Toshiba Corporation today announced the launch of 32GB embedded NAND flash memory modules that offer the largest density yet announced plus full compliance with the e-MMC(1) and eSD(2) standards. The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. Samples will be available in September 2008, and mass production will start in the fourth quarter.The new 32GB embedded devices combine eight 32Gbit (=4GB) NAND chips fabricated with Toshiba's cutting-edge 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA Ver 4.3 and SDA Ver 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association and SD Card Association, respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.

Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NAND(3) memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1GB to 32GB, supports application in a very wide range of products.

There is growing demand for memories with a controller function that minimizes development requirements and eases integration into system designs. Toshiba has already taken steps to secure leadership in this expanding market, and the addition of higher density modules will reinforce the company's position.

(1) e-MMC is a trademark of the MultiMediaCard Association
(2) eSD is a trademark of SD Association
(3) LBA-NAND is a trademark of Toshiba Corporation

Specifications:

e-MMC



eSD