our proven 40 nm technology to even more UMC customers."

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun using 40-nanometer (nm) process technology to produce an eight-gigabit (Gb) Flex-OneNAND™ fusion memory chip. Samsung's Flex-OneNAND is a proprietary memory device that provides both SLC and MLC NAND in a single cost-efficient chip. It has been designed for applications that require high speed and high reliability in processing both code and data content. Applications using Flex-OneNAND are expected to expand from high-performance smart phones today, to full HDTVs, IPTVs and other high-end applications by year end.

AMD today announced the world’s first graphics processors to harness 40nm process technology: the ATI Mobility Radeon HD 4860 and ATI Mobility Radeon HD 4830. These feature-rich graphics processors redefine mobile PC entertainment with advanced capabilities including support for the latest Microsoft DirectX 10.1 games, a home theater-quality HD multimedia experience, and energy-efficient features for long battery life at work, at home or at play.

Hynix forms one of the top-tier DRAM manufacturers. On Sunday, the company made it official that its new 1 Gb (128 MB) DDR3 memory chip built on the new 40 nm silicon fabrication process, will enter mass production by the third quarter, and be available to manufacturers soon after. The chip (model: H5TQ1G83CFR) operates with a top-speed of 2,133 Mbps, at a wide range of voltage.

Using the three-dimensional transistor technology, the company has stepped-up productivity by more than 50% over its current DRAM chips built on the 50 nm process. The new technology is said to minimize electric leakages and reduces overall power consumption of the DRAM chip. The new 1Gb memory chip meets Intel's DDR3 DRAM specification compliance and the memory module will be examined for certification by Intel.


Source: DigiTimes

AMD is on course of releasing the industry's first GPU built on the 40nm silicon process: the RV740. Its specifications make it a cheap yet powerful GPU for the segment it is about to cater to. With the earliest pointers hinting at 640 stream processors and a 128-bit wide GDDR5 memory interface. The GPU also marks the industry's first mainstream implementation of the GDDR5 standard.

Fresh details emerging out of the inspection of the driver information files of ATI Catalyst version 9.1, as German website ATI Forum finds out, hints at the possibility of the RV740 being implemented in two SKUs: the Radeon HD 4730 and Radeon HD 4750. While in the driver file, the device string lists with "RV630", it can be seen throughout the file that several strings are assigned to the same RV630, and is merely a means to identifying a whole class or generation of graphics processors to the driver. Additionally, the string bears the device ID of the RV670, again, that's not relevant. The strings are what matter. The RV740 is not very far away from large scale production. It should become a reality by the upcoming CeBIT event, in March. From the view of being a mere postulation, RV740 being the GPU that goes into making the new SKUs, does end up sounding plausible. When released, these cards are intended to further strengthen AMD's market position in the sub-US $150 market.


Source: ATi Forum

As the industry moves closer to implementation of the 40nm silicon technology on graphics processors, some of the most complex electronic devices, both AMD and NVIDIA have their offerings in the works. While AMD already has prototypes taped out, NVIDIA seems to be taking its time, perhaps to perfect its products.

The green camp, as Hardware-Infos finds out, is likely to start its 40nm lineup with the GT218 graphics processor. With NVIDIA's internal coding scheme, the GT218 is an entry-level GPU. In its generation hierarchy, would be the GT215, GT216 (mainstream) and GT212 (high-end). The GT218 will succeed the G98 GPU that went into making the GeForce 9300 series. It will have 32 stream processors, 8 texture memory units, and 4 raster operations pipelines. It will continue to have a 64-bit wide memory bus. Despite the increase in transistor counts, the GPU ends up with a lower TDP, expected to be around 22W, as against the roughly 30W for the G98. The GT218 is slated for April, later this year.


Source: Hardware-Infos

Having taped out late last year, samples based on the new RV790 graphics processor have been doing rounds in the industry. A few more details have surfaced about it. Earlier noted to have identical clock speeds to that of the RV770XT (Radeon HD 4870), the RV790 samples are now known to have higher memory clock speeds. While the Radeon HD 4870 has its memory frequency at 900 MHz GDDR5 (effective 3.60 GHz), the samples carry memory clocked at 975 MHz (effective 3.90 GHz). Interestingly the memory chips on the sample, labeled IDGV1G-05A1F1C-40X, made by Qimonda, are specified to run at 1.00 GHz, reaching the 4 GHz effective memory speed mark. The samples feature 1 GB of memory. The RV790 is AMD's new current-generation graphics processor built on the newer 40nm silicon fabrication process. The new process is expected to reduce the GPU's power consumption and thermal footprint. The RV790 is conceived to be an immediate successor to the RV770 GPU.

Source: Hardware-Infos

Every once in a while, comes a GPU by NVIDIA that marks the evolution of GPU architecture for NVIDIA. A good example of this would be the G80, which was a distinct evolution of the GPU architecture for the company. Sources tell Hardware-Infos that the GT300 is on course of being one such GPU that comes with distinct architectural changes. To begin with, GT300 will start the company’s DirectX 11 conquest the way its ancestor, the G80 did for DirectX 10, which turned out to be largely a successful one.

The GT300’s architecture will be based on a new form of number-crunching machinery. While today’s NVIDIA GPUs feature a SIMD (single instruction multiple data) computation mechanism, the GT300 will introduce the GPU to MIMD (multiple instructions multiple data) mechanism. This is expected to boost the computational efficiency of the GPU many-fold. The ALU cluster organization will be dynamic, pooled, and driven by a crossbar switch. Once again, NVIDIA gets to drop clock-speeds and power consumptions, while achieving greater levels of performance than current-generation GPUs. With GT300, NVIDIA will introduce the next major update to CUDA. With the new GPUs being built on the 40nm silicon fabrication process, transistor counts are expected to spiral-up. NVIDIA’s GT300 is expected to go to office in Q4 2009, with its launch schedule more or less dependent on that of Microsoft’s Windows 7 operating system that brings in DirectX 11 support.

Source: Hardware-Infos

NVIDIA's G200b, its current flagship GPU will be suceeded later this year with the GT212, and as Hardware Infos discovers, NVIDIA seems to have given some interesting specifications to the GT212. To begin with, the GPU holds more than 1.8 billion transistors. It is built on TSMC's 40nm manufacturing node. The shader domain gets a boost with 384 shader units (a 60% increase over G200(b)). The GPU holds 96 texture memory units and a 256-bit wide GDDR5 memory bus with a clock speed of 1250 MHz (5000 MT/s).

The transition to GDDR5 seemed inevitable, with there being a genuine incentive of cutting down the number of memory chips (due to the efficient memory bus), with NVIDIA having completely avoided GDDR4. With the die-size being expected to be around 300 sq. mm, these GPUs will be cheaper to manufacture. The GT212 is slated for Q2 2009.


Source: Hardware-Infos

At the AMD Analyst Day event, AMD indicated in its presentations that The Foundry Company, a manufacturing company formed from the assets of AMD with the intestments of ATIC under the AssetSmart program, would in the future become an independent foundry company accepting foundry partnerships from companies apart from its one largest customer, AMD. The move would keep the newly formed company profitable and competitive with other Asian foundry companies.

In the same presentation, AMD also indicated that eventually it would assign manufacturing of its ATI Radeon GPUs and chipsets, to The Foundry Company (TFC). Currently GPUs and chipsets are being manufacuted by foundry companies such as TSMC and UMC in Taiwan. This move would send a significant chunk of manufacturing to TFC. Sources tell ATI Forum.de that at FAB38 Dresden, a major manufacturing facility, installations of the 40nm bulk manufacturing node is in full-swing (not to be confused with 45nm SOI, on which K10.5 processors are built). Also there are indications of the facility accepting orders for manufacturing chips on the new node from other fab-less companies, an attempt to bring in profitability right from the start.


Source: ATI Forum

VIA, the third active player in the x86 processor market, is known for its low-power processors catering to the ULPC segment of the market. Sources tell HKEPC that the firm is now readying a dual-core variant of its Intel Atom competitor, the Nano 3000. The Nano 3000 series, slated for launches throughout 2009 includes a new architecture by VIA, while bearing the same essential Nano-BGA package.

The processor would use a boarder system interface with the 1333 MHz VIA V4 bus (FSB). It will feature x86-64 extension along with the SSE4 instruction sets to make it standards compliant. It will feature 128KB of L1 and 1MB of L2 caches. VIA is also looking to improve the processor's number-crunching capabilities by working on its integer and floating-point operations efficiency. The processor will be built on the Japanese Fujitsu 65nm manufacturing process which has so far been VIA's foundry partner with processors and S3 Graphics products. The company is also considering a switch to the TSMC 40nm or 45nm node later, sources note. The VIA Nano 3000 Dual-Core variant can be expected in the second-half of 2009, while single core variants of the architecture can be expected earlier.


Source: HKEPC

The year 2008 has been eventful for the PC graphics industry. This is the year which, for the most of the part, saw some serious competition between NVIDIA and ATI. While pure horsepower and value are what determined product superiority, implementing new technologies is what looks to drive GPU makers in 2009. One of the first of these technologies is the introduction of the 40nm manufacturing process, which facilitates GPU makers to step-up transistor counts or even cut manufacturing costs. VR-Zone, based on a few documents it has access to, compiled a list of GPUs that NVIDIA could pull out of its hat in 2009.

To begin with, NVIDIA is expected to have a full-fledged lineup of GPUs top-to-bottom built on the 40nm fab process within 2009. Before it makes the move to the new fab process, the G200b, built on the 55nm fab process will be given a chance to hold the performance and enthusiast segment offerings by the company, in Q1. Come Q2, and the G200b will be succeeded by GT212. All that while, current G94, G96, G98 will hold the mainstream thru value segments, only to be replaced by GT214, GT216 and GT218 respectively in Q3. NVIDIA's gets a newer IGP too, the iGT209. NVIDIA looks to end the year with a newer high-end GPU, the GT300 to succeed GT212 in Q4.


Source: VR-Zone

The AMD RV740 has been gaining quite some attention lately. Following news of it being the first GPU to be built on the 40nm manufacturing process, there is some information trickling in about NVIDIA's offering to combat it. The GT216, unlike what most speculations talked about being a next generation high-end GPU, is supposed to be a mainstream GPU whose specifications make it a rival to the AMD RV740. This, according to specifications of the said GPU emerging from Beyond3D, part of which they are sure of, part speculation.

For starters, the GT216 will be built on the 40nm manufacturing process. It will feature a 192-bit wide GDDR3 memory bus. Graphics cards built on this would feature 768 MB of memory (with possible OEM variants having just 384 MB). The memory is clocked at 1200 MHz (2400 MHz DDR). There is speculation linked to the rest of the specs at this point in time, notably that it might have 7 ALU clusters (168 SPs). The manufacturing process will make sure the GPU is cost-effective. With this, the next round of mainstream GPU competition sounds even more exciting.

Sources: Beyond3D Forums, Expreview

The RV740 graphics processor by AMD could well be the first GPU in production, to be built on the newer 40nm manufacturing process, giving its makers something to brag about. The RV740 design and specifications are largely derived from the RV770LE (covered here), while bringing the GDDR5 memory standard to the mainstream.

Chinese industrial journals tell DigiTimes that the company has completed taping-out the RV740, and that the GPU is awaiting mass-production by AMD's foundry partner, Taiwan Semiconductor Manufacturing Company (TSMC). Mass production of products based on this GPU could commence by the end of Q1 2009.

RV740, the first GPU built by AMD on the 40nm silicon fabrication process, seems to be gaining attention. While earlier reports suggested this core to be simply a miniaturized RV730, a fresh report emerging from VR-Zone says otherwise.

The RV740 is supposed to be largely derived from the RV770, as in its RV770LE avatar which went into making the ATI Radeon HD 4830. There are some interesting specifications attached to it. To begin with, the core physically holds only 640 stream processors, in comparison to the 800(+) on the RV770. The core continues to have 32 texture memory units (TMUs) and 16 render back-ends. Interestingly, there is a 128-bit wide GDDR5 memory bus instead of 256-bit wide GDDR3 (for the RV770LE). With this, the RV740 has a rated memory bandwidth identical to that of the RV770LE, 57.6 GB/s, though the bus width would warrant the use of lesser number of memory chips, and effectively reduce manufacturing costs. Graphics cards based on this GPU are expected to emerge in early 2009. You can also expect derivatives based on this core with GDDR4, GDDR3 or even DDR2 memory. In any case, the products are expected to cost below US $100.


Source: VR-Zone

The manufacturing process technologies for graphics processors that dominated the 2008 were TSMC 65nm and 55nm. While AMD made the transition to 55nm over an year ago, it was a little later when we started seeing 55nm versions of existing NVIDIA GPUs.

A month into TSMC's announcement of of its 40nm bulk production node, AMD has reportedly taped out its first 40nm GPU, the RV740. While this is no high-end GPU, it is supposed to be the first successful port of AMD's GPU architecture to the new node. The RV740 succeeds the RV730, the GPU that went into the making the Radeon HD 4670. It is a mainstream GPU that ideally should make it to the sub-$100 graphics card segment. With RV740, AMD gains some experience as a manufacturer as it works on the RV870 "Lil' Dragon", the next generation GPU from the red camp. A product based on the RV740 can be expected only after Q1 2009.

Source: NordicHardware

Sources in the industry point out that the 7 GT/s GDDR5 memory chip made by Hynix (model: H5GQ1H24AFR), which was announced earlier in this week, would make it to several major graphics board SKUs by both AMD and NVIDIA. The two companies have chosen TSMC and its 40nm fabrication process as the foundry partner for their upcoming 40nm graphics processors, namely AMD RV870 and NVIDIA GT212.

Both these chips would feature GDDR5 memory bus capabilities, and there are indications of the 7 GT/s DRAM chip being incorporated into graphics boards based on these GPUs. Additionally, there is also word that AMD will be using the said DRAM chip in its current flagship graphics card, the Radeon HD 4870 X2 in the near future. Both AMD and NVIDIA are expected to have taped out their 40nm GPU designs within Q1, 2009.

Source: Expreview

Taiwan Semiconductor Manufacturing Company (TSMC) today announced volume production of the first semiconductor foundry 40nm logic manufacturing process with the successful ramp of its 40 nanometer (nm) General Purpose (G) and Low Power (LP) versions. Nanometers measure the width of metal lines in semiconductors. Forty nanometers is less than one-thousandth the width of a human hair.
The 40nm process is one of the semiconductor industry's most advanced available for production manufacturing process and is expected to play a key role in the development of next generation products in global consumer electronics, mobile, and computer end markets.

The RV770 graphics processor changed AMD's fortunes in the graphics processor industry and put it back in the race for supremacy over the larger rival NVIDIA. The introduction of RV770-based products had a huge impact on the mid-range and high-end graphics card markets, which took NVIDIA by surprise. Jen-Hsun Huang, the CEO of NVIDIA has been quoted saying that they had underestimated their competitor’s latest GPU, referring to RV770. While the Radeon HD 4870 graphics accelerator provided direct competition to the 192 shader-laden GeForce GTX 260, the subsequent introduction of a 216 shader variant saw it lose ground, leaving doubling of memory size to carve out the newer SKU, the Radeon HD 4870 1GB. Performance benchmarks of this card from all over the media have been mixed, but show that AMD isn’t giving up this chance for gaining technological supremacy.

In Q4 2008, NVIDIA is expected to release three new graphics cards: GeForce GTX 270 and GeForce GTX 290. The cards are based on NVIDIA’s G200 refresh, the G200b, which incorporates a new manufacturing technology to facilitate higher clock-speeds, stepping up performance. This looks to threaten the market position of AMD’s RV770, since it’s already established that G200 when overclocked to its stable limits, achieves more performance than RV770 pushed to its limits. This leaves AMD with some worries, since it cannot afford to lose the wonderful market-position its cash-cow, the RV770 is currently in, to an NVIDIA product that outperforms it by a significant margin, in its price-domain. The company’s next generation graphics processor would be the RV870, which still has some time left before it could be rushed in, since its introduction is tied to the constraints of foundry companies such as TSMC, and the availability of the required manufacturing process (40nm silicon lithography) by them. While TSMC takes its time working on that, there’s a fair bit of time left, for RV770 to face NVIDIA, which given the circumstances, looks a lost battle. Is AMD going to do something about its flagship GPU? Will AMD make an effort to maintain its competitiveness before the next round of the battle for technological supremacy begins? The answer is tilting in favour of yes.

The year 2008 so far, has been very eventful for the graphics card market. A reinvigorated GPU lineup by ATI, brought in some fierce competition to NVIDIA, which resulted in a tug-of-war with pricing graphics cards in the market, with either company refusing to lose on grounds of pricing. This event, coupled with the announcement of several game titles by game publishers, resulted in bumper-sales of graphics cards, giving the present state of the global economy little or no relevance.

The months to come hold the same amount of importance for both AMD and NVIDIA, where the next round of competition begins with successors to current high-end products being slated. NVIDIA is expected to continue with its monolithic high transistor-count GPU design methodology, while AMD could bring in a little change to the way it uses two efficient GPUs to build powerful products.

Reports suggest that the Taiwan Semiconductor Manufacturing Company (TSMC) could receive manufacturing contracts by AMD, and long-time customer NVIDIA, for graphics processors based on the newest 40nm silicon fabrication process. The two giants in the visual computing industry, are expected to skip the 45nm process altogether. This is seen as a move to cut down manufacturing costs, and use the most feasible manufacturing technologies. Miniaturizing circuitry at that scale would allow them to build even more complex silicon machinery, with much higher transistor counts, while maintaining size constraints.

AMD on its part would have to use the services of TSMC, since the foundry company's fab in Dresden is only capable of 45nm SOI fabrication process, and that it would take as long as 2010, by the time the expected 32nm process is ready at the New York fab. The next star-entry for AMD would be the ATI RV870, and as for NVIDIA, it would continue development of monolithic high-end GPUs with GT216, a successor to the G200 GPU. Meanwhile, the companies could continue aggressive competition, with projections of up to 20% price-cuts by Christmas 2008 shopping season. Their 40nm GPU designs could be ready by the end of this year, and 40nm GPUs could be supplied by June, 2009.

Source: CENS

As we inch closer to the R700 release, which previews prove to have dethroned the GeForce GTX 280 convincingly, taking the crown for the fastest graphics card there is, NordicHardware reports AMD could be giving 'final-touches' to a fresh-wave of GPUs for early 2009. The timing is a critical factor here as that's the time-range the proposed NVIDIA G300 carrying 384 SP's and 512bit GDDR5 memory bus is marked for. The R800 cards could carry 2,000 stream processors, with its unit processors the RV870 holding 1,000 stream processors each. They could enter the realm of either 40nm or 45nm fabrication process.

Source: Nordichardware

Taiwan Semiconductor Manufacturing Company (TSMC) recently unveiled the foundry's first 40 nanometer (nm) manufacturing process technology. The new node supports a performance-driven general purpose (40G) technology and a power-efficient low power (40LP) technology. It features a full design service package and a design ecosystem that covers verified third party IP, third party EDA tools, TSMC-generated SPICE models and foundation IPs. First wafers out are expected in the second quarter of 2008.