AMD's newly announced Ryzen 8000G "Hawk Point" desktop APUs do not support ECC memory, contrary to what the specifications on the AMD website had initially shown, Reddit users found out. The company has since quietly edited its product pages to remove the bit about ECC support. For the overwhelming majority of desktop client use cases, including enthusiast PCs, ECC memory support is irrelevant. That said, the memory controllers of "Phoenix" in Ryzen PRO 7000 mobile processors for commercial notebooks support ECC memory, and so it stands to reason that upcoming Ryzen PRO models for both commercial desktops and notebooks might feature it.

The AMD Ryzen 7 8700G and Ryzen 5 8600G are based on the 4 nm "Hawk Point" monolithic silicon, with a more overclocker-friendly set of DDR5 memory controllers than the ones found in the Ryzen 7000 "Raphael" processors. Besides support for several high-frequency DDR5 modes, the memory controller technically supports ECC (at least "Phoenix" does, on the Ryzen PRO 7000 mobile processors). The memory controller also supports a maximum of 256 GB of memory, or 64 GB dual-rank memory modules per slot. It also supports 24 GB and 48 GB DIMM densities.

In 2024, the tech industry remains steadfastly focused on AI, with the continued rollout of advanced AI chips leading to significant enhancements in processing speeds. TrendForce posits that this advancement is set to drive growth in both DRAM and NAND Flash across various AI applications, including smartphones, servers, and notebooks. The server sector is expected to see the most significant growth, with content per box for server DRAM projected to rise by 17.3% annually, while enterprise SSDs are forecast to increase by 13.2%. The market penetration rate for AI smartphones and AI PCs is expected to experience noticeable growth in 2025 and is anticipated to further drive the average content per box upward.

Looking first at smartphones, despite chipmakers focusing on improving processing performance, the absence of new AI functionalities has somewhat constrained the impact of AI. Memory prices plummeted in 2023 due to oversupply, making lower-priced options attractive and leading to a 17.5% increase in average DRAM capacity and a 19.2% increase in NAND Flash capacity per smartphone. However, with no new applications expected in 2024, the growth rate in content per box for both DRAM and NAND Flash in smartphones is set to slow down, estimated at 14.1% and 9.3%, respectively.

SK Hynix has unveiled ambitious High Bandwidth Memory (HBM) roadmaps at SEMICON Korea 2024. Vice President Kim Chun-hwan announced plans to mass produce the cutting-edge HBM3E within the first half of 2024, touting 8-layer stack samples already supplied to clients. This iteration makes major strides towards fulfilling surging data bandwidth demands, offering 1.2 TB/s per stack and 7.2 TB/s in a 6-stack configuration. VP Kim Chun-hwan cites the rapid emergence of generative AI, forecasted for 35% CAGR, as a key driver. He warns that "fierce survival competition" lies ahead across the semiconductor industry amidst rising customer expectations. With limits approaching on conventional process node shrinks, attention is shifting to next-generation memory architectures and materials to unleash performance.

SK Hynix has already initiated HBM4 development for sampling in 2025 and mass production the following year. According to Micron, HBM4 will leverage a wider 2048-bit interface compared to previous HBM generations to increase per-stack theoretical peak memory bandwidth to over 1.5 TB/s. To achieve these high bandwidths while maintaining reasonable power consumption, HBM4 is targeting a data transfer rate of around 6 GT/s. The wider interface and 6 GT/s speeds allow HBM4 to push bandwidth boundaries significantly compared to prior HBM versions, fueling the need for high-performance computing and AI workloads. But power efficiency is carefully balanced by avoiding impractically high transfer rates. Additionally, Samsung is aligned on a similar 2025/2026 timeline. Beyond pushing bandwidth boundaries, custom HBM solutions will become increasingly crucial. Samsung executive Jaejune Kim reveals that over half its HBM volume already comprises specialized products. Further tailoring HBM4 to individual client needs through logic integration presents an opportunity to cement leadership. As AI workloads evolve at breakneck speeds, memory innovation must keep pace. With HBM3E prepping for launch and HBM4 in the plan, SK Hynix and Samsung are gearing up for the challenges ahead.

MSI released an intriguing AMI BIOS update on January 31 for their Intel 700 and 600 chipset mainboards—hardware tipster chi11eddog noticed this quiet announcement and proceeded to get his Z790 Carbon MAX WIFI motherboard running on beta version 7D89v1B1. This preliminary release enables "capacity support up to 256 GB" for DDR5 Memory—chi11eddog noted that you previously had to jump through several hoops to get this configuration in working order: "As per a friend in the industry, before this, it needs to disable Above 4G/Resizable BAR/remapping to support 256 GB on Intel systems. MSI has fixed this. No need to disable Above 4G/Resizable Bar."

His MSI Z790 test platform featured an Intel Core i9-14900K CPU and 256 GB (4 x 64 GB) DDR5-4800 of memory—Wccftech's reportage proposes some extra tests: "it would be interesting to see what the maximum speeds are supported when using high-capacity memory kits but for those who prefer capacity over speed, well the solutions are now out there." The Compression Attached Memory Module (CAMM) standard has been adopted by the laptop memory segment, and manufacturers are believed to be transferring technological innovations to desktop form factors. Upcoming 64 GB DDR5 modules offer twice the capacity over the best previous-gen solutions. The proliferation of non-binary DIMM kits—from 24 to 48 GB—in 2023 brought (total) desktop memory capacities to a maximum of 192 GB.

In addition to the 37 Gbps GDDR7 memory, Samsung Electronics prepares to showcase several other memory innovations at the 2024 IEEE-SSCC as compiled by VideoCardz. To begin with, the company is showcasing a new 280-layer 3D QLC NAND flash memory in the 1 Tb density, enabling next generation of mainstream SSDs and smartphone storage. This chip offers an areal density of 28.5 Gb/mm², and a speed of 3.2 GB/s. To put this into perspective, the fastest 3D NAND flash types powering the current crop of flagship NVMe SSDs rely on 2.4 GB/s of I/O data rates.

Next up, is a new generation DDR5 memory chip offers data rates of DDR5-8000 with a density of 32 Gbit (4 GB). This chip uses a symmetric-mosaic DRAM cell architecture, and is built on a 5th generation 10 nm class foundry node Samsung optimized for DRAM products. What's impressive about this chip is that it will allow PC memory vendors to build 32 GB and 48 GB DIMMs in single-rank configuration with DDR5-8000 speeds; as well as 64 GB and 96 GB DIMMs in dual-rank configuration (impressive, provided your platform can play well with DDR5-8000 in dual-rank).

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

During CES, PCWorld had a chat with Donny Woligroski, Technical Marketing Manager at AMD. The new Ryzen 8000G APUs were a large part of what covered in the almost 17 minute long video and PCWorld got some details that weren't covered in the official press materials that AMD released at the launch. The officially supported memory speed listed by AMD is DDR5-5600, which is a step up from the official speed of DDR5-5200 for the Ryzen 7000-series CPUs.

However, we know that the Ryzen 7000-series is more than happy to use faster memory and as before, AMD has an unofficial memory sweet spot and just as with the Ryzen 7000-series, the Ryzen 8000G-series of APUs has a memory sweet spot of DDR5-6000. That said, it's unknown if the Ryzen 8000G-series will support faster memory or will start flaking out above DDR5-6000, like many Ryzen 7000-series CPUs do unless you switch to a 1:2 ratio. Woligroski is also pointing out that dual-channel is a must to get the best performance out of the new APUs, although this shouldn't really surprise anyone. Full video after the break.

Worldwide semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner, Inc.

"While the cyclicality in the semiconductor industry was present again in 2023, the market suffered a difficult year with memory revenue recording one of its worst declines in history," said Alan Priestley, VP Analyst at Gartner. "The underperforming market also negatively impacted several semiconductor vendors. Only 9 of the top 25 semiconductor vendors posted revenue growth in 2023, with 10 experiencing double-digit declines."

The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

Last week, Doc TB acted as a spokesperson for an updated version of everyone's favorite lightweight open source memory testing tool: "We have released Memtest86+ v7! 🎉 Now with live RAM settings displayed (supported on Core 1st to 14th Gen & AMD Ryzen CPUs) and preliminary ECC support (supported on some Ryzen CPUs). Give it a try at memtest.org 👍." Version 6.0 of Memtest86+, issued back in 2022, was a complete overhaul (courtesy of dev. Martin Whitaker) that revived the irregularly updated FOSS tool's fortunes. Recent media coverage has presented a more optimistic view of Memtest86+ (not to be confused with Passmark's similarly titled app)—several articles propose that a consistent release of future updates is feasible. Version 7.0's changelog documents a good number of highlighted improvements, including: "IMC polling for live RAM settings, preliminary support for ECC polling (on a selection of Ryzen CPUs), added support for MMIO UART, debugging options, plus various bug fixes & optimizations."

NVM Express, Inc. today announced the release of the NVM Express (NVMe) Computational Storage Feature, which provides a standardized, vendor-neutral framework for connecting applications to NVMe Computational Storage devices across both compute and storage services. Computational Storage includes two new command sets: Computational Programs and Subsystem Local Memory Command Sets.

"NVM Express Computational Storage is part of our efforts to help enterprises and hyperscale data centers meet the ever-evolving demands of the storage industry," said Bill Martin, NVMe Computational Storage Task Group Co-Chair and Board Member. "Computational Storage is a standardized approach that enables an open, interoperable ecosystem. By offloading compute to the device, we anticipate that these industries will experience reduced total cost of ownership and overall performance boosts."

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Crucial, the client-focused brand of memory giant Micron Technology, showed off a handful new innovations at its booth along the sidelines of the 2024 International CES. First up, is a prototype USB4 portable SSD and prototype desktop SSD. These are proofs of concept, and not actual products. With this, Crucial is testing the waters with USB4 and its delicious 40 Gbps bidirectional bandwidth, which unlocks a new generation of fast removable storage devices. The prototype USB4 portable SSD comes in a tiny chassis about the size of a burner phone. It is a PCB with an M.2-2280 slot with PCIe Gen 4 x4 wiring, connected to an ASMedia ASM2464PD USB4 bridge chip. An OEM Micron Gen 4 SSD with 232-layer 3D TLC NAND flash and LPDDR4 DRAM cache, is installed on this drive. The CDM reading for this drive is 3821 MB/s sequential reads, with 885 MB/s sequential writes.

Next up, is a larger desktop SSD prototype (which again, isn't an actual product but a proof of concept). Its metal chassis is about the size of a 3.5-inch HDD. Inside is at least one M.2-2280 Gen 4 slot (there are probably more); with a preinstalled drive. An ASMedia ASM2464PD handles things here, too. The performance is mostly similar, at 3792 MB/s sequential reads, but with significantly increase 3803 MB/s sequential writes. This may seem unspectacular because Thunderbolt 4 has been delivering 40 Gbps for many years now, and we've had TB4-based external SSDs; but USB4 somewhat democratizes this kind of bandwidth.

TrendForce reports that the DRAM contract prices are estimated to increase by approximately 13-18% in 1Q24 with mobile DRAM leading the surge. It appears that due to the unclear demand outlook for the entire year of 2024, manufacturers believe that sustained production cuts are necessary to maintain the supply-demand balance in the memory industry.

PC DRAM: The market is buzzing with unfilled DDR5 orders, while savvy buyers brace for a continued surge in DDR4 prices, keeping procurement engines running. This trend, however, is shadowed by a gradual industry pivot toward DDR5, casting uncertainty over the expansion of DDR4 bit procurement volumes. Despite this, both DDR4 and DDR5 prices have yet to hit the target set by manufacturers, and buyers seem ready to ride the wave of price hikes into 1Q24. This sets the stage for an estimated 10-15% in PC DRAM contract prices, with DDR5 poised to take the lead over DDR4 in this pricing rally.

V-COLOR Technology Inc. is proud to unveil the Manta XFinity Series, our newest product tailored for PC enthusiasts and end users in pursuit of high performance. Engineered for extreme speeds and dependability, this series places a strong emphasis on facilitating high overclocking with straightforward compatibility and enhanced heat dissipation. The module has been tested on systems utilizing 14th generation CPUs, including the Gigabyte Z790 AORUS TACHYON X and ROG MAXIMUS Z790 APEX Motherboards. The XFinity Series has undergone extensive testing on motherboards from reliable manufacturers to guarantee smooth integration with a range of systems in configuration.

SK hynix Inc. announced today that it will showcase the technology for ultra-high performance memory products, the core of future AI infrastructure, at CES 2024, the most influential tech event in the world taking place from January 9 through 12 in Las Vegas. SK hynix said that it will highlight its future vision represented by its Memory Centric at the show and promote the importance of memory products accelerating the technological innovation in the AI era and its competitiveness in the global memory markets.

The company will run a space titled SK Wonderland jointly with other major SK Group affiliates including SK Inc., SK Innovation and SK Telecom, and showcase its major AI memory products including HBM3E. SK hynix plans to provide HBM3E, the world's best-performing memory product that it successfully developed in August, to the world's largest AI technology companies by starting mass production from the first half of 2024.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its state-of-the-art Gen 4 DDR5 Registering Clock Driver (RCD) which began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023. The Rambus Gen 4 RCD boosts the data rate to 7200 MT/s, setting a new benchmark for performance and enabling a 50% increase in memory bandwidth over today's 4800 MT/s DDR5 module solutions. It supports the rapid pace of server main memory performance improvements to meet the demands of generative AI and other advanced data center workloads.

"With memory being an essential enabler of server performance, the need for greater memory bandwidth continues its meteoric rise driven by demanding workloads like generative AI," said Sean Fan, chief operating officer at Rambus. "The Rambus Gen 4 DDR5 RCD is the latest demonstration of our commitment to providing leadership products ahead of the market need to support our customers' current and planned server platforms."

Micron Technology, Inc. (Nasdaq: MU) today announced results for its first quarter of fiscal 2024, which ended November 30, 2023.

Fiscal Q1 2024 highlights

• Revenue of $4.73 billion versus $4.01 billion for the prior quarter and $4.09 billion for the same period last year
• GAAP net loss of $1.23 billion, or $1.12 per diluted share
• Non-GAAP net loss of $1.05 billion, or $0.95 per diluted share
• Operating cash flow of $1.40 billion versus $249 million for the prior quarter and $943 million for the same period last year

"Micron's strong execution and pricing drove better-than-anticipated first quarter financial results," said Micron Technology President and CEO Sanjay Mehrotra. "We expect our business fundamentals to improve throughout 2024, with record industry TAM projected for calendar 2025. Our industry-leading High Bandwidth Memory for data center AI applications illustrates the strength of our technology and product roadmaps, and we are well positioned to capitalize on the immense opportunities artificial intelligence is fueling across end markets."

Apple has been experimenting with Large Language Models (LLMs) that power most of today's AI applications. The company wants these LLMs to serve the users best and deliver them efficiently, which is a difficult task as they require a lot of resources, including compute and memory. Traditionally, LLMs have required AI accelerators in combination with large DRAM capacity to store model weights. However, Apple has published a paper that aims to bring LLMs to devices with limited memory capacity. By storing LLMs on NAND flash memory (regular storage), the method involves constructing an inference cost model that harmonizes with the flash memory behavior, guiding optimization in two critical areas: reducing the volume of data transferred from flash and reading data in larger, more contiguous chunks. Instead of storing the model weights on DRAM, Apple wants to utilize flash memory to store weights and only pull them on-demand to DRAM once it is needed.

Two principal techniques are introduced within this flash memory-informed framework: "windowing" and "row-column bundling." These methods collectively enable running models up to twice the size of the available DRAM, with a 4-5x and 20-25x increase in inference speed compared to native loading approaches on CPU and GPU, respectively. Integrating sparsity awareness, context-adaptive loading, and a hardware-oriented design pave the way for practical inference of LLMs on devices with limited memory, such as SoCs with 8/16/32 GB of available DRAM. Especially with DRAM prices outweighing NAND Flash, setups such as smartphone configurations could easily store and inference LLMs with multi-billion parameters, even if the DRAM available isn't sufficient. For a more technical deep dive, read the paper on arXiv here.

Chinese company Sipeed has introduced the Lichee Pocket 4A, one of the first handheld gaming devices based on the RISC-V open-source instruction set architecture (ISA). Sipeed positions the device as a retro gaming platform capable of running simple titles via software rendering or GPU acceleration. At its core is Alibaba's T-Head TH1520 processor featuring four 2.50 GHz Xuantie C910 RISC-V general-purpose CPU cores and an unnamed Imagination GPU. The chip was originally aimed at laptop designs. Memory options include 8 GB or 16 GB LPDDR4X RAM and 32 GB or 128 GB of storage. The Lichee Pocket 4A has a 7-inch 1280x800 LCD touchscreen, Wi-Fi/Bluetooth connectivity, and an array of wired ports like USB and Ethernet. It weighs under 500 grams. The device can run Android or Linux distributions like Debian, Ubuntu, and others.

As an early RISC-V gaming entrant, performance expectations should be modest—the focus is retro gaming and small indie titles, not modern AAA games. Specific gaming capabilities remain to be fully tested. However, the release helps showcase RISC-V's potential for consumer electronics and competitive positioning against proprietary ISAs like ARM. Pricing is still undefined, but another Sipeed handheld console retails for around $250 currently. Reception from enthusiasts and developers will demonstrate whether there's a viable market for RISC-V gaming devices. Success could encourage additional hardware experimentation efforts across emerging open architectures. With a 6000 mAh battery, battery life should be decent. Other specifications can be seen in the table below, and the pre-order link is here.

TrendForce predicts a significant rise in mobile DRAM and NAND Flash (eMMC/UFS) prices for the first quarter of 2024, with an expected seasonal increase of 18-23%. This surge could be further amplified in a market dominated by a few major players or if brand clients resort to panic buying under pressure.

Observations for 1Q24 indicate steady production planning by Chinese smartphone OEMs. A clear rise in memory prices is driving buyers to actively increase their purchasing efforts as they aim to establish secure and competitively priced inventory levels.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, today is excited to unveil the all-new CRAS V RGB Brilliant White edition memory kit available in extreme high speed of DDR5-8200 & DDR5-8400 configurations. As a testament to the immense popularity and growing demand for the CRAS V RGB memory kits, KLEVV has responded by introducing the long-awaited Brilliant White edition to its flagship memory lineup as well as two high-speed options for consumers. This new addition boasts striking aesthetics by keeping the tone-on-tone design, and upholds the exceptional performance standards synonymous with the CRAS V RGB series, solidifying its position as the preferred choice among enthusiasts and professionals alike.

Meticulously engineered for high-speed operation, KLEVV's CRAS V RGB memory kits deliver outstanding performance with remarkable speed options of DDR5-8200 (featuring timings of 38-49-49-131) and DDR5-8400 (with timings of 40-52-52-134), all while operating efficiently at a voltage of 1.45 V. Below screenshot demonstrates the test result of DDR5-8400 kit using AIDA64 Cache & Memory Benchmark tool.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage and gaming peripherals, has announced the upcoming release of Viper Gaming's first-ever collaboration with ASUS' gaming division, TUF Gaming: The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series.

As a bold new take on the recently released Viper Elite 5 performance memory series, the Viper Elite 5 TUF Gaming Alliance RGB DDR5 series is certified by ASUS' TUF Gaming Alliance and features high-performance transfer speeds of up to 6,600MT/s, capacities of up to 48 GB and tuned overclock support for XMP 3.0 and AMD EXPO on select models. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series offers the latest in top-tier performance for gamers, tech enthusiasts and creatives alike. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series also features unique branding and design combining Viper Gaming and TUF Gaming alongside the Viper Elite 5's one-of-a-kind matte white heatshield with an RGB lightbar.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

SK hynix presented its leading AI and high-performance computing (HPC) solutions at Supercomputing 2023 (SC23) held in Denver, Colorado between November 12-17. Organized by the Association for Computing Machinery and IEEE Computer Society since 1988, the annual SC conference showcases the latest advancements in HPC, networking, storage, and data analysis. SK hynix marked its first appearance at the conference by introducing its groundbreaking memory solutions to the HPC community. During the six-day event, several SK hynix employees also made presentations revealing the impact of the company's memory solutions on AI and HPC.

Displaying Advanced HPC & AI Products
At SC23, SK hynix showcased its products tailored for AI and HPC to underline its leadership in the AI memory field. Among these next-generation products, HBM3E attracted attention as the HBM solution meets the industry's highest standards of speed, capacity, heat dissipation, and power efficiency. These capabilities make it particularly suitable for data-intensive AI server systems. HBM3E was presented alongside NVIDIA's H100, a high-performance GPU for AI that uses HBM3 for its memory.