SanDisk Corporation (NASDAQ: SNDK), a global leader in flash memory storage solutions, today announced it has appointed Thomas Rampone as senior vice president of the company's solid state drive (SSD) business, which includes SanDisk's Enterprise Storage Solutions (ESS) and Client Storage Solutions (CSS) organizations. He will report to Sanjay Mehrotra, SanDisk's president and CEO.

Rampone joined SanDisk from Intel where he served for over 27 years in various engineering and executive roles. Most recently, Rampone was vice president and general manager of Intel's Non-Volatile Memory Solutions Group where he was responsible for all of Intel's flash memory business including technology and product development, operations and marketing. Previously, Rampone served as vice president and general manager for Intel's Channel Platforms Group and the Desktop Boards Business.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

To further capitalize on the opportunity for Accelerated Processing Units (APUs) in embedded applications and form factors, AMD today announced the formation of a new Embedded Solutions Group and appointed Arun Iyengar as its corporate vice president and general manager. The AMD Embedded Solutions Group will operate as a separate business within AMD's Global Business Units under AMD Senior Vice President Lisa Su.

"AMD APUs have been extremely well received by embedded system designers who require more graphic-intensive displays and compute power, while continuing to increase our engagement with ecosystem partners to deliver a complete solution," said Lisa Su, senior vice president and general manager, AMD Global Business Units. "Arun's appointment and dedicated focus on expanding our differentiated embedded offerings will help ensure we are seizing the opportunity to expand in this rapidly growing market."

TYAN, an industry-leading server platform manufacturer and subsidiary of MiTAC International Corp., announces its fully array of platforms supporting the Intel Xeon processor E5-4600/2600/2400 and E3-1200 v2 product families. This rich product portfolio offers various selections to server markets ranging from economic single-socket (Intel Xeon processor E3-1200 v2 product family-based), entry level dual-socket (Intel Xeon processor E5-2400 product family-based), mainstream dual-socket (Intel Xeon processor E5-2600 product family-based) and high density quad-socket (Intel Xeon processor E5-4600 product family-based) products. TYAN’s rich product lines accelerate customers migrating to Intel’s latest platforms with enhanced performance, reduced total cost of ownership and greater flexibility.

HP today announced that John Schultz has been promoted to the position of executive vice president and general counsel, effective immediately. Schultz, who joined HP in 2008, will be a member of HP’s executive council and report to Meg Whitman, president and chief executive officer, HP.

As general counsel, Schultz is responsible globally for all legal and compliance functions. His previous role was vice president and deputy general counsel in charge of litigation.

Led by President and CEO Kazuo Hirai, these changes are intended to drive revitalization and growth across Sony's core electronics businesses, and deliver compelling user experiences through convergence of the unique assets in place throughout the Sony Group.

With Mr. Hirai at the center of a management team that will work together with the heads of each business group and platform, this new business structure is intended to establish rapid and optimized decision making processes as "One Sony," that significantly reinforce and accelerate Sony's overall business management. The changes are effective April 1, 2012.

Logitech International today announced that Whirlpool EMEA leader Bracken P. Darrell will join Logitech as president, effective April 9, 2012. Reporting to Guerrino De Luca, Logitech chairman and chief executive officer, Mr. Darrell will assume responsibility for research and development, sales and marketing, manufacturing, supply chain, IT, human resources and legal functions. The company's finance organization and LifeSize division will continue to report to Mr. De Luca until January 1, 2013, at which time Mr. Darrell will succeed Mr. De Luca as chief executive officer.