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- Apr 16, 2010
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System Name | LenovoⓇ ThinkPad™ T430 |
---|---|
Processor | IntelⓇ Core™ i5-3210M processor (2 cores, 2.50GHz, 3MB cache), Intel Turbo Boost™ 2.0 (3.10GHz), HT™ |
Motherboard | Lenovo 2344 (Mobile Intel QM77 Express Chipset) |
Cooling | Single-pipe heatsink + Delta fan |
Memory | 2x 8GB KingstonⓇ HyperX™ Impact 2133MHz DDR3L SO-DIMM |
Video Card(s) | Intel HD Graphics™ 4000 (GPU clk: 1100MHz, vRAM clk: 1066MHz) |
Storage | SamsungⓇ 860 EVO mSATA (250GB) + 850 EVO (500GB) SATA |
Display(s) | 14.0" (355mm) HD (1366x768) color, anti-glare, LED backlight, 200 nits, 16:9 aspect ratio, 300:1 co |
Case | ThinkPad Roll Cage (one-piece magnesium frame) |
Audio Device(s) | HD Audio, RealtekⓇ ALC3202 codec, DolbyⓇ Advanced Audio™ v2 / stereo speakers, 1W x 2 |
Power Supply | ThinkPad 65W AC Adapter + ThinkPad Battery 70++ (9-cell) |
Mouse | TrackPointⓇ pointing device + UltraNav™, wide touchpad below keyboard + ThinkLight™ |
Keyboard | 6-row, 84-key, ThinkVantage button, spill-resistant, multimedia Fn keys, LED backlight (PT Layout) |
Software | MicrosoftⓇ WindowsⓇ 10 x86-64 (22H2) |
I've recently bought an ASRock FM2A75 Pro4 motherboard, except I haven't found the time to assemble the parts yet. So I was checking the board out, when I noticed that there seems to be glue residue along the edges where the back-plate makes contact with the motherboard.
It has been a good while since I've last assembled an AMD system (in fact, this is my first FM2 assembly, even though I know that the system is the same since AM2) and the last few used the stock cooler, so I didn't even notice this sort of thing.
Now I'm reluctant to use my SD963 in this board...until the warranty period isn't over anyway. And even then. I don't want those SMDs on the back of the board to jump off...
My question is, is it glue, or some sort of replacement for dampening foam?
EDIT: Upon further inspection and better analysis, it seems to be a plastic-based residue that is there to make sure the metal back-plate doesn't come in contact with the board, avoiding shorts...meh. Got scared for a second there. Still, is it sticky (meaning I have to twitch it a bit to take it off), or does it lack adherence?
It has been a good while since I've last assembled an AMD system (in fact, this is my first FM2 assembly, even though I know that the system is the same since AM2) and the last few used the stock cooler, so I didn't even notice this sort of thing.
Now I'm reluctant to use my SD963 in this board...until the warranty period isn't over anyway. And even then. I don't want those SMDs on the back of the board to jump off...
My question is, is it glue, or some sort of replacement for dampening foam?
EDIT: Upon further inspection and better analysis, it seems to be a plastic-based residue that is there to make sure the metal back-plate doesn't come in contact with the board, avoiding shorts...meh. Got scared for a second there. Still, is it sticky (meaning I have to twitch it a bit to take it off), or does it lack adherence?
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