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MSI Announces X-Slim X430, a Major Breakthrough in Ultra-Thin Mobile Technology

The MSI X-Slim X430 uses AMD's latest second-generation Ultrathin Platform with dual-core processors and Microsoft's newest operating system, Windows 7, to provide users with the ultimate in ultra-thin mobility. MSI's ultra-thin, power-saving X-Slim 14" notebook has evolved once again to feature AMD's 2nd Generation Ultrathin Platform and Microsoft's new Windows 7 operating system in the gorgeous new X-Slim X430.MSI Notebook Marketing Director Sam Chern states that the X430, in addition to maintaining the ultra-thin, power-saving and beautiful exterior design characteristics of the X-Slim series, has bolstered hardware performance not only by the use of a dual-core processor, but also a fully supported HD video output capability that provides users with outstanding image management and visual performance.

AMD RS880 Details Trickle in

AMD processors finally get to address DDR3 memory on the new AM3 socket. Compatible processors under the Phenom II and Athlon X3, X4 banners that come in AM3 socket packages, will run initially on updated AMD 7-series chipset variants, and later be succeeded by the the company's RD890 and RS880 chipset cores. HKEPC compiled some information on the RS880 core logic. The "RS" prefix for AMD GPG chipsets mark the presence of integrated graphics. Based on the performance efficiency of the RSx80 dice, they're branded into the mainstream RSx80 product (eg: RS780 for AMD 780G), RSx80C for a value product (eg: RS780C for AMD 740G) and a high-end RSx80D (eg: in AMD 790GX).

The RS880 will use feature-set refresh, though will embed a rather dated RV620-class graphics processor. The IGP will have DirectX 10.1 API compliance. Specifications-wise it is identical to the RS780, both sport 40 stream processors, 8 texture address and 4 texture filtering units, though the core speed on the RS880 is expected to be significantly higher. The feature-set refresh, as stated earlier, includes support for Universal Video Decoder 2 (UVD-2), in addition to 100% hardware acceleration for VC-1, H.264 and MPEG-2 bitstream decoding. Also provided is video dynamic-contrast. The IGP supports HDMI with audio routing, and DisplayPort. The chipset will be released in Q3 2009. Like the current RS780, the RS880 will be manufactured on the 55nm node of TSMC. It will be used on motherboards with companion SB710 or SB800 southbridge chips.

Source: HKEPC

AMD Chalks-Out Chipset Launch Schedule for 2009

The year 2009 could be very decisive for AMD, with a fleet of desktop processors awaiting launch within H1, 2009. The company will also be preparing supportive core logic for compatibility with AM3 socket CPUs. Listed, are the highlights for the chipset division's product plans, as compiled by industry observer DigiTimes:
  • The introduction of a value-oriented IGP chipset in January 2009, the AMD 760G, based on the RS780 architecture. This is expected to replace AMD 740G. It offers a DirectX 10 IGP without support for UVD, Hybrid Crossfire or DisplayPort. To be accompanied by AMD SB710 southbridge.
  • The introduction of high-end AMD 790FX and 790GX chipsets that have been upgraded with native AM3 socket support, in May or June. To be accompanied by AMD SB750 southbridge.
  • The company will introduce the RX780-based AMD 770, which also gets its share of changes that bring in AM3 socket compatibility, in July or August. To be accompanied by SB710.
  • A next generation IGP-based RS880 northbridge would be introduced in May or June, also accompanied by SB710.
  • Finally in September, the company will launch a proper successor to the 790FX, in the form of RD890, and the introduction of the new SB800 southbridge.
Source: DigiTimes

First AMD Fusion Specifications, Hint Toward RV710 Specs.

AMD Fusion could well be the first CPU to feature a graphics processor core. It will incorporate a graphics processor with specifications identical to the RV710. This CPU would be based on the 45 nm silicon fabrication process, and this processor will be manufactured at the Taiwan Semiconductor Manufacturing Company (TSMC). This GPU will be called "Kong". Here are its specifications:
  • Core Frequency between 600 ~ 800 MHz
  • 128-bit wide memory bus (DDR3, Side-port supportive)
  • 40 Stream Processors
  • 8 TMUs, 4 ROPs
  • DirectX 10.1 support
  • UVD

AMD RS780 is 261% Faster Than AMD 690G in 3DMark06

Today, AMD announced the AMD RS780 IGP chipset in China, and first benchmark results are already starting to spread around the web. Initial tests of 3Dmark05, 3Dmark06 and F.E.A.R. under Windows VISTA Ultimate using AMD Athlon X2 5000+, 2GB PC2-6400 Corsair memory and the integrated graphics on a 690G board and RS780 board show some spectacular differences:

3DMARK05 @690G=1105, @RS780=2495
Vista Experience Index @690G=3.1, @RS780=3.5
FEAR DEMO @690=15FPS, @RS780=29FPS
3DMARK 06 @690G : Score=321, SM2:147, HDR/SM3=0, CPU score = 1860
3DMARK 06 @RS780: Score=1162, SM2:380, HDR/SM3=441, CPU score 1869

In terms of 3D graphics performance, AMD RS780 is 2x faster than AMD 690G. In 3Dmark06, the difference is shocking, 1162 vs 321. That is 3.6x difference.Source: OCWorkBench

AMD to Ship RS780 in China First Due to Driver Issues

Although AMD has already completed the hardware for its next generation IGP chipset, RS780, the company is still waiting on drivers to support its new Hybrid CrossFireX technology. As a result the motherboards will be launched first in China on January 23, while the launch date in other countries will be set after the driver is complete. Since Hybrid CrossFireX technology is a major feature of the RS780 chipset, AMD hopes to give the technology the best introduction to the market it can. However, any significant delay in shipments could end up hurting AMD's profits and momentum. Therefore, the company has decided to adopt a strategy of selling the motherboards in certain regions first. Final Hybrid CrossFireX drivers are expected to be distributed to AMD's partners by the middle of February, with the worldwide launch of the RS780 to take place before the end of February, if everything goes by plan.Source: DigiTimes

AMD RS780 Chipset to Launch in January

Information coming from DigiTimes, claims that AMD will launch its next-generation performance/mainstream RS780 IGP and value RS740 chipsets in January next year, while in the second quarter, the company will launch the high-end RS780D and mainstream RS780C. RS780 motherboards will be priced around US$90-120, while RS740 motherboards will come for around US$40-60. The RS780 supports AM2+ processors, HyperTransport 3.0 and PCI Express 2.0, while the IGP will support DirectX 10 and UVD (Unified Video Decoder) 2.0 for H.264 and VC-1 decoding. The IGP also supports DisplayPort, HDMI, DVI and HDCP. Hybrid CrossFireX technology, which is a similar to NVIDIA's Hybrid SLI, allowing the IGP to work together with discrete graphics cards for extra performance, will be presented as well.Source: DigiTimes

More AMD RS780 Details Revealed

AMD’s latest roadmap reveals more details of its upcoming next-generation RS780 platform, designed to accommodate the new Socket AM2+ processors with HyperTransport 3.0. The RS780 north bridge sports a new graphics core with AMD’s Universal Video Decoder, or UVD technology for hardware acceleration of H.264 and VC-1 video formats. The new chipset supports DisplayPort, DVI, VGA, TV-out, LVDS outputs and HDMI digital video output interfaces. Additionally, the chipset can work with external graphics card via a PCIe 2.0 x16 slot. New to the RS780 platform is the SB700 south bridge. The SB700 does away with all PCIe lanes and only supports PCI, because all PCIe functionality has moved to the RS780 north bridge. AMD increases USB support to 12 USB 2.0 ports plus an additional 2 USB 1.1 ports. The new south bridge supports up to six SATA 3.0 Gbps ports with RAID 0, 1 and 10 configurations. IDE remains a supported feature of the SB700. There's also integrated audio controller. Expect AMD to unveil the RS780 platform sometime next year.Source: DailyTech
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