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AMD Ryzen 9 7900X3D

12
Cores
24
Threads
120 W
TDP
4.4 GHz
Frequency
5.6 GHz
Boost
Raphael
Codename
Socket AM5
Socket
Front
Front
Back
Back
Delidded
Delidded
Package
Package
Connectivity
Connectivity
AMD Socket AM5
AMD Socket AM5
The AMD Ryzen 9 7900X3D is a desktop processor with 12 cores, launched in January 2023, at an MSRP of $599. It is part of the Ryzen 9 lineup, using the Zen 4 (Raphael) architecture with Socket AM5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 24 threads. Ryzen 9 7900X3D has 128 MB of L3 cache and operates at 4.4 GHz by default, but can boost up to 5.6 GHz, depending on the workload. AMD is building the Ryzen 9 7900X3D on a 5 nm production process using 17,840 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. You may freely adjust the unlocked multiplier on Ryzen 9 7900X3D, which simplifies overclocking greatly, as you can easily dial in any overclocking frequency.
With a TDP of 120 W, the Ryzen 9 7900X3D consumes a lot of power, so good cooling is definitely needed. AMD's processor supports DDR5 memory with a dual-channel interface. The highest officially supported memory speed is 5200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, Ryzen 9 7900X3D uses a PCI-Express Gen 5 connection. This processor features the Radeon Graphics integrated graphics solution.
Hardware virtualization is available on the Ryzen 9 7900X3D, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket AM5
Foundry: TSMC
Process Size: 5 nm
Transistors: 17,840 million
Die Size: 2x 71 mm²
I/O Process Size:6 nm
I/O Die Size:122 mm²
Package: FC-LGA1718
tCaseMax: 47°C
tJMax: 89°C

Processor

Market: Desktop
Production Status: Active
Release Date: Jan 4th, 2023
Retail Availability:Feb 28th, 2023
Launch Price: $599
Part#: 100-000000909
Bundled Cooler: None

Performance

Frequency: 4.4 GHz
Turbo Clock: up to 5.6 GHz
Base Clock: 100 MHz
Multiplier: 44.0x
Multiplier Unlocked: Yes
TDP: 120 W
PPT:162 W

Architecture

Codename: Raphael
Generation: Ryzen 9
(Zen 4 (Raphael))
Memory Support: DDR5
Rated Speed: 5200 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 5, 24 Lanes
(CPU only)
Chipsets: X670E, X670, B650E, B650, A620

Core Config

# of Cores: 12
# of Threads: 24
SMP # CPUs: 1
Integrated Graphics: Radeon Graphics

Cache

Cache L1: 64 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 128 MB (shared)
3D V-Cache:1x 64MB Slice

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost 2
  • XFR 2

Notes

Radeon graphics dynamic frequency: 400-2200MHz

Level 3 cache arranged as 2x 32MB 2D cache plus 1x 64MB 3D V-Cache.

ECC modes require motherboard support.
Dec 7th, 2024 17:17 CST change timezone

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