The AMD Ryzen AI 9 HX 370 is a mobile processor with 12 cores, launched in July 2024. It is part of the Ryzen AI lineup, using the Zen 5 architecture with Socket FP8. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 24 threads. Ryzen AI 9 HX 370 has 16 MB of L3 cache and operates at 2000 MHz by default, but can boost up to 5.1 GHz, depending on the workload. AMD is building the Ryzen AI 9 HX 370 on a 4 nm production process, the transistor count is unknown. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen AI 9 HX 370, which limits its overclocking capabilities.
With a TDP of 28 W, the Ryzen AI 9 HX 370 consumes only little energy. AMD's processor supports DDR5 and LPDDR5X memory with a dual-channel interface. The highest officially supported memory speed is 5600 MT/s. For communication with other components in the system, Ryzen AI 9 HX 370 uses a PCI-Express Gen 4 connection. This processor features the Radeon 890M integrated graphics solution.
Hardware virtualization is available on the Ryzen AI 9 HX 370, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too. This processor is equipped with a Neural Processing Unit (NPU) that comes with a performance rating of up to 50 TOPS.