Thursday, June 2nd 2016

Streacom Announces the DB4 Chassis

Streacom introduces the DB4, its most ambitious fanless case to date, featuring a bisymmetrical design that is uniquely bold and blurs the lines between technology and art. With the DB4 we set out to not only redefine what a PC case could look like, but the performance and compatibility achievable from a fanless solution. Every element of this case subtly screams premium, from the 13mm thick extruded aluminium side panels to the precision CNC'd internal frame, all perfectly blended together with our characteristically understated design tone.

The identical sides of the case serve both as the striking monolithic exterior and the convection surface (or heat sink) for component cooling and is the basis of its fanless operation. The challenge was to create an efficient heat sink that didn't look industrial, one that would actually be integral to the sleek exterior, and the result speaks for itself. Each side can handle 65W of heat dissipation and can be coupled to provide 120W of total CPU cooling.
Beyond simply looking impressive, the DB4 solves one of the biggest complexities of building a fanless case. Traditionally motherboard choice is limited and alternative heat pipes might be required depending on layout, but the DB4 rewrites the rules. With both the motherboard and side panels being parallel, the heat pipes run perpendicular, away from any components and in combination with the flexibility of the universal bracket, means that virtually all ITX motherboard are compatible with the case.

Our existing CPU mount has also been re-engineered to be adjustable and universally compatible with any socket. It now features a copper shim interface between the IHC and heat pipes which creates a more efficient all copper thermal path to the heat sink, greatly improving cooling performance. To make assembly easier, all the side panels are removable, as is the motherboard tray, leaving an open frame with plenty of accessibility.

Building on the innovation of our F12C, components are fitted using a universal bracket system that supports, drives, heat sink mounts and the ZF240, allowing components to be mounted anywhere along the frame of the case, delivering a truly modular and flexible layout.

The DB4 measures 260 x 260 x 270mm but still manages to accommodate an ITX motherboard, a dual slot full height PCI card (max 200mm), up to 5 x 3.5" or 12 x 2.5" drives (lots of combinations in between), and can be powered by our Nano or ZeroFlex PSU solutions.

Full specifications are on the DB4 product page.
Add your own comment

5 Comments on Streacom Announces the DB4 Chassis

#2
Caring1
55b.jpg is upside down.
The whole design is very poorly thought out.
Externally it looks fine, but having the motherboard mounted vertically means the heatpipes are horizontal, not the optimal design for heat that rises.
Posted on Reply
#3
5DVX0130
Already announced at 2013 Computex. After that it disappeared without a trace.

Who knows… maybe it will be announced again in 2019?
Posted on Reply
#4
Dammeron
Caring1 said:
Externally it looks fine, but having the motherboard mounted vertically means the heatpipes are horizontal, not the optimal design for heat that rises.
Like that matters in any way. Heatpipes work cause of the fluid inside constantly evaporating and liquifying back again, transfering the heat through the whole pipe. Whether it works horizontally, or vertically, both are just fine.
Posted on Reply
#5
Caring1
Dammeron said:
Like that matters in any way. Heatpipes work cause of the fluid inside constantly evaporating and liquifying back again, transfering the heat through the whole pipe. Whether it works horizontally, or vertically, both are just fine.
In your opinion.
Just as I am allowed mine.
Posted on Reply