GPU buyers can breathe a huge sigh of relief that AMD isn't fixated with next-generation game consoles, and that its late-2013 launch of its next GPU generation is with good reason. The company is building a new GPU micro-architecture from the ground up. Codenamed "Volcanic Islands," with members codenamed after famous islands along the Pacific Ring of Fire, the new GPU family sees AMD rearranging component-hierarchy within the GPU, in a big way.

Over the past three GPU generations that used VLIW5, VLIW4, and Graphics CoreNext SIMD architectures, the component hierarchy was essentially untouched. According to an early block-diagram of one of the GPUs in the series, codenamed "Hawaii," AMD will designate parallel and serial computing units. Serial cores based on either of the two architectures AMD is licensed to use (x86 and ARM), could handle part of the graphics processing load. The stream processors of today make up the GPU's parallel processing machinery.

In addition to its latest flagship Obsidian 900D chassis, Corsair plans to launch a new premium micro-ATX gaming PC case this season, the Obsidian 350D (model: CC-9011029-WW). It posed for pictures at various retailers, and some of its press-shots were leaked to the web. Reportedly measuring 450 x 210 x 440 mm, the case will retain the solid matte steel construction with a brushed aluminium front, and a large side acrylic window. Its front-panel features two 5.25-inch drive bays, a pair of USB 3.0 ports, and HD audio jacks.

Internally, the Obsidian 350D doesn't feature any drive cages that can go on to obstruct long graphics cards. Instead, it features two 3.5-inch bays towards its bottom, and what appear to be three 2.5-inch bays towards the top portion, with a gap in between. Ventilation includes two 140 mm fan vents on the top, to which radiators can be latched on to (one 140 mm spinner included), and a rear 120 mm fan (included). The Obsidian 350D should be released some time towards late-April or early-May.

As confirmed by some freshly-leaked slides, 2014 will see Intel bring some new guns to the fight with ARM, including Bay Trail-T, the successor of Clover Trail and the first Atom platform to take advantage of the 22 nm manufacturing process.

The star of Bay Trail-T is the Valleyview SoC which will feature four (out-of-order) Silvermont cores clocked at up to 2.1 GHz (delivering up to 60% higher performance than the Clover Trail chip), a two-channel LPDDR3 memory controller, an upgraded video decoder, support for resolutions up to 2560 x 1600 pixels, and a new GPU boasting DirectX 11 capabilities and offering up to a 3x performance boost over Clover Trail.

Devices based on Bay Trail-T are expected to have a standby battery life of 20 days and would last for 11 hours of continuous video playback, before needing to be charged.Source: Mobile Geeks

Going into 2013, Intel's tough balancing act between keeping a low power/thermal envelope, and advancing performance, all while staying on the 22 nm silicon fab process, will be care of its Core "Haswell-ULT" processor. The chip will feature some radical changes to traditional Intel processor design, which will help it achieve its design goals. According to a deck of leaked slides scored by Expreview, Intel plans to use additional C-states that drop the processor's base clock, and redesign the processor package to accommodate the PCH silicon, reducing the board footprint.

To begin with, Haswell-ULT will be designed to support 24 MHz base clock speed, which running in "deep" energy-saving idle states. Modern processors with FSB replacement interconnect technologies such as QuickPath Interconnect and HyperTransport need a base clock to time other components on the processor, and for low-level communications, while a bulk of the data is transported by the primary interconnect. Intel found a way to turn off the 100 MHz base clock signal (which is also used to time the PCI-Express root complex and integrated graphics core), and replace it with a 24 MHz clock, when the processor is idling. As the processor returns to lower (more active) C-states, the 100 MHz base clock is reapplied. The 24 MHz base clock is activated by three new power states, C8, C9, and C10, introduced by Haswell-ULT. The third slide below details what happens to the various components in the new C-states.

ASUS is working on a new graphics card based on the upcoming GeForce GTX 650 Ti GPU, augmented with a non-reference design cooling solution. ASUS refers to it as "dual-fan," stopping short of calling it "DirectCU II." One can infer that the cooler could look very similar to dual-slot DirectCU II featured on GTX 660 DirectCU II, with the exclusion of direct-contact heat pipes. The new cooler, according to leaked marketing material will be 11% quieter, and run the GPU 14% cooler than NVIDIA reference cooler. The new marketing materials confirm specifications revealed by an older leak. The GPU is clocked at 980 MHz, with 1350 MHz memory (5.40 GHz GDDR5-effective), with 576 CUDA cores, and 1 GB of memory across a 128-bit wide interface. The GeForce GTX 650 Ti is expected to be priced around US $149, and is slated for October 9.Source: VideoCardz

A little later this month, NVIDIA plans to launch the GeForce GTX 660, its first desktop GPU based on the 28 nm GK106 silicon. The GTX 660 carries NVIDIA's ASIC codename GK106-400. An internal document detailing other SKUs based on the GK106 in the works, was leaked to the web. According to a 3DCenter.org report, the two ASIC codenames GK106-250 and GK106-200 described in the document could be new SKUs.

The GK106-250, carrying a working title GeForce GTX 655, could have one of the five SMX units of the GK106 disabled, resulting in a CUDA core count of 768. According to the document, it features a 192-bit wide GDDR5 memory interface, holding 2 GB of memory, much like the GTX 660. The GK106-200, on the other hand, with a working title GeForce GTX 650 Ti, could feature just three of the five SMX units on the GK106 silicon, making up 576 CUDA cores. According to the document, it features 2 GB of GDDR5 memory across a 128-bit wide memory interface, much like the GK107-based GTX 650. The two SKUs could help NVIDIA seal gaps in its mainstream desktop GPU lineup.Sources: 3DCenter.org, PCinLife

Here are some of the first pictures of NVIDIA's upcoming GK106 silicon, which goes into building the GeForce GTX 660 graphics card. The GK106, built on the 28 nm silicon fab process, is poised to be NVIDIA's newest mainstream-performance chip that succeeds the GF116. The pictures reveal the chip package to be almost as big as the GF116 but smaller than the GK104. This can be attributed to fewer memory I/O pins (192-bit maximum bus width).

The rectangular die of the GK106 appears to have roughly the same area as that of the GF116, but with the higher transistor density of the 28 nm process, one can expect a significantly higher transistor count for the chip. If some of the pictures we're seeing are any indication the GK106 will be extremely energy-efficient, as an unknown graphics card based on it draws power from just one 6-pin power connector.

A leaked AMD document for retail partners spelled out specifications of the first three FX "Vishera" processors by AMD. The new CPUs incorporate AMD's "Piledriver" architecture, and much like the first-generation "Zambezi" chips, will launch as one each of eight-core, six-core, and four-core chips. The eight-core FX-8350 is confirmed to ship with 4.00 GHz nominal clock speed, with 4.20 GHz TurboCore speed. The six-core FX-6300 ships with 3.50 GHz nominal, and 4.10 GHz TurboCore speed. The quad-core FX-4320, on the other hand, ships with the same clock speeds as the FX-8350. In addition, the document confirmed clock speeds of several socket FM2 A-series APUs, such as the A10-5700 and the A8-5500.Source: Expreview

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").

Source: VR-Zone Chinese

Streacom's newest duo of silent all-aluminum cases for HTPCs, the micro-ATX FC9, and the ATX FC10, inch closer to their Computex 2012 launch. Their specifications were leaked by the company's Chinese website. Both cases ensure the machines running in them stay quiet, and remain completely fanless, because their bodies double up as heatsinks for sensitive components, such as the processor. Both cases are made of brushed silver and black (sandblast finish) color options.

Measuring 348 x 289 x 100 mm (WxDxH), the Streacom FC9 supports motherboards in the micro-ATX and mini-ITX form-factors. It features one 2.5-inch drive bay, and a 3.5-inch bay, which supports 2.5-inch drives. It also has a bay for a slimline slot-loading optical drive. A CPU base makes contact with the processor (LGA775, LGA1155, LGA1156 supported), which conveys heat to a side panel via four copper heat pipes. All six panels of the case are made of thick aluminum sheets, some of which are ridged to increase surface area for heat dissipation. The case features three low-profile expansion slots.

According to a possible leak by a Rockstar North employee, Grand Theft Auto V (GTA V), could be headed for an October 2012 launch. The employee in question, Alex O'Dwyer, a character animation developer, listed out the projects he worked on, in his CV, which included a mention of "Grand Theft Auto V", with a date of "Oct 2012". The CV has since been pulled, with no comment from O'Dwyer or Rockstar.Source: Joystiq

It 'tis the season of rumors and assumptions for this years winter time blockbusters. According to Computer and Video Games, the following information, claiming to reveal the game's release date and a load of multiplayer features, was first posted on the official Black Ops forums in a thread that was later taken down, and its cached version is unavailable. It was then reposted in another thread on Activision's forums, which was also killed off by the publisher, but its cache remains available (via MP1st). None of this information is confirmed, but there's no reason it couldn't be genuine as it all sounds feasible. The list is full of new modes but makes no mention of a new game engine.

Thanks to some good understanding of geometry, and great Photoshop skills, the punters have estimated the die-size of NVIDIA's GeForce Kepler 104 (GK104) GPU, using a picture of the NVIDIA reference board that was leaked last week. Compared to the known die-size of an AMD "Tahiti"-based graphics card, the die-size of GK104 was estimated to be around 320 mm², about 45 mm² smaller than Tahiti. The relative transistor density of the chip, compared to AMD's 28 nm chips, were also estimated.Source: XtremeSystems Forums

Despite the less than mind-blowing title Rage, gamers who have been around long enough have come to know not to take id Software and its upcoming games lightly, especially if they're from one of its star franchises such as Doom and Quake. AllGamesBeta posted what it claims to be leaked screenshots of Doom 4, which it also goes on to claim as being "doomed" (cancelled), citing rumors. Close to two dozen of these screenshots can be found at the source. They reveal what [could have been] the setting of Doom 4, probably of the horrors unleashed on Mars (in Doom 3 and Resurrection of Evil) finding their way to Earth.

Source: AllGamesBeta

Pictures of the Sapphire HD 7950 3 GB graphics card have been leaked on the Guru3D forum by user asder00. No further details or specifications were given other than "Product name: Sapphire HD7950 3G GDDR5 PCI-E HDMI/DVI-I/DUAL MINI DP OC VERSION".

As can be seen by the cooler, this is a non-reference design - at least for the cooler. The cooler is coloured black, has a very modern, sharp, angular and somewhat futuristic look to it and sports two large Sapphire-branded fans. Of course, it has heatpipes and five are visible. The design of this cooler suggests that it should work quietly and cool efficiently. Connectivity is aided and abetted by one DVI port, one full size HDMI port and two mini-DisplayPorts, like on its bigger brother the HD 7970. Moving on to the box, one can see that it has a 384-bit bus and 3 GB GDDR5, again like the HD 7970. The box also shows a logo with "OverClock" written boldly in white on it. The inevitable attractive lady box art in this instance has her wearing a grey top, a partial face mask and a helmet from what looks like the wars of yesteryear, plus she is carrying a rifle over her shoulder.

Not quite two weeks ago, we reported on leaked pictures of AMD's upcoming Radeon HD 7770 mid-range graphics card based on the new Southern Islands architecture and listed its basic specs. Well, the leaks keep coming and bigpao007 of ChipHell has leaked more pictures with some benchmarks to go with them. The test setup consisted of an Ivy Bridge ES CPU – Core i5-3550K at 3.3Ghz and Z77 chipset-based motherboard. The driver used was the AMD Catalyst 8.940 RC2, giving the following 3DMark benchmark results:

VR-Zone have been having a little chat with Intel 'sources', who have leaked some juicy tidbits for us to enjoy in the form performance and power news. The upcoming next generation Medfield platform is Intel's first true System on a Chip (SoC) and is designed to compete with various low power ARM offerings in the tablet space. To help achieve this, they've gone through an internal restructure, merging four business units into just one: Ultra-Mobility, Mobile Wireless, Mobile Communications and Netbook & Tablet PC. The business unit is now simply known as Mobile and Communications. It's being run by Mike Bell and Hermann Eul and the first product to emerge from it will be is the 32 nm Medfield SoC solution.

VR-Zone explained that the competition will be "Apple's A-Series, NVIDIA Tegra, Qualcomm Snapdragon, Samsung Exynos, Texas Instruments OMAP and the likes. Out of all the chips mentioned above, only Samsung's Exynos is currently manufactured in 32nm process, just like Medfield."

First pictures of AMD's mainstream card, HD 7770, have now been leaked online. This card is the first major upgrade to the HD 5770 in two years, since the HD 6770 was just a rebrand. It features the Cape Verde GPU, which replaces the Juniper GPU used in the HD 5770/HD 6770. The card looks somewhat different, with a large fan sitting on top of the GPU, blowing directly onto it and the card's length is the same as the HD 5770, at around 8.25 inches.

If slide leaked on Orb-Hardware is to be believed we GPU consumers are in for a pretty big treat in the next month or so. The slide shown below states that the AMD 7970 will have a default core clock speed of 925MHz and a whopping 3 GB of GDDR5 memory.

It also sports a 3.5 TFLOPs precision floating point. Which would put it well beyond the NVIDIA flagship single GPU solution. The slide states the a ROP count of 32, against an earlier speculated count of 48. This could be because AMD may have delinked ROP clusters from memory bus. The cooler itself is under the trademark AMD black shroud so there is no way to see if it uses the rumored "vapor chamber" as seen in after market solutions.

Looking past all the beastly prowess of this slide one cannot help but think about power draw. The "leaked" slide states the 7970 will have a peak power draw of 300 W and an idle draw of 3 W. We will have to wait for review to see if any of these amazing stats are true.Source: OBR Hardware