G.Skill International Enterprise, a leading provider of high performance memory, is launching a new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "π" series heat spreader design increases the air contact surface 100% more than traditional design. Under high voltage, G.Skill claims that "π" can lower the module temperature at least 20% to 30% more than other memory cooling systems. G.Skill's "π" series heat spreader will be implemented with a whole new "HZ" series of dual-channel kits ranging from DDR2-800 to DDR3-1600. These modules will be available through G.Skill's authorized resellers and distributors worldwide.Lower Temperature = Lower Power Consumption
All users are pursuing higher system performance. Memory frequency is one of the key factors. According to the theory, higher memory frequency takes higher power consumption as the higher Vdimm needed. G.Skill "π" series heat spreader design takes more heat out from the memory IC surface. It can lower the temperature at least 20% to 30% more than the traditional design.



Without Heat Spreader



With G.Skill "π" Series Heat Spreader

G.Skill "π" series product list