• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

AMD Ryzen 3000 "Zen 2" BIOS Analysis Reveals New Options for Overclocking & Tweaking

btarunr

Editor & Senior Moderator
Staff member
Joined
Oct 9, 2007
Messages
46,274 (7.69/day)
Location
Hyderabad, India
System Name RBMK-1000
Processor AMD Ryzen 7 5700G
Motherboard ASUS ROG Strix B450-E Gaming
Cooling DeepCool Gammax L240 V2
Memory 2x 8GB G.Skill Sniper X
Video Card(s) Palit GeForce RTX 2080 SUPER GameRock
Storage Western Digital Black NVMe 512GB
Display(s) BenQ 1440p 60 Hz 27-inch
Case Corsair Carbide 100R
Audio Device(s) ASUS SupremeFX S1220A
Power Supply Cooler Master MWE Gold 650W
Mouse ASUS ROG Strix Impact
Keyboard Gamdias Hermes E2
Software Windows 11 Pro
AMD will launch its 3rd generation Ryzen 3000 Socket AM4 desktop processors in 2019, with a product unveiling expected mid-year, likely on the sidelines of Computex 2019. AMD is keeping its promise of making these chips backwards compatible with existing Socket AM4 motherboards. To that effect, motherboard vendors such as ASUS and MSI began rolling out BIOS updates with AGESA-Combo 0.0.7.x microcode, which adds initial support for the platform to run and validate engineering samples of the upcoming "Zen 2" chips.

At CES 2019, AMD unveiled more technical details and a prototype of a 3rd generation Ryzen socket AM4 processor. The company confirmed that it will implement a multi-chip module (MCM) design even for their mainstream-desktop processor, in which it will use one or two 7 nm "Zen 2" CPU core chiplets, which talk to a 14 nm I/O controller die over Infinity Fabric. The two biggest components of the IO die are the PCI-Express root complex, and the all-important dual-channel DDR4 memory controller. We bring you never before reported details of this memory controller.


AMD has two big reasons to take the MCM route for even its mainstream desktop platform. The first is that it lets them mix-and-match silicon production technologies. AMD bean-counters reckon that it's more economical to build only those components on a shrunk 7 nanometer production process, which can benefit from the shrink; namely the CPU cores. Other components like the memory controller can continue to be built on existing 14 nm technologies, which by now are highly mature (= cost-efficient). AMD is also competing with other companies for its share of 7 nanometer allocation at TSMC.

The 14 nm I/O controller die could, in theory, be sourced from GlobalFoundries to honor the wafer-supply agreement. The second big reason is the economics of downscaling. AMD is expected to increase CPU core counts beyond 8 and cramming 12-16 cores on a single 7 nm slab will make carving out cheaper SKUs by disabling cores costly, because AMD isn't always harvesting dies with faulty cores. These mid-range SKUs sell in higher volumes, and beyond a point AMD is forced to disable perfectly functional cores. It makes more sense to build 8-core or 6-core chiplets, and on SKUs with 8 cores or fewer, physically deploy only one chiplet. This way AMD is maximizing its utilization of precious 7 nm wafers.



The downside of this approach is the memory controller is no longer physically integrated with the processor cores. The 3rd generation Ryzen processor (and all other Zen 2 CPUs), hence have an "integrated-discrete" memory controller. The memory controller is physically located inside the processor, but is not on the same piece of silicon as the CPU cores. AMD isn't the first to come up with such a contraption. Intel's 1st generation Core "Clarkdale" processor took a similar route, with CPU cores on a 32 nm die, and the memory controller plus an integrated GPU on a separate 45 nm die.

Intel used its Quick Path Interconnect (QPI), which was cutting-edge at the time. AMD is tapping into Infinity Fabric, its latest high-bandwidth scalable interconnect that's heavily implemented on "Zen" and "Vega" product lines. We have learned that with "Matisse," AMD will be introducing a new version of Infinity Fabric that offers twice the bandwidth compared to the first generation, or up to 100 GB/s. AMD needs this because a single I/O controller die must now interface with up to two 8-core CPU dies, and up to 64 cores in their "EPYC" server line SKU.

Our resident Ryzen Memory Guru Yuri "1usmus" Bubliy took a really close look at one of these BIOS updates with AGESA 0.0.7.x and found several new controls and options that will be exclusive to "Matisse," and possibly the next-generation Ryzen Threadripper processors. AMD has changed the CBS section title from "Zen Common Options" to "Valhalla Common Options." We have seen this codename on the web quite a bit over the past few days, associated with "Zen 2." We have learned that "Valhalla" could be the codename of the platform consisting of a 3rd generation Ryzen "Matisse" AM4 processor and its companion AMD 500-series chipset based motherboard, specifically the successor to X470 which is being developed in-house by AMD as opposed to sourcing from ASMedia.

When doing serious memory overclocking, it can happen that the Infinity Fabric can't handle the increased memory speed. Remember, Infinity Fabric runs at a frequency synchronized to memory. For example, with DDR-3200 memory (which runs at 1600 MHz), Infinity Fabric will operate at 1600 MHz. This is the default of Zen, Zen+ and also Zen 2. Unlike earlier generations, the new BIOS offers UCLK options for "Auto", "UCLK==MEMCLK" and "UCLK==MEMCLK/2". The last option is new and will come in handy when overclocking your memory, to achieve stability, but at the cost of some Infinity Fabric bandwidth.

Precision Boost Overdrive will receive more fine-grained control at the BIOS level, and AMD is making significant changes to this feature to make the boost setting more flexible and improve the algorithm. Early adopters of AGESA Combo 0.0.7.x on AMD 400-series chipset motherboards noticed that PBO broke or became buggy on their machines. This is because of poor integration of the new PBO algorithm with the existing one compatible with "Pinnacle Ridge." AMD also implemented "Core Watchdog", a feature that resets the system in case address or data errors destabilize the machine.

The "Matisse" processor will also provide users with finer control over active cores. Since the AM4 package has two 8-core chiplets, you will have the option to disable an entire chiplet, or adjust the core-count in decrements of 2, since each 8-core chiplet consists of two 4-core CCX (compute complexes), much like existing AMD designs. At the chiplet-level you can dial down core counts from 4+4 to 3+3, 2+2, and 1+1, but never asymmetrically, such as 4+0 (which was possible on first-generation Zen). AMD is synchronizing CCX core counts for optimal utilization of L3 cache and memory access. For the 64-core Threadripper that has eight 8-core chiplets, you will be able to disable chiplets as long as you have at least two chiplets enabled.

CAKE, or "coherent AMD socket extender" received an additional setting, namely "CAKE CRC performance Bounds". AMD is implementing IFOP (Infinity Fabric On Package,) or the non-socketed version of IF, in three places on the "Matisse" MCM. The I/O controller die has 100 GB/s IFOP links to each of the two 8-core chiplets, and another 100 GB/s IFOP link connects the two chiplets to each other. For multi-socket implementations of "Zen 2," AMD will provide NUMA node controls, namely "NUMA nodes per socket," with options including "NPS0", "NPS1", "NPS2", "NPS4" and "Auto".

With "Zen 2," AMD is introducing a couple of major new DCT-level features. The first one is called "DRAM Map Inversion," with options including "Disabled", "Enabled" and "Auto". The motherboard vendor description of this option goes like "Properly utilize the parallelism within a channel and DRAM device. Bits that flip more frequently should be used to map resources of greater parallelism within the system." Another is "DRAM Post Package Repair," with options including "Enabled", "Disabled", and "Auto." This new special mode (which is a JEDEC standard) lets the memory manufacturer increase DRAM yields by selectively disabling bad memory cells, to replace them automatically with working ones from a spare area, similar to how storage devices map out bad sectors. We're not sure why such a feature is being exposed to end-users, especially from the client-segment. Perhaps it will be removed on production motherboards.

We've also come across an interesting option related to the I/O controller that lets you select PCI-Express generation up to "Gen 4.0". This could indicate some existing 400-series chipset motherboards could receive PCI-Express Gen 4.0, given that we're examining a 400-series chipset motherboard's firmware. We've heard through credible sources that AMD's PCIe Gen 4.0 implementation involves the use of external re-driver devices on the motherboard. These don't come cheap. Texas Instruments sells Gen 3.0 redrivers for $1.5 a piece in 1,000-unit reel quantities. Motherboard vendors will have to fork out quite at least $15-20 on socket AM4 motherboards with Gen 4.0 slots, given that you need 20 of these redrivers, one per lane. We've come across several other common controls, including "RCD Parity" and "Memory MBIST" (a new memory self-test program).

One of the firmware setup program pages is titled "SoC Miscellaneous Control," and includes the following settings, many of which are industry-standard:
  • DRAM Address Command Parity Retry
  • Max Parity Error Replay
  • Write CRC Enable
  • DRAM Write CRC Enable and Retry Limit
  • Max Write CRC Error Replay
  • Disable Memory Error Injection
  • DRAM UECC Retry
  • ACPI Settings:
    o ACPI SRAT L3 Cache As NUMA Domain
    o ACPI SLIT Distance Control
    o ACPI SLIT remote relative distance
    o ACPI SLIT virtual distance
    o ACPI SLIT same socket distance
    o ACPI SLIT remote socket distance
    o ACPI SLIT local SLink distance
    o ACPI SLIT remote SLink distance
    o ACPI SLIT local inter-SLink distance
    o ACPI SLIT remote inter-SLink distance
  • CLDO_VDDP Control
  • Efficiency Mode
  • Package Power Limit Control
  • DF C-states
  • Fixed SOC P-state
  • CPPC
  • 4-link xGMI max speed
  • 3-link xGMI max speed

All in all, AMD Ryzen "Matisse" promises to give advanced and enthusiast users a treasure-chest of tuning options. Thanks again to Yuri "1usmus" Bubliy, who contributed significantly to this article.

View at TechPowerUp Main Site
 
Joined
Feb 3, 2017
Messages
3,475 (1.33/day)
Processor R5 5600X
Motherboard ASUS ROG STRIX B550-I GAMING
Cooling Alpenföhn Black Ridge
Memory 2*16GB DDR4-2666 VLP @3800
Video Card(s) EVGA Geforce RTX 3080 XC3
Storage 1TB Samsung 970 Pro, 2TB Intel 660p
Display(s) ASUS PG279Q, Eizo EV2736W
Case Dan Cases A4-SFX
Power Supply Corsair SF600
Mouse Corsair Ironclaw Wireless RGB
Keyboard Corsair K60
VR HMD HTC Vive
Unlike earlier generations, the new BIOS offers UCLK options for "Auto", "UCLK==MEMCLK" and "UCLK==MEMCLK/2". The last option is new and will come in handy when overclocking your memory, to achieve stability, but at the cost of some Infinity Fabric bandwidth.
So, this is not exactly untied from memory clock as AMD said previously. IF clock is still tied to MEMCLK but they added the divider to handle higher memory clocks.
 
Joined
Aug 6, 2017
Messages
7,412 (3.05/day)
Location
Poland
System Name Purple rain
Processor 10.5 thousand 4.2G 1.1v
Motherboard Zee 490 Aorus Elite
Cooling Noctua D15S
Memory 16GB 4133 CL16-16-16-31 Viper Steel
Video Card(s) RTX 2070 Super Gaming X Trio
Storage SU900 128,8200Pro 1TB,850 Pro 512+256+256,860 Evo 500,XPG950 480, Skyhawk 2TB
Display(s) Acer XB241YU+Dell S2716DG
Case P600S Silent w. Alpenfohn wing boost 3 ARGBT+ fans
Audio Device(s) K612 Pro w. FiiO E10k DAC,W830BT wireless
Power Supply Superflower Leadex Gold 850W
Mouse G903 lightspeed+powerplay,G403 wireless + Steelseries DeX + Roccat rest
Keyboard HyperX Alloy SilverSpeed (w.HyperX wrist rest),Razer Deathstalker
Software Windows 10
Benchmark Scores A LOT
Mainstream threadripper
 
Joined
Feb 3, 2017
Messages
3,475 (1.33/day)
Processor R5 5600X
Motherboard ASUS ROG STRIX B550-I GAMING
Cooling Alpenföhn Black Ridge
Memory 2*16GB DDR4-2666 VLP @3800
Video Card(s) EVGA Geforce RTX 3080 XC3
Storage 1TB Samsung 970 Pro, 2TB Intel 660p
Display(s) ASUS PG279Q, Eizo EV2736W
Case Dan Cases A4-SFX
Power Supply Corsair SF600
Mouse Corsair Ironclaw Wireless RGB
Keyboard Corsair K60
VR HMD HTC Vive
Joined
Apr 12, 2013
Messages
6,728 (1.68/day)
Speculation more than anything else, AMD haven't disclosed much about Ryzen 3xxx anywhere let alone such technical details.
 
Joined
Feb 28, 2015
Messages
45 (0.01/day)
If they add DRAM Post Package Repair for consumers I will be interested, sometimes you can get faulty sticks on second hand market cheap if for example from 16gb stick you get workingh 15gb is still win
 
Joined
Feb 19, 2019
Messages
324 (0.17/day)

Attachments

  • AsusPrimeX470Pro4602bios.JPG
    AsusPrimeX470Pro4602bios.JPG
    66.3 KB · Views: 514
  • AsusPrimeX470Pro.jpg
    AsusPrimeX470Pro.jpg
    44.5 KB · Views: 1,227

phill

Moderator
Staff member
Joined
Jun 8, 2011
Messages
15,861 (3.39/day)
Location
Somerset, UK
System Name Not so complete or overkill - There are others!! Just no room to put! :D
Processor Ryzen Threadripper 3970X
Motherboard Asus Zenith 2 Extreme Alpha
Cooling Lots!! Dual GTX 560 rads with D5 pumps for each rad. One rad for each component
Memory Viper Steel 4 x 16GB DDR4 3600MHz not sure on the timings... Probably still at 2667!! :(
Video Card(s) Asus Strix 3090 with front and rear active full cover water blocks
Storage I'm bound to forget something here - 250GB OS, 2 x 1TB NVME, 2 x 1TB SSD, 4TB SSD, 2 x 8TB HD etc...
Display(s) 3 x Dell 27" S2721DGFA @ 7680 x 1440P @ 144Hz or 165Hz - working on it!!
Case The big Thermaltake that looks like a Case Mods
Audio Device(s) Onboard
Power Supply EVGA 1600W T2
Mouse Corsair thingy
Keyboard Razer something or other....
VR HMD No headset yet
Software Windows 11 OS... Not a fan!!
Benchmark Scores I've actually never benched it!! Too busy with WCG and FAH and not gaming! :( :( Not OC'd it!! :(
Really looking forward to seeing these new AMD CPUs come out..
 
Joined
Feb 29, 2016
Messages
12 (0.00/day)
The connection between the CPU-Dies must be a AM4-only thing then, because it makes no sense on EPYC?
 
Joined
Mar 20, 2019
Messages
412 (0.22/day)
Location
Australia
System Name Ryzen
Processor AMD Ryzen 7 5700X
Motherboard Asus TUF Gaming B550-Plus (Wi-Fi)
Cooling Cryorig H7
Memory Kingston Fury Beast DDR4 3200MHz 2x8GB + 2x16GB
Video Card(s) Sapphire NITRO+ Radeon RX 6700 XT GAMING OC
Storage WD_Black SN850 500GB NVMe SSD + Adata XPG SX8200 Pro 512GB NVMe SSD
Display(s) Gigabyte G27QC
Case NZXT H510 Flow
Audio Device(s) SteelSeries Arctis Prime
Power Supply Corsair RM650x Gold 650W
Mouse Logitech G502 Hero
Keyboard HyperX Alloy FPS Cherry MX Blue
Software Windows 11 Pro
I'm looking forward to these chips very much. I have a 2600 on a B450 board currently, so hopefully the rumors are true and the next "midrange" 3600 (or whatever it will be called) is an 8 core chip. 6 -> 8 cores for hopefully around about the same price is a very nice upgrade and improvement in my book.
 

TheLostSwede

News Editor
Joined
Nov 11, 2004
Messages
15,996 (2.26/day)
Location
Sweden
System Name Overlord Mk MLI
Processor AMD Ryzen 7 7800X3D
Motherboard Gigabyte X670E Aorus Master
Cooling Noctua NH-D15 SE with offsets
Memory 32GB Team T-Create Expert DDR5 6000 MHz @ CL30-34-34-68
Video Card(s) Gainward GeForce RTX 4080 Phantom GS
Storage 1TB Solidigm P44 Pro, 2 TB Corsair MP600 Pro, 2TB Kingston KC3000
Display(s) Acer XV272K LVbmiipruzx 4K@160Hz
Case Fractal Design Torrent Compact
Audio Device(s) Corsair Virtuoso SE
Power Supply be quiet! Pure Power 12 M 850 W
Mouse Logitech G502 Lightspeed
Keyboard Corsair K70 Max
Software Windows 10 Pro
Benchmark Scores https://valid.x86.fr/5za05v
The re-drivers aren't needed for the first x16 slot, as it's close enough to the CPU socket. However, they would be needed for all other slots to operate at PCIe 4.0 speeds.
 
Joined
Feb 17, 2010
Messages
1,475 (0.29/day)
Location
Azalea City
System Name Main
Processor Ryzen 5950x
Motherboard B550 PG Velocita
Cooling Water
Memory Ballistix
Video Card(s) RX 6900XT
Storage T-FORCE CARDEA A440 PRO
Display(s) Samsung UE590
Case QUBE 500
Audio Device(s) Logitech Z623
Power Supply LEADEX V 1KW
Mouse Cooler Master MM710
Keyboard Huntsman Elite
Software 11 Pro
Benchmark Scores https://hwbot.org/user/damric/
These look like a lot of fun to tune. Can't wait.
 
Joined
Sep 27, 2017
Messages
42 (0.02/day)
System Name Fedora
Processor 5800X3D
Motherboard X370
Memory 32GB
Video Card(s) RX 6800
I think they might have changed the chiplets placement on die since CES 2019 by looking how EPYC 3000 Embedded looks :

AMD-EPYC-Embedded-3000-Series-Overview.jpg
conga-B7E3_rep_web.png


https://www.congatec.com/en/products/com-express-type7/conga-b7e3.html

They even list there 12 and 16 core models but no 6 core :
AMD EPYC™ Embedded 3000 Model 3451 (16 x 2.1 GHz, 32MB L3 cache, 100W)
AMD EPYC™ Embedded 3000 Model 3401 (16 x 1.85 GHz, 32MB L3 cache, 85W)
AMD EPYC™ Embedded 3000 Model 3351 (12 x 1.90 GHz, 32MB L3 cache, 80W) (12 x 2.0 GHz, 32MB L3 cache, 65W)
AMD EPYC™ Embedded 3000 Model 3255 (8 x 2.5 GHz, 32MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3251 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3201 (8 x 1.5 GHz, 16MB L3 cache, 30W)
AMD EPYC™ Embedded 3000 Model 3151 (4 x 2.7 GHz, 16MB L3 cache, 45W)
AMD EPYC™ Embedded 3000 Model 3101 (4 x 2.1 GHz, 8MB L3 cache, 35W)

Probably the I/O die got smaller so the 2 chiplets can be placed top and bottom of it
 
Last edited:
Joined
Nov 24, 2017
Messages
853 (0.37/day)
Location
Asia
Processor Intel Core i5 4590
Motherboard Gigabyte Z97x Gaming 3
Cooling Intel Stock Cooler
Memory 8GiB(2x4GiB) DDR3-1600 [800MHz]
Video Card(s) XFX RX 560D 4GiB
Storage Transcend SSD370S 128GB; Toshiba DT01ACA100 1TB HDD
Display(s) Samsung S20D300 20" 768p TN
Case Cooler Master MasterBox E501L
Audio Device(s) Realtek ALC1150
Power Supply Corsair VS450
Mouse A4Tech N-70FX
Software Windows 10 Pro
Benchmark Scores BaseMark GPU : 250 Point in HD 4600
Joined
Oct 10, 2009
Messages
786 (0.15/day)
Location
Madrid, Spain
System Name Rectangulote
Processor Core I9-9900KF
Motherboard Asus TUF Z390M
Cooling Alphacool Eisbaer Aurora 280 + Eisblock RTX 3090 RE + 2 x 240 ST30
Memory 32 GB DDR4 3600mhz CL16 Crucial Ballistix
Video Card(s) KFA2 RTX 3090 SG
Storage WD Blue 3D 2TB + 2 x WD Black SN750 1TB
Display(s) 2 x Asus ROG Swift PG278QR / Samsung Q60R
Case Corsair 5000D Airflow
Audio Device(s) Evga Nu Audio + Sennheiser HD599SE + Trust GTX 258
Power Supply Corsair RMX850
Mouse Razer Naga Wireless Pro / Logitech MX Master
Keyboard Keychron K4 / Dierya DK61 Pro
Software Windows 11 Pro
The 3255 it's quite sexy for a laptop. And mine needs an upgrade.
 
Joined
Feb 19, 2009
Messages
1,151 (0.21/day)
Location
I live in Norway
Processor R9 5800x3d | R7 3900X | 4800H | 2x Xeon gold 6142
Motherboard Asrock X570M | AB350M Pro 4 | Asus Tuf A15
Cooling Air | Air | duh laptop
Memory 64gb G.skill SniperX @3600 CL16 | 128gb | 32GB | 192gb
Video Card(s) RTX 4080 |Quadro P5000 | RTX2060M
Storage Many drives
Display(s) M32Q,AOC 27" 144hz something.
Case Jonsbo D41
Power Supply Corsair RM850x
Mouse g502 Lightspeed
Keyboard G913 tkl
Software win11, proxmox
Benchmark Scores 33000FS, 16300 TS. Lappy, 7000 TS.
EPYC Embedde 3000 is based on Zen architecture, not Zen2.
All Zen/Zen+ have single die.

I think it'd still be a dualdie for the 16 core ?
 
Joined
Nov 24, 2017
Messages
853 (0.37/day)
Location
Asia
Processor Intel Core i5 4590
Motherboard Gigabyte Z97x Gaming 3
Cooling Intel Stock Cooler
Memory 8GiB(2x4GiB) DDR3-1600 [800MHz]
Video Card(s) XFX RX 560D 4GiB
Storage Transcend SSD370S 128GB; Toshiba DT01ACA100 1TB HDD
Display(s) Samsung S20D300 20" 768p TN
Case Cooler Master MasterBox E501L
Audio Device(s) Realtek ALC1150
Power Supply Corsair VS450
Mouse A4Tech N-70FX
Software Windows 10 Pro
Benchmark Scores BaseMark GPU : 250 Point in HD 4600
I think it'd still be a dualdie for the 16 core ?
When I replied the comment, the comment has only single die 8 core ones.
Yes.
EPYC Embedded 3000 comes 8 core with single die, and 16 with two die.
 
Joined
Mar 23, 2005
Messages
4,054 (0.58/day)
Location
Ancient Greece, Acropolis (Time Lord)
System Name RiseZEN Gaming PC
Processor AMD Ryzen 7 5800X @ Auto
Motherboard Asus ROG Strix X570-E Gaming ATX Motherboard
Cooling Corsair H115i Elite Capellix AIO, 280mm Radiator, Dual RGB 140mm ML Series PWM Fans
Memory G.Skill TridentZ 64GB (4 x 16GB) DDR4 3200
Video Card(s) ASUS DUAL RX 6700 XT DUAL-RX6700XT-12G
Storage Corsair Force MP500 480GB M.2 & MP510 480GB M.2 - 2 x WD_BLACK 1TB SN850X NVMe 1TB
Display(s) ASUS ROG Strix 34” XG349C 180Hz 1440p + Asus ROG 27" MG278Q 144Hz WQHD 1440p
Case Corsair Obsidian Series 450D Gaming Case
Audio Device(s) SteelSeries 5Hv2 w/ Sound Blaster Z SE
Power Supply Corsair RM750x Power Supply
Mouse Razer Death-Adder + Viper 8K HZ Ambidextrous Gaming Mouse - Ergonomic Left Hand Edition
Keyboard Logitech G910 Orion Spectrum RGB Gaming Keyboard
Software Windows 11 Pro - 64-Bit Edition
Benchmark Scores I'm the Doctor, Doctor Who. The Definition of Gaming is PC Gaming...
There's one thing I read about a couple weeks ago about AMDs use of Infinity Fabric 2. The author claimed reliable sources close to AMD said that Infinity Fabric 2 may have a fixed speed (A very high speed) and not tied to the Integrated Memory Controller Speed. Or something of that nature.

He further explained that AMD may take this approach to help eliminate most or all latency issues found in ZEN and ZEN+. This was based on ZEN2 engineering sample testing. So it seems AMD isn't testing out various methods to determine what works best. I assume.

Speculation of course, but that's what I read. If I can locate that link I'll share it.
 
Joined
Jul 20, 2018
Messages
125 (0.06/day)
System Name Multiple desktop/server builds
Processor Desktops: 13900K, 5800X3D, 12900K | Servers: 2 x 3900X, 2 x 5950X, 3950X, 2950X, 8700K
Motherboard Z690 Apex, X570 Aorus Xtreme, Z690-I Strix
Cooling All watercooled
Memory DDR5-6400C32, DDR4-3600C14, DDR5-6000C36
Video Card(s) 4090 Gaming OC, 4090 TUF OC, 2 x 3090, 2 x 2080Ti, 1080Ti Gaming X EK, 2 x 1070, 2 x 1060
Storage dozens of TBs of SSDs, 112TB NAS, 140TB NAS
Display(s) Odyssey Neo G9, PG35VQ, P75QX-H1
Case Caselabs S8, Enthoo Elite, Meshlicious, Cerberus X, Cerberus, 2 x Velka 7, MM U2-UFO, Define C
Audio Device(s) Schiit Modius + SMSL SP200, Grace DAC + Drop THX AAA, Sony HT-A9, Nakamichi 9.2.4
Power Supply AX1200, Dark Power Pro 12 1500W
Mouse G Pro X Superlight Black + White
Keyboard Wooting 60HE, Moonlander
VR HMD Index, Oculus CV1
I think they might have changed the chiplets placement on die since CES 2019 by looking how EPYC 3000 Embedded looks :

View attachment 119289View attachment 119290

https://www.congatec.com/en/products/com-express-type7/conga-b7e3.html

They even list there 12 and 16 core models but no 6 core :
AMD EPYC™ Embedded 3000 Model 3451 (16 x 2.1 GHz, 32MB L3 cache, 100W)
AMD EPYC™ Embedded 3000 Model 3401 (16 x 1.85 GHz, 32MB L3 cache, 85W)
AMD EPYC™ Embedded 3000 Model 3351 (12 x 1.90 GHz, 32MB L3 cache, 80W) (12 x 2.0 GHz, 32MB L3 cache, 65W)
AMD EPYC™ Embedded 3000 Model 3255 (8 x 2.5 GHz, 32MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3251 (8 x 2.5 GHz, 16MB L3 cache, 55W)
AMD EPYC™ Embedded 3000 Model 3201 (8 x 1.5 GHz, 16MB L3 cache, 30W)
AMD EPYC™ Embedded 3000 Model 3151 (4 x 2.7 GHz, 16MB L3 cache, 45W)
AMD EPYC™ Embedded 3000 Model 3101 (4 x 2.1 GHz, 8MB L3 cache, 35W)

Probably the I/O die got smaller so the 2 chiplets can be placed top and bottom of it

Epyc embedded 3000 is 14nm 1st gen Zen and was released over a year ago. These are just Ryzen 1000 series dies that have all 32 pci-e lanes working. The 12 and 16 core models are just like current threadrippers with 2 active dies, except epyc 3000 has no dummy dies on the package. The 3000 has nothing to do with what gen the product is. 1st gen Epyc is already Epyc 7000.
 
Last edited:
Joined
Jun 2, 2017
Messages
7,785 (3.13/day)
System Name Best AMD Computer
Processor AMD 7900X3D
Motherboard Asus X670E E Strix
Cooling In Win SR36
Memory GSKILL DDR5 32GB 5200 30
Video Card(s) Sapphire Pulse 7900XT (Watercooled)
Storage Corsair MP 700, Seagate 530 2Tb, Adata SX8200 2TBx2, Kingston 2 TBx2, Micron 8 TB, WD AN 1500
Display(s) GIGABYTE FV43U
Case Corsair 7000D Airflow
Audio Device(s) Corsair Void Pro, Logitch Z523 5.1
Power Supply Deepcool 1000M
Mouse Logitech g7 gaming mouse
Keyboard Logitech G510
Software Windows 11 Pro 64 Steam. GOG, Uplay, Origin
Benchmark Scores Firestrike: 46183 Time Spy: 25121
There's one thing I read about a couple weeks ago about AMDs use of Infinity Fabric 2. The author claimed reliable sources close to AMD said that Infinity Fabric 2 may have a fixed speed (A very high speed) and not tied to the Integrated Memory Controller Speed. Or something of that nature.

He further explained that AMD may take this approach to help eliminate most or all latency issues found in ZEN and ZEN+. This was based on ZEN2 engineering sample testing. So it seems AMD isn't testing out various methods to determine what works best. I assume.

Speculation of course, but that's what I read. If I can locate that link I'll share it.

If that is true it could make the 2990WX's successor the fastest TR4 CPU.
 
Joined
Aug 6, 2017
Messages
7,412 (3.05/day)
Location
Poland
System Name Purple rain
Processor 10.5 thousand 4.2G 1.1v
Motherboard Zee 490 Aorus Elite
Cooling Noctua D15S
Memory 16GB 4133 CL16-16-16-31 Viper Steel
Video Card(s) RTX 2070 Super Gaming X Trio
Storage SU900 128,8200Pro 1TB,850 Pro 512+256+256,860 Evo 500,XPG950 480, Skyhawk 2TB
Display(s) Acer XB241YU+Dell S2716DG
Case P600S Silent w. Alpenfohn wing boost 3 ARGBT+ fans
Audio Device(s) K612 Pro w. FiiO E10k DAC,W830BT wireless
Power Supply Superflower Leadex Gold 850W
Mouse G903 lightspeed+powerplay,G403 wireless + Steelseries DeX + Roccat rest
Keyboard HyperX Alloy SilverSpeed (w.HyperX wrist rest),Razer Deathstalker
Software Windows 10
Benchmark Scores A LOT
Doesn’t sound like it’ll do well for gaming :/ more glue and more latency bottleneck
will depend on IF speed and latency,wouldn't write it off just yet.
 
Top