News Posts matching "Infineon"

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Globalfoundries and Infineon Collaborate for 40 nm Embedded Flash Process

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures. Production of the next generation 40nm eFlash MCUs will take place at different GLOBALFOUNDRIES sites, initially in Singapore with subsequent transfer to its site in Dresden, Germany.

"Next generation embedded Flash microcontrollers with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets," says Arunjai Mittal, Member of the Management Board of Infineon Technologies. "We trust in GLOBALFOUNDRIES with their excellent manufacturing background and sites on different continents to fulfill Infineon's stringent quality, infrastructure security and business continuity requirements."

Enterprise Strength and New Products Drive Record Intel Results

Intel Corporation reported record EPS and revenue on both a GAAP and non-GAAP basis. On a non-GAAP basis, revenue was $12.9 billion, operating income was $4.3 billion, net income was $3.3 billion, and EPS was 59 cents. On a GAAP basis, the company reported first-quarter revenue of $12.8 billion, operating income of $4.2 billion, net income of $3.2 billion, and EPS of 56 cents.

The company generated approximately $4.0 billion in cash from operations, paid cash dividends of $994 million, and used $4.0 billion to repurchase 189 million shares of common stock. “The first-quarter revenue was an all-time record for Intel fueled by double digit annual revenue growth in every major product segment and across all geographies,” said Paul Otellini, Intel president and CEO. “These outstanding results, combined with our guidance for the second quarter, position us to achieve greater than 20 percent annual revenue growth.”

Intel to Acquire Infineon's Wireless Solutions Business

Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon's Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately $1.4 billion.

WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel's strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.

"The global demand for wireless solutions continues to grow at an extraordinary rate," said Paul Otellini, Intel president and CEO. "The acquisition of Infineon's WLS business strengthens the second pillar of our computing strategy -- Internet connectivity -- and enables us to offer a portfolio of products that covers the full range of wireless options from Wi-Fi and 3G to WiMAX and LTE. As more devices compute and connect to the Internet, we are committed to positioning Intel to take advantage of the growth potential in every computing segment, from laptops to handhelds and beyond."

EU Slaps Chip Vendors with Penalties for Price-Fixing

As many as nine major chip vendors were fined a total of 331 million Euros (US $404.2 million) for participating in illegal price-fixing activities, by the European Union authorities. These include Samsung, Hynix, Nanya, Elpida, Infineon, NEC, Toshiba, Hitachi, and Mitsubishi. A 10th company in this price-fixing cartel was Micron Technology, which escaped the fine for exposing the malpractice to the EU authorities. Of these Samsung was given the single biggest fine of 146 million Euros, followed by Infineon at 57 million Euros. The fines were reduced by 10% because all companies extended cooperation in the investigations.

The price-fixing cartel mostly involved bad trade of DRAM chips, and was active between 1998 and 2002, operating with a network of contacts which secretly exchanged pricing information. They colluded to fix prices of DRAM chips sold to major PC and server manufacturers. Investigations in the scam began in 2002 when Micron blew the whistle on the cartel. "By acknowledging their participation in a cartel the companies have allowed the Commission to bring this long-running investigation to a close and to free up resources to investigate other suspected cartels," said EU's Competition Commissioner, Joaquin Almunia. "As the procedure is applied to new cases it is expected to speed up investigations significantly," he added.Source: BBC News

Toppan Photomasks and GLOBALFOUNDRIES Form JV at Dresden Advanced Mask Tech Center

Toppan Photomasks, Inc. (TPI) and GLOBALFOUNDRIES today announced that they have formed a joint venture for operation of the Advanced Mask Technology Center (AMTC) in Dresden, Germany. The joint venture will provide leading-edge photomasks to GLOBALFOUNDRIES and to TPI’s European and global networks of customers.

Under terms of the venture, TPI’s Dresden manufacturing facility and the AMTC will be combined into a single manufacturing facility. TPI will retain its Dresden sales, customer service and mask front-end functions. The new integrated organization builds on the AMTC’s history of providing advanced masks, TPI’s and GLOBALFOUNDRIES’ manufacturing excellence in Dresden, Toppan’s world-class mask technology development, and the extensive collaborative relationships that GLOBALFOUNDRIES and Toppan have established in the industry.

AMD Names Thomas Seifert Chief Financial Officer

AMD today announced the appointment of Thomas Seifert as senior vice president and chief financial officer. Seifert, 46, will report to Dirk Meyer, AMD president and chief executive officer, and will have responsibility for leading the company’s global financial organization. Seifert succeeds Robert Rivet, who was previously promoted to chief operations and administrative officer.

“Thomas is a talented industry veteran with a wealth of knowledge and experience managing the operations and finances of companies in the most difficult and competitive sectors of the semiconductor industry,” said Meyer. “This knowledge and experience will enable him to further strengthen AMD’s financial foundation and help accelerate our transformation into a product design and marketing leader.”

IBM Announces Availability of 28 nm Semiconductor Technology

In a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM, Chartered Semiconductor Manufacturing Ltd., GLOBALFOUNDRIES, Infineon Technologies, Samsung Electronics, Co., Ltd., and STMicroelectronics have defined and are jointly developing a 28-nanometer, high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.

The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive mobile and consumer electronics applications, including the fast-growing mobile Internet device market segment. The favorable leakage characteristics of the HKMG technology result in optimized battery life for the next generation of mobile products.

Qimonda petitions for the opening of insolvency proceedings

Qimonda AG (NYSE: QI) and Qimonda Dresden OHG have filed an application with the local court in Munich today to open insolvency proceedings. Their goal is to reorganize the companies as part of the ongoing restructuring program. The court will now appoint a preliminary insolvency administrator.

The Qimonda Management Board intends to restructure key business units within the context of the insolvency regime. “German insolvency law offers the opportunity to accelerate the restructuring process that has already been started in order to reposition the company back onto a solid base,” said Kin Wah Loh, President and Chief Executive Officer of Qimonda AG. Qimonda possesses established products and, with its Buried Wordline technology, is currently bringing a promising future technology to the market.

Infineon Strengthens its Power Activities by Acquiring Primarion

Infineon Technologies today announced that the company has acquired one hundred percent of Primarion, Inc. to further strengthen its activities in the field of power management applications. Primarion is among the leaders in designing, manufacturing and marketing digital power ICs for computing, graphics and communication applications. Primarion is a fabless company, headquartered in Torrance, California.

Infineon Announces Technology Collaboration with Intel to Develop HD SIM Cards

Today at the Cartes Trade Show in Paris, Infineon Technologies AG announced a strategic technology collaboration for the development of optimized chip solutions for high-density (HD) SIM cards with Intel Corporation. Under the terms of the agreement, Infineon will architect modular chip solutions with Intel offering memory capacities from 4MB to 64MB (Megabytes). Infineon contributes its vast expertise in security hardware and will develop a 32-bit security microcontroller based on its existing SLE 88 family for use with HD SIM cards. Intel is contributing its leading-edge flash memory technologies, capabilities and manufacturing.
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