AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

V-COLOR Technology Inc, a leading memory manufacturer is proud to present the revolutionary DDR5 OC R-DIMM Workstation Memory in configurations 16 GB, 32 GB, and 64 GB. Designed for use with the latest unlocked Intel Xeon W-2400X and W-3400X series processors on respective Intel W790 chipset-based motherboards supporting quad-channel and octo-channel memory

Extreme Overclocking: Experience unrivaled power with OC R-DIMM Workstation Memory. Engineered for extreme overclocking capabilities, this memory module dares to push the limits and achieve unparalleled speeds. With v-color technology, effortlessly unlock the full potential of workstations and conquer even the most demanding tasks. Intel XMP 3.0 Certified: Seamlessly compatible with Intel XMP 3.0, OC R-DIMM Workstation Memory ensures a hassle-free and optimized experience. Effortlessly enhance system's performance and achieve the perfect balance between speed and stability.

Micron Technology, Inc., (Nasdaq: MU) today announced volume production availability of high-capacity 96 GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory. By unlocking the next level of monolithic technology, the integration of Micron's high-density memory solutions empowers artificial intelligence (AI) and in-memory database workloads and eliminates the need for costly die stacking that also adds latency. Micron's 96 GB DDR5 RDIMM modules are qualified with 4th Gen AMD EPYC processors. Additionally, the Supermicro 8125GS - an AMD-based system - includes the Micron 96 GB DDR5 modules and is an excellent platform for high-performance computing, artificial intelligence and deep learning training, and industrial server workloads.

"Delivering high-capacity memory solutions that enable the right performance for compute-intensive workloads is essential to Micron's role as a leading memory innovator and manufacturer. Micron's 96 GB DDR5 DRAM module establishes a new optimized total cost of ownership solution for our customers," stated Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "Our collaboration with a flexible system provider like Supermicro leverages each of our strengths to provide customers with the latest memory technology to address their most challenging data center needs."
"Supermicro's time-to-market collaboration with Micron benefits a wide variety of key customers," said Don Clegg, senior vice president, Worldwide Sales, Supermicro. "Micron's portfolio of advanced memory and storage products, aligned with Supermicro's broad server and storage innovations deliver validated, tested, and proven solutions for data center deployments and advanced workloads."

Transcend brought its latest flash storage and PC memory products to Computex 2023. The company, much like Kingston and Micron, appears to be focusing on the high-volume mid-range of the market that it can sell both in the retail channel and to OEMs, without too much invested on niche high-end ones. To begin with, the company showed us its DDR5 UDIMMs and RDIMMs. Nothing flashy—these stick with JEDEC-standard speeds, such as DDR5-5600 (13th Gen native speed), and DDR5-4800.

The company doesn't have PCIe Gen 5 SSDs yet, but we were shown a handful Gen 4 ones meant for the DIY retail channel, including the PCIe SSD 250H (MTE250H), with its sporty heatsink, and extensive testing for PlayStation 5 compatibility; and its alter-ego without the heatsink, the PCIe SSD 250S (MTE250S). These drives come in capacities ranging between 1 TB to 4 TB, with sequential transfer speeds of up to 7.5 GB/s reads, and up to 6.7 GB/s writes. Also shown were a set of smaller NVMe Gen 3 SSDs in the M.2-2230 and M.2-2260 form-factors, the MTE300S and MTE400S, respectively. With capacities of just 256 GB and 512 GB for the MTE300S, and 256 GB thru 1 TB for the MTE400S, these drives are probably meant for hand-held game consoles, or low-cost desktop PCs, where OEMs or SIs buy them in large quantities.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its 64 GB DDR4 very low profile registered DIMMS (VLP RDIMMs) built for embedded blade compute and storage, industrial single-board computers, enterprise networking, and Internet of Things (IoT) systems processing memory-intensive workloads. The new product offers twice the density of typical 32 GB VLP RDIMMs available in the market to meet the increasing memory requirements resulting from the endless generation of data from connected cars, smart factories, and other 5G IoT applications.

The high-performance 64 GB VLP RDIMMs are organized as 8192 MB x 72 bits in a 288-pin DIMM. Each module utilizes 18 chips of 8Gx4 DDR4 SDRAMs in dual-die package (DDP) stacked chips, consists of a 512-byte serial EEPROM containing the module information, and includes error correction code (ECC) to support error detection and correction.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.

AMD and JEDEC are collaborating to create a new industry standard for DDR5 memory called MRDIMMs (multi-ranked buffered DIMMs). The constant need for bandwidth in server systems provides trouble that can not easily be solved. Adding more memory is difficult, as motherboards can only get so big. Incorporating on-package memory solutions like HBM is expensive and can only scale to a specific memory capacity. However, engineers of JEDEC, with the help of AMD, have come to make a new standard that will try and solve this challenge using the new MRDIMM technology. The concept of MRDIMM is, on paper, straightforward. It combines two DDR5 DIMMs on a single module to effectively double the bandwidth. Specifically, if you take two DDR5 DIMMs running at 4,400 MT/s and connect them to create a single DIMM, you get 8,800 MT/s speeds on a single module. To efficiently use it, a special data mux or buffer will effectively take two Double Data Rate (DDR) DIMMs and convert them into Quad Data Rate (QDR) DIMMs.

The design also allows simultaneous access to both ranks of memory, thanks to the added mux. First-generation MRDIMMs can produce speeds of up to 8,800 MT/s, while the second and third generations modules can go to 12,800 MT/s and 17,600 MT/s, respectively. We expect third-generation MRDIMMs after 2030, so the project is still far away. Additionally, Intel has a similar solution called Multiplexer Combined Ranks DIMM (MCRDIMM) which uses a similar approach. However, Intel's technology is expected to see the light of the day as early as 2024/2025 and beyond the generation of servers, with Granite Rapids likely representing a contender for this technology. SK Hynix already makes MCRDIMMs, and you can see the demonstration of the approach below.

Kingston today unveiled the FURY Renegade Pro DDR5 RDIMM memory for workstations based on the Intel W790 platform (Xeon W-3400 and W-2400 series "Sapphire Rapids" processors). The company is marking these as "overclockable" registered ECC DIMMs, as they come with Intel XMP 3.0 profiles that enable their advertised speeds on Intel platforms. The FURY Renegade Pro series comes in DDR5-6000 (32-38-38 1.35 V), DDR5-5600 (36-38-38 1.25 V), and DDR5-4800 (36-38-38 1.1 V) speed; with module densities of 16 GB and 32 GB (per DIMM); making up single-module kits, 4-module kits (for W-2400 platforms), and 8-module kits (for W-3400 platforms). The modules themselves are bare—lacking in heatspreaders, with a thin decal covering the DRAM chips. These are standard-height DIMMs.

ASUS today announced that ASUS W790 workstation motherboards support ECC R-DIMM DDR5 RAM at up to 6800 MHz, unleashing class-leading overclocking capability to unlock even more performance potential. ASUS W790 workstation motherboards feature the memory capability of up to 2 TB RDIMM DDR5 memory to power the next generation of compute-intensive professional workloads. In addition, ASUS have been working with market-leading memory partners including G.SKILL, Kingston, and V-Color to establish multiple memory validations and to widely support 8-channel and quad-channel memory architectures. The Pro WS W790E-SAGE SE now supports up to 128 GB (8x16 GB) at 6800 MT/s, and the Pro WS W790-ACE supports up to 64 GB (4x16 GB) of DDR5 RAM at 6800 MT/s. This painstakingly cultivated collection of device validations helps ensure that an ASUS W790 workstation build supports a wide variety of scenarios.

Choosing the right CPU cooler for a workstation build can also be a challenge, because CPU sockets and form factors are different from those used in desktops. Therefore, ASUS has partnered with cooling experts including Enermax, EK and Noctua to offer air and liquid coolers for the LGA4677 socket used by the latest Intel Xeon workstation processors. These solutions are designed to offer optimal heat transfer and heat dissipation capacity through the cooler base and then to coolant tubes, heat pipes and radiator fins.

Intel today announced the new Intel Xeon W-3400 and Intel Xeon W-2400 desktop workstation processors (code-named Sapphire Rapids), led by the Intel Xeon w9-3495X, Intel's most powerful desktop workstation processor ever designed. Built for professional creators, these new Xeon processors provide massive performance for media and entertainment, engineering and data science professionals. With a breakthrough new compute architecture, faster cores and new embedded multi-die interconnect bridge (EMIB) packaging, the Xeon W-3400 and Xeon W-2400 series of processors enable unprecedented scalability for increased performance.

"For more than 20 years, Intel has been committed to delivering the highest quality workstation platforms - combining high-performance compute and rock-solid stability - for professional PC users across the globe. Our new Intel Xeon desktop workstation platform is uniquely designed to unleash the innovation and creativity of professional creators, artists, engineers, designers, data scientists and power users - built to tackle both today's most demanding workloads as well as the professional workloads of the future." -Roger Chandler, Intel vice president and general manager, Creator and Workstation Solutions, Client Computing Group

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers. With a 33% increase in data rate and bandwidth over Gen 1 4800 MT/s solutions, the Rambus Gen 3 6400 MT/s DDR5 RCD enables a new level of main memory performance for data center servers. Delivering industry-leading latency and power, it offers optimized timing parameters for improved RDIMM margins.

"Data center workloads have an insatiable thirst for greater memory bandwidth and capacity, and our mission is to advance the performance of server memory solutions that meet this need for each new server platform generation," said Sean Fan, chief operating officer at Rambus. "We were first in the industry to 5600 MT/s, and now we have raised the bar with our Gen 3 DDR5 RCD capable of 6400 MT/s to support a new generation of RDIMMs for server main memory."

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x 16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz enhances high end performance for advanced inspection equipment and improves efficiency.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing the industry-leading Rambus Registering Clock Driver (RCD). DDR5 achieves greater memory bandwidth and capacity by employing a new module architecture with an expanded chipset. The SPD Hub and Temperature Sensors improve DDR5 Dual Inline Memory Module (DIMM) system management and thermal control to deliver higher performance within the desired power envelope for servers, desktops and laptops.

"The new performance levels of DDR5 memory place an increased premium on signal integrity and thermal management for server and client DIMMs," said Sean Fan, chief operating officer at Rambus. "With over 30 years of memory subsystem design experience, Rambus is ideally positioned to deliver DDR5 chipset solutions which enable breakthrough bandwidth and capacity for advanced computing systems."

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the IMB760, a server-grade extended ATX motherboard (330 mm x 305 mm) powered by the dual LGA4189 socket 3rd Gen Intel Xeon scalable processors (code name: Ice Lake-SP) with the Intel C627A chipset. It comes with an effective load balancing between two CPUs and multiple accelerator cards to stabilize computation loads and maximize computing power. Featuring optimized performance, more PCI Express Card slots, and high-density memory expansion, this EATX server motherboard enables high level computing, AI workload and deep learning for the data-fueled future.

"Performance, security, and flexibility are indispensable for AI in next-gen computing. As the first and flagship EATX motherboard of Axiomtek, the IMB760 features built-in AI and crypto acceleration functions as well as advanced security capabilities to meet the specific needs of automated manufacturing, robotics, image or video analytics, and other AIoT applications. This server-grade motherboard has sixteen DDR4-3200 RDIMM sockets with a memory capacity of up to 1 TB. Ready for the demands of massive data storage and high-speed data transmission, the industrial motherboard supports two NVMe SSD, one IPMI LAN, and two 10GbE LAN ports. Rich expansions with enough PCIe x16 slots and PCIe x8 slots for GPU acceleration, making IM760 a perfect solution for computationally intensive imaging, intelligent video analytics, and heavy workload processing," said Wayne Chung, the product manager of AIoT Team at Axiomtek.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products, announces its new SMART Kestral PCIe Optane Memory Add-in-Card (AIC), which is able to add up to 2 TB of Optane Memory expansion on a PCIe-Gen4-x16 or PCIe-Gen3-x16 interface independent of the motherboard CPU. SMART's Kestral AICs accelerate selected algorithms by offloading software-defined storage functions from the host CPU to the Intel FPGA on the AIC. SMART's Kestral memory AICs are ideal for hyperscale, data center, and other similar environments that run large memory applications, and would benefit from memory acceleration or system acceleration through computational storage.

"With the advancement of new interconnect standards such as CXL and OpenCAPI, SMART's new family of SMART Kestral AICs addresses the industry's need for a variety of new memory module form factors and interfaces for memory expansion and acceleration," stated Mike Rubino, SMART Modular's vice president of engineering. "SMART is able to leverage our many years of experience in developing and productizing controller-based memory solutions to meet today's emerging and continually evolving memory add-on needs of server and storage system customers."

SMART Modular Technologies, Inc., a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new DDR5 32 GB Very Low Profile Registered Dual In-Line Memory Module (VLP RDIMM). SMART's new DuraMemory DDR5 32 GB VLP RDIMM is the industry's first DDR5 VLP RDIMM form factor.

The 32 GB VLP RDIMM addresses applications with space constraints, such as embedded 1U blade compute and storage, enterprise networking, telecom, and industrial single-board computers (SBCs). The space savings also equates to improved heat dissipation and energy savings, reducing business costs. The DDR5 32 GB VLP RDIMM is the newest addition to SMART's broad portfolio of VLP and ULP (Ultra Low Profile) modules that are suitable for all types of dense computing, storage, networking and telecom applications. For ruggedized and harsh operating conditions, SMART also offers retention clips to secure the socket latches in place, and industrial grade temperature operation of -40°C to +85°C.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

Micron Technology, Inc., today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

Today's news builds on Micron's January announcement of DDR5 RDIMM samples and brings the industry one step closer to unlocking the value in next-generation, data-centric applications. Companies joining Micron in the DDR5 Technology Enablement Program include Cadence, Montage, Rambus, Renesas and Synopsys.

Today, AMD announced the new AMD Ryzen Threadripper PRO Processor line-up, with up to 64 cores and unrivaled bandwidth built with enterprise-grade AMD PRO technologies. Designed for professional workstations from OEMs and system integrators, AMD Ryzen Threadripper PRO Processors uniquely offer full spectrum compute capabilities with unmatched core counts for multi-threaded workloads plus high frequency single core performance for lightly threaded workloads. This combination makes AMD Ryzen Threadripper PRO Processors the best choice for artists, architects, engineers and data scientists.

"AMD Ryzen Threadripper PRO Processors are purpose-built to set the new industry standard for professional workstation compute performance," said Saeid Moshkelani, senior vice president and general manager, AMD Client business unit. "The extreme performance, high core counts and bandwidth of AMD Ryzen Threadripper Processors are now available with AMD PRO technology features including seamless manageability and unique built-in data protection. Even the most demanding professional environment is addressed with the new AMD Ryzen Threadripper PRO line-up, from artists and creators developing breathtaking visual effects, to architects and engineers working with large datasets and complex visualizations, all brought to life on the most advanced professional workstation platform in the world.

Videocardz seems to have snagged some official AMD slides detailing their upcoming Threadripper PRO lineup. AMD is tiering its Threadripper CPU offerings between the Threadripper and Threadripper PRO via added functionality that AMD considers is better suited to the prospective buyers of a PRO-branded Threadripper: professional studios, designers, engineers and data scientists. AMD's positioning for these creatives or scientists is to offer a much improved platform throughput compared to Threadripper: the PRO version supports up to 128 PCIe 4.0 lanes (64 in non-PRO); up to 2 TB of ECC memory support (either in UDIMM (Unbuffered DIMM), RDIMM (Registered DIMM), LRDIMM (Load-Reduced DIMM) and 3DS (three-dimensional stacking) RDIMM vi an 8-channel configuration (4-channel in non-PRO); as well as professional-oriented tools and features such as Pro Security, Pro manageability, and PRO business ready support.

Four different CPUs will reportedly be offered in the Threadripper PRO lineup: the 64-core 3995WX is a relatively known quantity by now; likewise, the 3975WX will mirror consumer parts core counts (32 cores), both with reduced clocks by 100-200 MHz compared to their non-PRO counterparts. AMD seems to also be launching 12 and 16-core PRO Threadrippers in the form of the 3955WX (16-core) and 3945WX (12-core), both with boost clocks being set to 4.3 GHz.