News Posts matching "DIMM"

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Samsung Starts Mass Producing First 3D TSV Technology Based DDR4 Modules

Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

SanDisk Introduces New Solutions for VMware Horizon 6 and Virtual SAN at VMworld

SanDisk Corporation (NASDAQ:SNDK), a global leader in flash storage solutions, today announced broad support for VMware Horizon 6 and Virtual SAN with a series of virtual desktop infrastructure (VDI) and end-user computing (EUC) solutions for Horizon 6, utilizing the award-winning ULLtraDIMM solid state drive (SSD) and Fusion ioMemory.

When coupled with VMware's Horizon 6, ULLtraDIMM and Fusion ioMemory allow customers to deploy high-performance, cost-effective virtual desktop infrastructure solutions and increase virtual desktop density. Additionally, through the combination of solid-state hardware and software technology, SanDisk enables enterprise organizations to select the right deployment option for their environment, providing greater flexibility and reducing barriers to adoption.

Corsair Officially Announces Vengeance LPX and Dominator Platinum DDR4 Memory

Corsair, a leader in high-performance PC hardware, today announced the availability of Corsair Vengeance LPX and Dominator Platinum lines of high-speed DDR4 computer memory. This new generation of memory ushers in a new age of ultrafast computing with optimizations such as increased DRAM bandwidth, higher bus frequencies, lower power usage, and higher reliability.

Corsair Vengeance LPX and Dominator Platinum DDR4 memory kits are validated with motherboard partners (ASUS, ASRock, EVGA, Gigabyte, and MSI) and use the new XMP 2.0 profile to deliver easy, reliable overclocking performance with the upcoming next-generation Intel X99 platforms and Intel Core i7 processors (codenamed Haswell-E). The Vengeance LPX and Dominator Platinum memory kits are supplied with a limited lifetime warranty.

SanDisk and Super Micro Computer Announce Design Win for ULLtraDIMM SSD

SanDisk Corporation, a global leader in flash storage solutions, and Super Micro Computer, Inc., today announced that the SanDisk ULLtraDIMM solid state drive (SSD), the industry's first enterprise-class, ultra-low latency, memory-channel connected storage solution, will begin shipping in Supermicro's Green SuperServer and SuperStorage platforms. Adding flash storage on the memory bus provides Supermicro with a powerful solution to help customers address growing data center application performance requirements without a significant infrastructure investment.

"The ULLtraDIMM SSD was designed to expand the reach of flash storage throughout the data center and scale to meet the requirements of any enterprise application - no matter how bandwidth or capacity intensive," said John Scaramuzzo, senior vice president and general manager, Enterprise Storage Solutions at SanDisk. "We are very excited to partner with Supermicro in offering this innovative, ultra-low latency storage solution to help their customers accelerate the performance of their cloud, virtualization, HPC and other applications and experience the benefits of a flash-transformed data center."

Apacer Combo SDIMM Starts Sampling

Traditional PC providers are targeting the upcoming vast wave of replacement of enterprises'equipment caused by termination of Window XP system update service. Besides, a new generation of Internet of Things, cloud-based services and Smart Automation are booming and growing. These have created a great demand for terminal devices, along with the ever-increasing applications.Given the trend of compactness, it is very important that memory module features both simplicity and flexibility, as the storage devices designed for more and more system service resources and for the purpose of thinner hardware appearance.

Apacer, the leading professional manufacturer of memory modules, presented Combo SDIMM in Computex this year. The product derives from an innovative concept and underlines its innovative R&D design that integrates SSD (Solid State Drive) and DRAM on the DRAM Module, adding a new storage choice for principal customers of embedded industrial computer providers. It takes up less motherboard space occupied by storage devices and memory modules. Users can expand SSD storage capacity anytime. Currently Apacer has launched two SSD options, including M.2 NGFF and CFast memory card, both supporting SATA 3.0 (6Gb/s) interface. It is a great breakthrough in storage device field.

Micron Announces Monolithic 8 Gb DDR3 SDRAM

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the introduction of a monolithic 8 Gb DDR3 SDRAM component, enhancing its leadership position as a diverse memory solutions provider for enterprise applications such as data analytics. This new design is based on Micron's latest-generation 25 nm DRAM manufacturing process.

DDR3 is the mainstream DRAM technology for the enterprise market, and the addition of an 8 Gb monolithic component will enable cost-effective, high-capacity solutions optimized to support large-scale, data-intensive workloads.

I'M Intelligent Memory Debuts 8 Gb DDR3 Components, 16 GB Modules

I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, announces availability of the world's first 8 Gigabit (Gb) DDR3 components with a single chip-select, doubling the amount of memory per chip compared to other DDR3 DRAM devices on the market. Based on these new 8 Gb components, I'M is also introducing the first 16 Gigabyte (GB) DDR3 UDIMM and SO-DIMM memory modules with optional ECC error-correction.

The JEDEC specification JESD79-3 has always allowed an 8 Gb density for DDR3 memory devices. While most DRAM manufactures are waiting for a 2x nm process to fit such high memory capacity into a single DRAM IC package, I'M has developed its own a revolutionary way to manufacture 8 Gb DDR3 components with single chip-select utilizing existing 30 nm manufacturing technologies.

SMART Modular Announces Sample Shipments of DDR4 Memory Modules

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today that it has begun shipments in sample quantities of DDR4 memory modules. These samples are for qualification in next generation server, storage and networking applications which are expected to launch later in 2014 through 2015.

Currently, SMART's lineup of available DDR4-2133 1.2V modules includes VLP (Very Low Profile) and standard height RDIMMs up to 16 GB, and ECC SO-DIMMs up to 8 GB. These modules include improved capacity and performance scalability, improved power efficiency, and enhanced system reliability, which are all benefits driving the transition to DDR4.

ADATA and ASRock to Showcase the Glory of Cooperation

ADATA Technology Co., Ltd., a leading manufacturer of high-performance DRAM modules and NAND Flash application products, collaborated with AsRock to run a demo system equipped with ADATA's overclocking memory modules and AsRock's motherboard, whose performance reached a breakthrough record. ADATA's XPG series DDR3 3100 memory modules going with AsRock's the latest Z97 OC Formula motherboard and Devil Canyon I7 4790K CPU processor reached the 3400MHz outstanding performance, which will be displaying at ADATA's booth and bring you with an amazing experience.

ADATA XPG Series exclusively designed for overslockers can meet the needs of professional gamers with the ultra-high speed performance and ultra-fast cool down function. At this year's Computex, ADATA will be showcasing its latest XPG Series V3, DDR3 3000 8GB x 4, whose 32GB capacity can match ASRock Z97 OC Formula motherboard bringing out a steady speed of 3000MHz, and fulfill overclockers' picky needs of high capacity and high performance as well. In addition, its replaceable heat sink design allows users to customize the memory modules' color to complement their high performance system. ADATA is the first one who is able to steadily provide customers with 8GB x 4 pack memory module house in the industry.

Diablo Technologies Presents Memory Channel Storage at EMC World

Diablo Technologies today announced that it will present on Memory Channel Storage (MCS) at EMC World 2014 in Las Vegas. Experts at Diablo will demonstrate the performance of MCS-based devices for virtualized environments in the VMware Theatre on May 7 at 4:15 p.m. PDT.

According to TechNavio, the global enterprise server virtualization market will grow 32 percent over the period 2010-2014. With the increasing adoption of virtualized computing, the need for higher I/O throughput and capacity has reached an important turning point. Traditionally, storage architectures have been unable to leverage the vast processing capabilities of modern CPUs. As a result, the number of virtual machines (VMs) that can be serviced on a single physical server is limited by the properties of pre-existing storage solutions. By leveraging the parallelism of the memory subsystem, Diablo's MCS technology enables ultra-low response times to VMs while simultaneously servicing heavy I/O workloads.

Micron Technology Debuts DDR4 Modules for Intel Xeon E5-2600 v3 Systems

Micron Technology, Inc., a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4 Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.

SMART Modular Announces High Performance DDR4 DRAM Module

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, has been actively involved in developing and standardizing DDR4 module technology and today announced the first products in its DDR4 DRAM module portfolio.

SMART's initial lineup of DDR4-2133 modules are loaded with technology advancements inherent to the DDR4 platform. Those advancements include power efficiencies, faster speeds and higher densities, all key benefits for next generation server, storage and networking applications.

SanDisk Announces Release of the ULLtraDIMM SSD

SanDisk Corporation, a global leader in flash storage solutions, today announced that its ULLtraDIMM Solid State Drive (SSD), the industry's first enterprise-class, ultra-low latency, memory channel storage solution, is now shipping for qualification with select enterprise servers. The addition of flash technology on the DRAM memory channel expands the growing penetration of flash storage technology in enterprise data centers, and complements SanDisk's existing flash-based server hardware and software storage solutions.

The award-winning SanDisk ULLtraDIMM SSD can be integrated into an existing DIMM slot. This ensures ultra-low latency in business applications and results in improved application response times. Additional ULLtraDIMM SSDs can also be added to available DIMM slots, scaling performance and capacity without impacting latency. This creates new opportunities for server system designs to support use cases that require extremely fast storage, such as High-Frequency Trading (HFT), VDI, transaction processing, virtualization and cloud computing.

MSI Rolls Out H81M-E35 V2 Motherboard

MSI rolled out the H81M-E35 V2 entry-level socket LGA1150 motherboard. Designed for Core "Haswell" processors, the board draws power from a combination of 24-pin ATX and 4-pin ATX power connectors. It uses a simple 3-phase VRM to power the CPU, which is wired to two DDR3 DIMM slots, and a single PCI-Express 2.0 x16 slot. A couple of PCI-Express 2.0 x1, and a legacy PCI make for the rest of the expansion area. Storage connectivity includes two each of SATA 6 Gb/s and SATA 3 Gb/s. Display outputs include one each of DVI, D-Sub, and HDMI. Six USB 3.0 ports (four on the rear panel, two by header), six USB 2.0/1.1 ports, gigabit Ethernet, 6-channel HD audio, and legacy PS/2 connectivity make for the rest of it. Expect a sub-$100 pricing.

SMART Introduces New Memory Module Form Factor

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

Silicon Power Announces DDR3 Ultra Low Voltage Memory Modules

Silicon Power, the world's leading provider of memory storage solutions, today unveils the latest memory module solution, DDR3L-1333 and DDR3L-1600 Low-Voltage Series. Running at 1.35 volts at 1333 MHz and 1600 MHz, the Low-Voltage series is able to decrease hardware power consumption effectively without compromising the benefit of the performance. Apart from saving power from long-term operations, it also reduces the unnecessary heat waste, allowing advanced gamers, video and photo professionals and DIY enthusiasts to create an eco-friendly working stations.

Silicon Power Low-Voltage DDR3L series comes in selections from UDIMM to SO-DIMM at 1333 MHz and 1600 MHz, providing desktop and notebook users to save energy up to 20% from the benefits of low energy consumption. Moreover, this series is compatible with the latest Intel Haswell platform, ideal for those who are looking for a greener and power-saving alternative while enjoying the ultimate system performance.

Transcend Introduces DDR3-1866 Modules to Support High-Powered Servers

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 4 GB DDR3-1866 Registered DIMM (RDIMM) and 4 GB DDR3-1866 Unbuffered ECC DIMM (ECC UDIMM) memory modules. Ideal for use in Intel Xeon E5-2600 v2 processor-based servers, the new DDR3 modules ensure optimal performance in today's virtualized data centers.

Developed to support increasing use of server virtualization, Transcend's DDR3-1866 memory modules are tested to be fully compatible with Intel Romley-EP platforms based on Intel's latest generation server processor, the Xeon E5-2600 v2 family (code named "Ivy Bridge-EP"). As Transcend's highest frequency DDR3 server modules, the 4 GB DDR3-1866 DIMMs are constructed with top quality DDR3-1866 DRAM chips that deliver exceptional performance and durability.

EUROCOM Unveils Panther 5SE Mobile Server with Lesser Weight

Intel has published a case study on the EUROCOM Panther 5SE Mobile Server as part of winning the "Form Factor Solution Innovation Award", titled "Super Computer Sheds Weight, gains mobility, Becomes "Server-on-the-Go". As an Intel Platinum Reseller, Eurocom works very closely with Intel to offer innovative and cutting edge technology to professionals who demand powerful computing solutions wherever they may be. At the 2013 Intel Solution Summit, Eurocom was awarded the Form Factor Solution Innovation Award for delivering the most innovative mobile solution based on Intel Technology to meet our customers' demands for mobility.

More specifically the EUROCOM Panther 5SE was awarded this distinction by conquering the challenge of creating a portable server for application developers, emergrency responders, on site trainers and others who need powerful server capability on the go. As Intel Explains "Eurocom corporation successfully conquered this challenge by outfitting a desktop replacement chassis with the highest quality components, including the Intel Xeon processor E5 series and Intel S3700 solid state drives - chosen for their ability to support both workstation and server-class operations."

Kingston Technology to Demo ECC SO-DIMMs for an Avoton C2000

Kingston Technology Company, Inc., the independent world leader in memory products, today announced they will be showcasing working DDR4 memory, XMP certified HyperX memory on a new Ivy Bridge-E based desktop, 2133 MHz SO-DIMMs for a Haswell based notebook and ECC memory in an Avoton based microserver at the Intel Developers Forum (IDF) 2013. IDF will be held at the Moscone center in San Francisco, California on September 10th - 12th.

During IDF 2013 Kingston will be showcasing four demo systems. The DDR4 memory demo will highlight 192 GB of working 2133 MT/s DDR4 Registered DIMMs at 1.2V operating on a future Intel reference platform. The Kingston HyperX demo will be showcasing the latest HyperX memory that has been validated through Intel's XMP certification process. The demos will be shown using an X79 motherboard and one of Intel's newest Ivybridge E processors. Our 2133 MHz SO-DIMM memory demo will be shown working on a Haswell based notebook. The Microserver demo will be demonstrating 1600 MHz 1.35V low voltage ECC SODIMM memory on an Intel Atom C2000-series "Avoton" microserver. Kingston's ECC SODIMM memory has been validated on the Intel "Edisonville" microserver system, and is posted on Intel's website.

GIGABYTE Intros F2A75M-DS2 Entry-level Socket FM2 Motherboard

GIGABYTE rolled out its newest entry-level socket FM2 motherboard, the F2A75M-DS2. With it, GIGABYTE established AMD A75 chipset and black PCB color as the new baseline for its AMD platform motherboards. Built in the compact micro-ATX form-factor measuring 174 x 226 mm, the motherboard seats AMD A-series APUs and Athlon processors in the FM2 package, with out of the box support for A-series "Richland" APUs.

The F2A75M-DS2 draws power from a combination of 24-pin ATX and 8-pin EPS connectors, a 4+1 phase VRM powers the APU socket, which is wired to two DDR3 DIMM slots, supporting up to 64 GB of dual-channel DDR3-2133 MHz memory; and a PCI-Express 2.0 x16 slot. A PCI-Express 2.0 x1 and legacy PCI make for the rest of its expansion. Display outputs include dual-link DVI and D-Sub. Storage connectivity includes four SATA 6 Gb/s ports from the A75 FCH. Four USB 3.0 ports (two on the rear panel two by header), 6-channel HD audio, gigabit Ethernet, PS/2 keyboard/mouse combo, and a number of USB 2.0/1.1 ports make for the rest of the connectivity. The board is driven by AMI Aptio UEFI BIOS, backed by GIGABYTE's dual-UEFI technology. Expect this one to go for around $60.

Haswell-E - Intel's First 8 Core Desktop Processor Exposed

Another day, another Intel leak and a few surprises as well. During the last few days we covered Intel's desktop roadmap for the next twelve months, bringing you news and insights on Intel's plans for the aforementioned time interval. Today we bring you news on what's to follow in the second half of 2014, specifically, on Intel's Premium Desktop plans for the interval, namely Haswell-E, DDR4 and the X99 PCH.

Haswell-E will be Intel's last and best offering using the 22 nm fabrication process, it will come in two versions, core count wise, 8 core part(s) as well as 6 core part(s) with hyper-threading enabled, therefore, boasting no less that 16 execution threads for the 8 core chips and 12 execution threads for the 6 core version(s). Judging by that alone, Haswell-E should constitute a far superior upgrade over Ivy Bridge-E, compared to what the latter will be in relation to Sandy Bridge-E, Haswell-E offering two additional physical cores that translate into four additional execution threads. The new chips will boast 2.5 MB of L3 Cache per core, summing up to 20 MB total L3 cache for the 8 core parts. TDP will remain in the same neighborhood it was in the case of its predecessors, around 130-140 W.

Sapphire Unveils Three APU-based Innovations

While Sapphire's LGA1150 motherboard lineup came across as a little lukewarm, the company more than made up for that with its fleet of motherboards that take advantage of AMD's newest A-series and E-series APUs and SoCs. First, there's the PGS A320M, a micro-ATX motherboard that ships with a FirePro A320 socket FM2 APU pre-installed. Largely identical to an A10-5800K, and based on the "Trinity" micro-architecture, the A320 features FirePro-branded professional graphics that's certified for most modern 3D productivity applications, and can give display output at resolutions as high as 4096 x 2160. The board features one each of DisplayPort 1.2, dual-link DVI-I, and D-Sub display outputs. Other features include eight SATA 6 Gb/s ports, four USB 3.0, gigabit Ethernet (Broadcom controller), and 8-channel HD audio.

Things get interesting with a contraption called IPC-FS1r2A75. This board comes in a proprietary IPC form-factor, features an FS1 rev 2.0 socket, which seats R-series APUs, an embedded AMD Radeon E6000 series GPU based on the Graphics CoreNext arhitecture, with its own dedicated GDDR5 memory on-package, and AMD A75 FCH chipset. The board offers six mini-DisplayPort and four HDMI outputs, two DDR3 SO-DIMM slots, an open-ended PCI-Express 2.0 x4 slot, four mPCIe slots (in stacks of two), five SATA 6 Gb/s ports, six USB 3.0 ports, two gigabit Ethernet connections, and 6-channel audio.

ASUS Maximus VI Formula Completes ROG LGA1150 Lineup

ASUS launched its socket LGA1150 motherboard lineup with three products in its coveted Republic of Gamers (ROG) lineup, the flagship Maximus VI Extreme, the micro-ATX Maximus VI Gene, and the mid-range Maximus VI Hero. A little earlier today, the mini-ITX Maximus VI Impact joined the team with a stunning feature-set for its size. At Computex, we pictured the last piece of the puzzle, the Maximus VI Formula. Pictured below, this ATX motherboard based on the Z87 chipset is best suited for liquid-cooled rigs with 3-way graphics cards. It borrows a piece of technology over from the TUF series, a thermal armor that covers most parts of the board. The armor makes contact with a water block that actively cools the board's CPU VRM.

The Maximus VI Formula uses an identical CPU VRM to the Maximus VI Extreme. The board draws power from a combination of 24-pin ATX and 8-pin EPS. A 4-pin ATX and Molex can be optionally connected to stabilize overclocks. The LGA1150 socket is wired to four DDR3 DIMM slots, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4), it lacks the PEX8747 bridge chip of its bigger sibling. Three other PCI-Express 2.0 x1 chips make for the rest of the expansion. Connectivity on the Maximus VI Formula includes ten SATA 6 Gb/s ports, eight USB 3.0 ports, SupremeFX audio, gigabit Ethernet (Intel controller), 802.11 ac WiFi, and Bluetooth 4.0. ASUS didn't reveal launch plans.

Corsair Launches Vengeance Pro Series DDR3 Memory

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

MSI Intros Trio of Mini-ITX LGA1150 Motherboards

MSI rolled out a trio of socket LGA1150 motherboards in the mini-ITX form-factor, Z87I, H87I, and B85I, based on Intel Z87, H87, and B85 chipsets, respectively. Pin-compatibility between the three chipsets means that the three boards are based on a common design. The three feature a 4-phase CPU VRM, two full-size DDR3 DIMM slots, a PCI-Express 3.0 x16, and a combination of 24-pin and 4-pin power connectors.

The Z87I and H87I are nearly identical, with VRM cooling, 802.11 b/g/n WiFi, and Bluetooth 4.0. The Z87I edges past the H87I with support for CPU overclocking, and a second gigabit Ethernet connection. The B85I lacks a VRM heatsink, and the wireless connectivity card. Instead, it gives you a vacant mPCIe slot. It offers 6-channel HD audio, instead of the 8-channel solution, on the other two. All three feature at least one gigabit Ethernet connection, DVI and HDMI display outputs, six USB 3.0 ports, and a number of USB 2.0/1.1 ports.
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