GIGABYTE, the world's leading computer brand, proudly introduces the latest evolution in gaming laptops for 2024 - the AORUS 17 and AORUS 15 - delivering cutting-edge performance in their signature sleek and portable package.

Powered by the all-new Intel Core Ultra 7 processors and equipped with full-powered NVIDIA GeForce RTX 40 Series Laptop GPUs alongside expandable DDR5 memory, the AORUS 17 and AORUS 15 effortlessly handle demanding gaming and creative tasks on the go. The exclusive WINDFORCE Infinity cooling technology ensures optimal performance in a super-portable chassis, while the addition of Dolby Vision and Dolby Atmos technologies provides an immersive personal cinema experience.

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers and IT infrastructure, is thrilled to present a cutting-edge series of servers optimized for the newly launched Intel Xeon E-2400 processors. These servers deliver essential computing power, ensuring a dependable workload for a wide range of enterprise and edge computing applications, all while maintaining an impressive price-to-performance ratio.

"We are thrilled to unveil our latest server product line, which is engineered to deliver unparalleled performance and reliability," said Vincent Wang, sales VP at Giga Computing. "By leveraging the power of the new Intel Xeon E processors, our servers empower businesses to elevate their computational capabilities, enabling them to achieve greater efficiency and productivity. Whether it's for enterprise applications or edge computing tasks, GIGABYTE servers are the cornerstone of innovation in the digital landscape." ⁠

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

Today at the "AI Everywhere" event, Intel launched its 5th Gen Intel Xeon processors (code-named Emerald Rapids) that deliver increased performance per watt and lower total cost of ownership (TCO) across critical workloads for artificial intelligence, high performance computing (HPC), networking, storage, database and security. This launch marks the second Xeon family upgrade in less than a year, offering customers more compute and faster memory at the same power envelope as the previous generation. The processors are software- and platform-compatible with 4th Gen Intel Xeon processors, allowing customers to upgrade and maximize the longevity of infrastructure investments while reducing costs and carbon emissions.

"Designed for AI, our 5th Gen Intel Xeon processors provide greater performance to customers deploying AI capabilities across cloud, network and edge use cases. As a result of our long-standing work with customers, partners and the developer ecosystem, we're launching 5th Gen Intel Xeon on a proven foundation that will enable rapid adoption and scale at lower TCO." -Sandra Rivera, Intel executive vice president and general manager of Data Center and AI Group.

After years of delays, Chinese chipmaker Zhaoxin has finally launched its long-awaited KX-7000 series consumer CPUs, only one of its kind in China, based on the licensed x86-64 ISA. Zhaoxin claims the new 8-core processors based on "Century Avenue" uArch deliver double the performance of previous generations. Leveraging architectural improvements and 4X more cache, the KX-7000 represents essential progress for China's domestic semiconductor industry. While still likely lagging behind rival AMD and Intel chips in raw speed, the KX-7000 matches competitive specs in areas like DDR5 memory, PCIe 4.0, and USB4 support. For Chinese efforts to attain technological independence, closing feature gaps with foreign processors is just as crucial as boosting performance. Manufactured on a 16 nm process, the KX-7000 does not use the best silicon node available.

Other chip details include out-of-order execution (OoOE), 24 PCIe 4.0 lanes, a 32 MB pool of L3 cache and 4 MB L2 cache, a base frequency of 3.2 GHz, and a boost clock of 3.7 GHz. Interestingly, the CPU also has VT-x, BT-d 2.5, SSE4.2/AVX/AVX2 support, most likely also licensed from the x86 makers Intel and/or AMD. Ultimately, surpassing Western processors is secondary for China next to attaining self-reliance. Instructions like SM encryption catering to domestic data protection priorities underscore how the KX-7000 advances strategic autonomy goals. With its x86 architecture license giving software compatibility and now a vastly upgraded platform, the KX-7000 will raise China's chip capabilities even if it is still trailing rivals' speeds. Ongoing progress closing that performance gap could position Zhaoxin as a mainstream alternative for local PC builders and buyers.

Thermaltake announced the ToughRAM RC DDR5 memory kit in its first non-binary (24 GB of 48 GB) capacity. Model number RA50D524GX2-5600C46A comes with a capacity of 48 GB (2x 24 GB), and supports both Intel XMP and AMD EXPO profiles for a frequency of DDR5-5600 with timings of 46-46-46-90 at 1.1 V. The modules lack any RGB lighting but come with preparation for the company's Floe RC liquid cooling for memory; or an RGB lighting kit. Thermaltake is backing these with lifetime warranty. We expect a street price of $150.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage and gaming peripherals, has announced the upcoming release of Viper Gaming's first-ever collaboration with ASUS' gaming division, TUF Gaming: The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series.

As a bold new take on the recently released Viper Elite 5 performance memory series, the Viper Elite 5 TUF Gaming Alliance RGB DDR5 series is certified by ASUS' TUF Gaming Alliance and features high-performance transfer speeds of up to 6,600MT/s, capacities of up to 48 GB and tuned overclock support for XMP 3.0 and AMD EXPO on select models. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series offers the latest in top-tier performance for gamers, tech enthusiasts and creatives alike. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series also features unique branding and design combining Viper Gaming and TUF Gaming alongside the Viper Elite 5's one-of-a-kind matte white heatshield with an RGB lightbar.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."

MINISFORUM released the AR900i, an MoDT (mobile on desktop) motherboard in the Mini-ITX form factor that comes with a hardwired Intel Core i9-13900HX mobile processor and a pre-installed cooling solution. The board is priced at $560 on Amazon, with a limited-period $70-off coupon. This is good value, considering that the i9-13900HX is a maxed-out "Raptor Lake" based mobile processor that features all 8 P-cores, all 16 E-cores, and all 36 MB of shared L3 cache physically present on the "Raptor Lake" silicon. The P-cores boost up to 5.40 GHz, and the E-cores up to 3.90 GHz. The only catch with this processor compared to something like a desktop i9-13900, is its power specs that were originally designed for the power constraints of notebooks, with 55 W base power, and 157 W of maximum turbo power, compared to 225 W of the socketed i9-13900.

Since the Core i9-13900HX is a mobile BGA1964 package that remains hardwired to the board, it is not upgradable. MINISFORUM has designed a cooling solution specific to the processor, which uses a large aluminium fin-stack heatsink that relies on an 80 mm case fan for ventilation. There's a secondary fan-heatsink that provides cooling to two M.2-2280 slots north of the processor. Each of these two M.2 slots has a PCI-Express 5.0 x4 wiring, and using either of them subtracts 8 PCIe lanes from the board's sole expansion slot, a PCI-Express 5.0 x16. The board features an M.2 E-key slot that you can pair with your own WLAN card, it comes with provision for dual-MIMO ready antennas. The processor is wired to two DDR5 SO-DIMM slots supporting up to 96 GB of memory. The board draws power from a 24-pin ATX and a single 8-pin EPS, which should prove sufficient for this processor.

V-COLOR Technology Inc. announces reaching a new overclocking milestone of DDR5-8000 for their DDR5 R-DIMM 96 GB (4x 24 GB). This impressive feat was accomplished on the AMD 7000 series processors and the ASUS PRO WS TRX50-SAGE WIFI motherboard. V-COLOR has effectively demonstrated its overclocking capabilities on the high-powered AMD 7000 series processors, highlighting the outstanding compatibility and superior performance of V-COLOR memory products with AMD innovations. The accomplishment of overclocking to DDR5-8000 was achieved on the ASUS Pro WS TRX50-SAGE WIFI motherboard, employing the DDR5 OC R-DIMM 96 GB (4x 24 GB) configuration with CL40-52-52-126-1.4 V timings.

Thanks to the leaked slides obtained by @InstLatX64, we have more details and some performance estimates about Intel's upcoming 5th Generation Xeon "Emerald Rapids" CPUs, boasting a significant performance leap over its predecessors. Leading the Emerald Rapids family is the top-end SKU, the Xeon 8592+, which features 64 cores and 128 threads, backed by a massive 480 MB L3 cache pool. The upcoming lineup shifts from a 4-tile to a 2-tile design to minimize latency and improve performance. The design utilizes the P-Core architecture under the Raptor Cove ISA and promises up to 40% faster performance than the current 4th Generation "Sapphire Rapids" CPUs in AI applications utilizing Intel AMX engine. Each chiplet has 35 cores, three of which are disabled, and each tile has two DDR5-5600 MT/s memory controllers, which operate two memory channels each and translating that into eight-channel design. There are three PCIe controllers per die, making it six in total.

Newer protocols and AI accelerators also back the upcoming lineup. Now, the Emerald Rapids family supports the Compute Express Link (CXL) Types 1/2/3 in addition to up to 80 PCIe Gen 5 lanes and enhanced Intel Ultra Path Interconnect (UPI). There are four UPI controllers spread over two dies. Moreover, features like the four on-die Intel Accelerator Engines, optimized power mode, and up to 17% improvement in general-purpose workloads make it seem like a big step up from the current generation. Much of this technology is found on the existing Sapphire Rapids SKUs, with the new generation enhancing the AI processing capability further. You can see the die configuration below. The 5th Generation Emerald Rapids designs are supposed to be official on December 14th, just a few days away.

TrendForce investigations reveal a significant leap in the DRAM industry for 3Q23, with total revenues soaring to US$13.48 billion—marking 18% QoQ growth. This surge is attributed to a gradual resurgence in demand, prompting buyers to re-energize their procurement activities. Looking ahead to Q4, while suppliers are firmly set on price hikes, with DRAM contract prices expected to rise by approximately 13-18%, demand recovery will not be as robust as in previous peak seasons. Overall, while there is demand for stockpiling, procurement for the server sector remains tentative due to high inventory levels, suggesting limited growth in DRAM industry shipments for Q4.

Three major manufacturers witnessed Q3 revenue growth. Samsung's revenue increased by about 15.9% to US$5.25 billion thanks to stable demand for high-capacity products fueled by AI advancements and the rollout of its 1alpha nm DDR5. SK hynix showcased the most notable growth among manufacturers with a 34.4% increase, reaching about US$4.626 billion and significantly narrowing its market share gap with Samsung to less than 5%. Micron's revenue rose by approximately 4.2% to US$3.075 billion—despite a slight drop in ASP—supported by an upswing in demand and shipment volumes.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today showcases the B650MT motherboard, featuring the AMD Ryzen 5 PRO 7645 processor, the best workstation setup ideal for office users and businesses. The BIOSTAR B650MT motherboard delivers exceptional performance, efficiency, and security to meet the demands of the modern workplace; with support for up to 96 GB of DDR5 memory, it ensures seamless multitasking and exceptional system responsiveness. Offering a versatile storage solution with an M.2 slot and four SATA III ports, this motherboard provides lightning-fast data access and ample storage capacity. BIOSTAR's signature features, including Super Durable Solid Caps, Super Durable Inductor, and Super Hyper PWM, guarantee a dependable and long-lasting system.

With the latest AMD Ryzen 5 PRO 7645 processor, BIOSTAR's B650MT motherboard sets up an ideal platform for business and casual use. The AMD Ryzen 5 PRO 7645 processor offers a compelling blend of top-notch performance, cutting-edge security features, and energy efficiency, making it an excellent fit for the modern-day business sector. Powered by the groundbreaking AMD Zen 4 architecture, this desktop processor comes equipped with integrated AMD Radeon Graphics, simplifying integration, management, and administration tasks. With six cores and twelve threads, fast clock speeds reach up to 5.10 GHz, making it ideal for multitasking and demanding tasks.

The Geekbench database of benchmark submissions is yielding more leaks about Intel's upcoming 5th generation Xeon Scalable processors codenamed Emerald Rapids. Previously, we have covered the leak of the possibly top-end 64-core Xeon 8592+ Platinum and a 48-core Xeon 8558U processor. However, today, we are seeing information about lower-stack SKUs carrying up to 48 cores each. The first in line is the Xeon Platinum 8558P, a 48-core, 96-threaded CPU that runs at 2.7 GHz base frequency and 4.0 GHz boost frequency. It is equipped with 16 MB of L3 cache in addition to 192 MB of L2, making the total cache memory 260 MB. The integrated memory controller (IMC) of the Xeon Platinum 8558P supports eight-channel DDR5 running at 4800 MT/s, and the CPU has a TDP of 350 Watts.

The other SKU that was also listed was the Xeon Platinum 8551C, also a 48-core, 96-thread model with the same 260 MB cache configuration. However, this SKU has a higher base frequency of 2.9 GHz, with an unknown boost speed and unknown IMC configuration. An interesting thing to note about these 48C/96T SKUs is that they feature less cache compared to the previously leaked 48-core Xeon 8558U processor, which had 96 MB of L2 cache and 260 MB of L3 cache, making for a total of 356 MB of cache (which includes L1D and L1I as well). The segmentation that Intel is doing for its Xeon processors will be based not only on core count, frequency, and TDP but also on CPU cache sizes.

Uptake on AMD's latest generation mobile offerings has been slow and steady to put it mildly, but today TUXEDO Computers, a specialist in Linux notebooks at a range of performance and pricing tiers, has announced pre-orders for their new Sirius 16 gaming laptop. This machine combines AMD's latest generation Ryzen 7 7840HS "Phoenix" APU with a Radeon RX 7600M XT RDNA3 GPU inside a sleek all aluminium chassis design that strives to remain understated while still providing a "sleek gamer look" via programmable RGB keys. The Sirius 16 is TUXEDO's first go at an all-AMD configuration and they've held very little back, choosing to allow the full TDP rating of the Phoenix APU at 54 W sustained (or 80 W CPU-only turbo) as well as keeping the RDNA3 GPU at its rated 120 W TGP under full CPU+GPU loads. The Sirius 16 features venting out of both sides as well as the rear of the chassis, and roughly half of the bottom panel is open intake for the dual-fan cooling system.

Powering everything is a 230 W power brick and an 80 Wh replaceable battery bolted inside the chassis. TUXEDO claims up to 10 hours of battery life at minimum display brightness with wireless disabled and without any programmable lighting enabled, or a more realistic 6 hours at medium brightness with wireless enabled and under minimal "office work" load.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

SK hynix presented its leading AI and high-performance computing (HPC) solutions at Supercomputing 2023 (SC23) held in Denver, Colorado between November 12-17. Organized by the Association for Computing Machinery and IEEE Computer Society since 1988, the annual SC conference showcases the latest advancements in HPC, networking, storage, and data analysis. SK hynix marked its first appearance at the conference by introducing its groundbreaking memory solutions to the HPC community. During the six-day event, several SK hynix employees also made presentations revealing the impact of the company's memory solutions on AI and HPC.

Displaying Advanced HPC & AI Products
At SC23, SK hynix showcased its products tailored for AI and HPC to underline its leadership in the AI memory field. Among these next-generation products, HBM3E attracted attention as the HBM solution meets the industry's highest standards of speed, capacity, heat dissipation, and power efficiency. These capabilities make it particularly suitable for data-intensive AI server systems. HBM3E was presented alongside NVIDIA's H100, a high-performance GPU for AI that uses HBM3 for its memory.

V-COLOR Technology Inc. is proud to announce the launch of a new TUF Gaming Alliance Memory, available in both DDR5 XPrism and DDR4 Prism Pro series, showcasing a striking design and exceptional performance. This collaboration with the ASUS TUF Gaming Alliance ensures that components bearing this badge undergo testing that surpasses the industry's standard norms. This rigorous testing is implemented to ensure superior compatibility, stability, and durability, catering to the specific needs of gamers and PC enthusiasts globally.

The new memory kits are offered in configurations of 32 GB (2x 16 GB) with speeds ranging from 5600 MHz to 6400 MHz for DDR5, and 16 GB (2x 8 GB) to 32 GB (2x 16 GB) with speeds ranging from 3200 MHz to 3600 MHz for DDR4 memory. The memory modules are equipped with powerful SK Hynix chips. DDR5 memory is compatible with Intel XMP, and DDR4 is compatible with both INTEL and AMD platforms.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

In support of World Environment Day, Team Group released the C175 ECO Net-Zero Flash Drive previously, which received positive reception from consumers worldwide. To encourage action against environmental pollution, Team Group has continued to devote itself to the development and design of environmentally friendly products. Now Team Group is launching the industry's first memory module with a recycled aluminium heat sink: the T-FORCE VULCAN ECO DDR5 Desktop Overclocking Memory.

Team Group takes social responsibility seriously, promoting sustainability through green research and development. For every 10,000 recycled aluminium T-FORCE VULCAN ECO DDR5 heat sinks made, carbon emissions are reduced by 73% or about 1,665 kg of carbon emissions. That is equivalent to the carbon footprint of 550,000 hand towels, 310,000 plastic straws, 30,000 plastic bags, and 10,000 PET bottles. The T-FORCE VULCAN ECO DDR5 also uses FSC-certified eco-packaging for the entire product, further contributing to the reduction of material and electronic waste.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

In a major leap forward for high-performance computing, Venom Computers announced the launch of its newest model: the BlackBook Zero 14" Phantom G9. The Phantom G9 is the latest example of Venom's commitment to blending unmatched power with conscientious sustainability and is designed for Venom's exclusive users, who include discerning professionals and informed tech enthusiasts.

"The Zero 14 Phantom isn't just about leading-edge specs, though we're proud of those," said Jaan Turon, Director of Venom. "This new model also embodies our dedication to longevity and service in what we call the Venom Value Cycle: a sustainable ethos that benefits both customers and the environment."

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming Peripherals, and Enthusiast Memory solutions, is excited to launch the TOUGHRAM XG RGB D5 Memory DDR5 7600/8000 MT/s 32 GB (16 GB x2) available in black and white. The TOUGHRAM XG RGB D5 is a high-performance DDR5 RAM module that features a unique X-shaped light bar with 16 LEDs. To satisfy different speed demands, the TOUGHRAM XG RGB D5 series provides frequency options starting from 5600MT/s, and now has new higher frequency additions of up to 8000MT/s and can support the latest Intel 14th Gen.

The TOUGHRAM XG RGB D5 7600/8000 MT/s are made with superior components to achieve uncompromised speed. Built with tightly-screened ICs and a 10-layer PCB with 2oz copper inner layer, The TOUGHRAM XG RGB D5 can deliver outstanding response time performance and overclocking performance. The high-quality 10μ gold fingers on the ram provide high wear resistance to reinforce durability. Additionally, the TOUGHRAM XG RGB D5 Memory DDR5 is equipped with a doubled bank group architecture, increasing capacity without lag. To reach long-term stability, the DDR5 memory features a native Power Management IC (PMIC) to optimize power efficiency with merely 1.1 V low operating voltage. The TOUGHRAM XG RGB D5 7600/8000 MT/s include the on-die error correction code (ECC) can strengthen stability and reliability through its auto error correction.