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Intel Issues PCN to Improve NUC Cooling

btarunr

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Intel issued a product change notification (PCN), marked 112432-00, which attempts to improve the reliability of the system under heavy wireless network stress. A design flaw in Intel's reference NUC boxes equipped with wireless LAN and Thunderbolt came to light late last year, when a reviewer at TechReport discovered that when under stress, the mPCIe WLAN card can overheat, causing the neighboring mSATA SSD to malfunction. In its latest PCN, Intel included a 9.5 mm-thick flexible thermal pad on the top panel, which draws heat from the SSD, and conducts it to the chassis.



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why not a single, silent, slow 120mm fan? or a fan that would fit, if that is too large. that would fix a lot of problems...
 
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Another day, another product defect from Intel. No wonder their sales continue to drop.
 

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Another day, another product defect from Intel. No wonder their sales continue to drop.

Even if that product is completely wiped out Intel's sales will barely register a blip. When you introduce new products teething problems are bound to happen, especially with miniaturisation.
 
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why not a single, silent, slow 120mm fan? or a fan that would fit, if that is too large. that would fix a lot of problems...

Nobody wants a failure-prone fan if the NUC is destined to be a "Media Center" type hub. Passive cooling > active cooling for these purposes.
 
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wonder if they have had any mSATA SSD failures because of this? or does malfunction mean the mSATA SSD failed.
 
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If I were to get one of these I would not want a fan if it could be cooled passive. Although a slightly bigger passive body I would not mind.
 
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Nobody wants a failure-prone fan if the NUC is destined to be a "Media Center" type hub. Passive cooling > active cooling for these purposes.

What are you talking about? The reference design already uses a fan.
 
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So, rather than directly address the heat output from the WLAN card, Intel decided to drain the heat from the mSATA SSD that was being cooked. Nice.... :shadedshu
 
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