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AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Micron and Intel Unveil New 3D NAND Flash Memory

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

New Micron "Ultra" Memory Products Enable Next-Generation Automotive Systems

Micron Technology, Inc., today announced the availability of ultra reliable, ultra high-speed and ultra high-temperature parallel NOR Flash and low-power DDR4 (LPDDR4) DRAM to meet the increasing memory requirements for the automotive market segment. Micron's G18 NOR family offers the industry's highest-performance parallel NOR, while Micron's automotive-grade LPDDR4 solutions are an industry-first.

These new products meet the needs of automotive applications that require ultra high speed. The G18 family's high performance (266 MB/s)enables faster boot and code execution for higher-density applications, while LPDDR4 enables 33 percent higher peak bandwidth than DDR4. Additionally, Micron's new solutions deliver long-lasting reliability and meet ISO/TS certification requirements-with the G18 family enabling three times faster throughput over quad SPI NOR, and the LPDDR4 products undergoing additional package-level burn-in testing. Furthermore, Micron's G18 NOR products have options that meet the industrial temperature (IT) range of -40 to 85°C and the automotive-grade automotive temperature (AAT) range of -40 to 105°C. The LPDDR4 products have options that meet the automotive-grade industrial temperature (AIT) range of -40 to 95°C, as well as some future options that will meet the automotive-grade ultra temperature (AUT) range of -40C to 125°C, which is the highest operating temperature range in the industry, expected to be available in 2016.

Micron Technology Breaks Ground on Expansion of Singapore NAND Flash Facility

Micron Technology, Inc., today hosted a groundbreaking ceremony with company and Singapore government officials to begin the expansion of its Singapore NAND flash memory fabrication facility.

Previously announced by the company in December, the approximate 255,000 square foot expansion will facilitate efficient implementation of 3D NAND production at the Singapore facility and give Micron the flexibility to gradually add incremental capacity in response to market requirements. In addition, the space will enable production of storage class and other memory technologies.

"Micron enjoys a strong relationship with Singapore where we employ more than 7,000 team members operating at four major facilities," said Micron President Mark Adams. "We're excited to expand our manufacturing footprint in Singapore, and we commend the government and Economic Development Board for fostering such a productive business environment."

Micron, Seagate Announce Strategic Alliance

Micron Technology, Inc., and Seagate Technology plc today announced a strategic agreement that establishes a framework for combining the innovation and expertise of both companies. The framework of the agreement will enable customers of the two companies to benefit from a focused approach to deliver industry-leading storage solutions, helping them innovate faster and more effectively

While initially focusing on next-generation SAS SSDs and strategic NAND supply, Micron and Seagate anticipate that this multi-year agreement will extend into future collaboration on enterprise storage solutions featuring Micron NAND flash memory. "As two of our key partners, we look forward to the benefits of this Micron and Seagate collaboration in future NAND flash-based storage technologies," said Mike Kerouac, President of Global Product Operations for EMC Corporation.

"The strategic agreement between Micron and Seagate promises to deliver new and innovative flash-based storage solutions," said Trevor Schick, Senior Vice President, EG Global Supply Chain, HP.

Crucial Introduces Next Generation Solid State Drives

Crucial, a leading global brand of memory and storage upgrades, today announced two new solid state drives (SSDs): the Crucial MX200, built to deliver leading speeds and features, and the Crucial BX100, designed to offer substantial yet affordable performance gains compared to a hard drive.

Crucial MX200 SSD: Available in 250GB, 500GB, and 1TB capacities with respective MSRPs of £107.99, £191.99, and £360.99, the new Crucial MX200 delivers sequential reads and write up to 555MB/s and 500MB/s, along with random reads and writes up to 100k and 87k IOPS on all file types. Additionally, with an endurance rating up to 320 TBW (total bytes written) on the 1TB model, the Crucial MX200 delivers up to five times more endurance than a typical client SSD.

NAND Flash Industry Value Poised to Grow More than 10% in 2015: Trendforce

The shrinking NAND Flash production costs resulting from the NAND Flash industry's improving technology are expected to boost demand for various end products, including SSDs and eMMCs, according to DRAMeXchange, a research division of TrendForce. NAND Flash industry value is expected to rise consistently in 2015, reaching as high as US$ 27.6 billion on annual growth of 12%.

Based on the tendency for new hardware devices to be released in the third and fourth quarters of each year and the likelihood of demand being restrained in the first two quarters, Sean Yang, an assistant vice president of DRAMeXchange, believes the NAND Flash market will thrive mostly during the second half of 2015 rather than during the first half. Increased NAND Flash demand in both the third and fourth quarters is expected to benefit the NAND Flash industry tremendously by easing any potential oversupply that occurs in the two preceding quarters and allowing the market to reach a potential balance. By the end of 2015, the NAND Flash industry has a good chance of remaining healthy and growth is expected to continue.

Micron Announces Next-Generation Automotive Storage Solutions

Micron Technology, Inc., expands its automotive storage solutions portfolio with the introduction of their M500IT solid-state drive (SSD) in densities ranging from 60GB to 240GB and embedded multimedia card (eMMC) 5.0 memory. Both solutions are specifically designed to enhance automotive applications.

Micron's M500IT solid state drive (SSD) is the industry's first automotive-grade SSD with AEC-Q100-compliant NAND flash memory components and system-level qualification in select automotive applications and conditions. The M500IT is dramatically faster than hard disk drive (HDD) technologies, enabling nearly instantaneous system response times and fast application loads that are critical to the increasingly media-rich automotive experience. The M500IT SSD also includes hardware-based encryption, data-at-rest protection against unexpected power loss and an adaptive thermal monitoring system to secure user data at extended temperatures. The M500IT SSD uses AEC-Q100-compliant NAND flash memory technology and customized firmware to provide high quality and high performance for demanding automotive applications.

Micron Debuts the M600 Solid State Drives

Micron Technology, Inc., today announced a next-generation, client-class solid state drive (SSD) that sets a new bar for low-power, high-performance storage for personal computers. The M600 SATA SSD - specifically designed to take advantage of Micron's leading-edge NAND Flash technology - addresses the storage demands of modern mobile computing applications, including Ultrabook platforms and tablets, as well as performance-oriented PC desktops and video capture systems.

"Storage is an important enabler for ultrathin designs in personal portable computing devices," said Greg Wong, founder and principal analyst at Forward Insights. "Micron's M600 delivers the power efficiency and performance that helps to enable instant-on performance and responsiveness as well as the all-day battery life demanded by next-generation computing systems."

How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

Angelbird Announces its SSD WRK Line of Entry-level SSDs

Angelbird, Austria's premium SSD manufacturer, presents its new SSD wrk, a robust and highly efficient entry level Solid State Drive (SSD). It is ideal for upgrading your computer or laptop to faster SSD technology.

Angelbird does not compromise in terms of quality in its new SSD wrk, using an ultra-fast SATA 3.1 6Gb/s interface, which is fully compatible with older computer set-ups and operating systems. The SSD wrk uses the SMI 2246EN controller and the case is made of high quality, matt black anodized aluminum, housing custom packed Multi-Level-Cell NANDs from Micron. Durability is guaranteed by the MTBF of at least 2 million hours. High reliability is also provided by the integrated EDC and ECC error correction capabilities. With a thickness of only 7 Millimeter, the SSD wrk fits even into the tightest notebook or desktop case.

Kingston Technology Leads the DRAM Module Industry: TrendForce

The global PC DRAM module market revenues arrived at US$ 7.3 billion in 2013, a 32% YoY increase from 2012's US$ 5.5 billion, according to DRAMeXchange, the memory and storage research division of TrendForce. The main factors leading to the revenue growth included price increases for PC DRAM, increased spot market demand, and the rising proportion of contract market transactions. The top ten module manufacturers accounted for nearly 88% of the entire market's revenue in 2013, with Kingston Technology maintaining its usual leading position within the industry. ADATA Technology and Ramaxel, which ended up in second and third place, respectively, showed respective revenue growth of 116% and 37%. As the module manufacturers' operations are becoming increasingly diverse, the ranking for 2013 is based solely on their annual DRAM revenue.

Micron Announces Monolithic 8 Gb DDR3 SDRAM

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the introduction of a monolithic 8 Gb DDR3 SDRAM component, enhancing its leadership position as a diverse memory solutions provider for enterprise applications such as data analytics. This new design is based on Micron's latest-generation 25 nm DRAM manufacturing process.

DDR3 is the mainstream DRAM technology for the enterprise market, and the addition of an 8 Gb monolithic component will enable cost-effective, high-capacity solutions optimized to support large-scale, data-intensive workloads.

Micron Collaborates With Intel to Enhance "Knights Landing"

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Micron Technology Reports Results for Q3 of Fiscal 2014

Micron Technology, Inc., today announced results of operations for its third quarter of fiscal 2014, which ended May 29, 2014. Revenues for the third quarter of fiscal 2014 were $3.98 billion and were 3 percent lower compared to the second quarter of fiscal 2014 and 72 percent higher compared to the third quarter of fiscal 2013.

GAAP Income and Per Share Data - On a GAAP basis, net income attributable to Micron shareholders for the third quarter of fiscal 2014 was $806 million, or $0.68 per diluted share, compared to net income of $731 million, or $0.61 per diluted share, for the second quarter of fiscal 2014 and net income of $43 million, or $0.04 per diluted share, for the third quarter of fiscal 2013.

SSD Price War on the Cards

The consumer SSD market could witness a price-war, with leading manufacturers spooling up production, according to industry sources. NAND flash chip supplier Micron Technology reportedly reduced supplies of its chips to other manufacturers, in a possible bid to increase production of consumer SSDs bearing its own channel brand, Crucial Memory. The company plans to double shipments of Crucial-branded SSDs quarter-over-quarter. Elsewhere, Kingston Digital ramped up SSD shipments to 600,000 units a month, to step up competition against SanDisk and Samsung.

SSD makers are likely to take advantage of the entry of M.2 standard in the consumer space, with the introduction of Intel's 9-series chipset. M.2 offers 10 Gb/s of interface bandwidth (physical layer PCI-Express 2.0 x2), and some non-standard implementations are wired to offer even 20 Gb/s (physical layer PCI-Express 2.0 x4). M.2 slots feature SATA 6 Gb/s wiring in some onboard implementations, which could pave the way for M.2 replacing 2.5-inch SATA as the highest selling SSD form-factor, in the near future.


Source: DigiTimes

Micron's Daniel Skinner Receives JEDEC's Most Prestigious Honor

Micron Technology, Inc., (Nasdaq:MU) today congratulates Daniel Skinner, Director, Mobile DRAM Architecture, on receiving the prestigious JEDEC Award of Excellence in recognition of his leadership as chairman of the LPDDR3 and LPDDR4 Task Groups. The Award of Excellence is the most prestigious award bestowed by the Association, and it recognizes an individual's sustained service to JEDEC and the standards community. Mr. Skinner is only the 10th individual to have been awarded this honor.

"Dan was instrumental in driving the development of LPDDR3 in a timely manner to meet the needs of the mobile industry," said JEDEC president John Kelly. "His continued leadership within JEDEC around LPDDR4 has been essential as he led the task group to identify next-generation mobile apps and develop a standard around the needed requirements to make those apps a reality."

Crucial Ballistix Elite DDR4 Module Pictured Up-close

Here are the first pictures of a Crucial Ballistix Elite DDR4 memory module up close. Launched earlier this week, the Ballistix Elite DDR4 will be Crucial's first enthusiast module to address the emerging market created by Intel's Haswell-E HEDT platform. It will come in various speeds upwards of 2133 MHz (DDR), and densities of 4 GB, 8 GB, and 16 GB, and will be available as single-module, dual-channel, and quad-channel kits. The underlying DRAM chips are homebrew, from Micron's mega DRAM/NAND-flash plant in Boise, Idaho, US. The chips are cooled by a simple and effective aluminium heat-spreader.

NAND Flash Brand Supplier Revenue Falls 6.6% in First Quarter

The shipment performances of Smartphones, Tablets, and Notebooks were relatively weak in the first quarter due to seasonality. As a result of the entire NAND Flash market's oversupply in 1Q 2014, the branded suppliers' Q1 revenues saw a 6.6% drop compared to the previous quarter, and slid to approximately US$ 7,244 million, according to Sean Yang, Assistant Vice President at DRAMeXchange, the memory and storage research division of TrendForce.

Looking at the branded supplier revenue ranking, Samsung managed to retain its lead in the market with approximately US$ 2,175 million in sales, but saw its market share dip slightly to 30.0%; Toshiba came in second with a revenue total of US$ 1,548 million and an improved market share of 21.4%; SanDisk ended up in third place with US$ 1,367 million in revenue, while Micron came in fourth with US$ 1,050 million; Affected by its capacity allocations, SK Hynix's revenues slid to approximately US$ 594 million, resulting in market share of 8.2%.

Crucial Readies Solid State Drive with 16 nm NAND Memory

Announced back in July 2013, Micron's 128 Gigabit 16 nm-manufactured MLC (multi-level cell) NAND Flash memory will soon be making its debut within a new Crucial solid state drive. Named MX100, the 16 nm NAND-equipped drive will be showcased at Computex 2014 and is expected to arrive in a 2.5-inch form factor.

The MX100 has a SATA 6.0 Gbps interface and performance-wise it's said to be somewhere between the aging M500 and the recently released M550. Pricing is expected to be very competitive.

Source: Hardware.info

Micron Releases New SATA Solid State Drive Tuned for Data Centers

Micron Technology, Inc., today announced a new enterprise-class solid state drive (SSD) designed specifically for data center storage platforms. Enterprise applications are experiencing tremendous new demands for greater data throughput due to rapid growth in mobile applications, cloud services and connected devices. Micron's new M500DC SATA SSD addresses this growing need by providing the performance and data protection features of an enterprise-class drive at a great value.

"System administrators are realizing that there is a need for an SSD that delivers more enterprise-features than a client drive at a more affordable price than most enterprise drives," said Greg Wong, founder and principal analyst at Forward Insights. "Products such as Micron's M500DC SSD offer data centers the optimal balance of enterprise class features, performance and price for demanding 24/7 enterprise workloads."

Micron Technology and Wave Systems Collaborate to Secure Connected Devices

Micron Technology, Inc., a global leader in advanced semiconductor systems, and Wave Systems Corp., a leading provider of endpoint security, today announced they are expanding their relationship to develop solutions designed to strengthen user protection against current and emerging threats to compute and embedded platforms.

Given the pervasive connectivity associated with cloud computing and data/asset management models, it is becoming even more critical to architect comprehensive security solutions that leverage close integration of software and hardware components. This collaboration is focused on the detection and remediation of advanced persistent threats (APTs), the most advanced forms of malware capable of infecting a wide array of IP-connected devices.

Micron Technology Licenses Avago Technologies' 30G SerDes for Hybrid Memory Cube

Avago Technologies, a leading supplier of analog interface components for wireless, wireline, and industrial applications, today announced that Micron Technology, Inc. (NASDAQ: MU) has licensed Avago's 28nm Low Power 30Gbps Serializer/Deserializer (SerDes) IP for use in Micron's next generation Hybrid Memory Cube (HMC) devices.

"Avago is an established leader in the development and delivery of high-speed SerDes cores with an offering that is very well suited for integration into our HMC product line," said Tom Eby, vice president of Micron's Compute and Networking Business Unit. "Based on its advanced performance and low power, we are confident that our customers will benefit from the presence of the Avago SerDes on both sides of the memory channel."

Micron Reports Results for the Second Quarter of Fiscal 2014

Micron Technology, Inc. today announced results of operations for its second quarter of fiscal 2014, which ended February 27, 2014. Revenues in the second quarter of fiscal 2014 were $4.11 billion and were 2 percent higher compared to the first quarter of fiscal 2014 and 98 percent higher compared to the second quarter of fiscal 2013.

GAAP Income and Per Share Data - On a GAAP basis, net income attributable to Micron shareholders in the second quarter of fiscal 2014 was $731 million, or $0.61 per diluted share, compared to net income of $358 million, or $0.30 per diluted share, in the first quarter of fiscal 2014 and a net loss of ($286) million, or ($0.28) per diluted share, in the second quarter of fiscal 2013.

Micron Technology Debuts DDR4 Modules for Intel Xeon E5-2600 v3 Systems

Micron Technology, Inc., a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4 Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.
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