Yeah that's why I decided to ditch the pea sized method and try the two lines this time.
As for the case ventilation, mine has a mesh front, three NF-A14 case fans and soon a NH-D15 cooler with two 140mm fans on it, and I clean dust filters and the insides of my case regularly. I'm not at all...
I realize, I just don't like doing it. Should've mentioned to not suggest spreading in the original post.
I've been recommended to just place two lines, one over the CCX dies and one over the I/O chip, to get maximum pressure directly over the area where heat is produced. This seems good to me...
I've decided to go with putting 5 dots of MX-4, one in the middle and 4 around it but not too close to the edges. Now hopefully I won't have to spin my cooler 360 degrees in order to take it off the next time I need to.
I'm still up to discussion.
My 3900X arrives next week and I've been hearing from multiple people that the classic "pea-sized dot" method in the middle no longer applies to 3rd gen Ryzens?
Looking at the dies, to me, it looks like it shouldn't matter:
Do I just apply a little bit large pea-sized dot than on my...