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AMD Griffin pixelated

Darksaber

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Intel has been creating waves with the new Centrino Pro/Duo plattform (although they dropped the "plattform" part) and AMD is trying to stay in the news. They have now shown off the upcoming Griffin CPU at the Microprocessor Forum 2007. The CPU itself is about as big as a compact flash card. I will come in combination with the RS780 Chipset, which features up to 14 USB 2.0 port & 6 SATA ports. Intel's Robson (or Turbo Memory) will be taken on by AMD's Hypermemory offering. There will be support for HDMI and DisplayPort as well. All this should be available in mid 2008.


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WarEagleAU

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AMD might finally have something to compete with Intel on in mobile power savings and processing power.
 
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"In combination with the RS780 chipset", so, does that mean it's on-board, or are they still testing that? 'Cos I remember reading about them having made a preliminary CPU+GPU, so integrating a chipset wouldn't be much harder I guess.
If it's on board, that'd explain the small chip, bottom left corner, and it would definately beat Intel in features at the very least (and possibly power consumption, when taking the additional chip into account). Chipset, memory controller, and CPU in one, Intel eat yer heart out.
 
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"In combination with the RS780 chipset", so, does that mean it's on-board, or are they still testing that? 'Cos I remember reading about them having made a preliminary CPU+GPU, so integrating a chipset wouldn't be much harder I guess.
If it's on board, that'd explain the small chip, bottom left corner, and it would definately beat Intel in features at the very least (and possibly power consumption, when taking the additional chip into account). Chipset, memory controller, and CPU in one, Intel eat yer heart out.

Um not quite man... and it wouldn't explain that small chip. AMD likes to integrate everything into the same die. i.e. the big center thing.

I think we have at least another year before an all-in-one package is made.
 
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wouldn't explain that small chip. AMD likes to integrate everything into the same die.

Yeah, it makes more sense to integrate, in terms of cutting wafers used, and in turn cuting costs, but I was thinking that if they had it out of the main die for the CPU, they could avoid heat troubles, although then again, the heat would spread through HSF, and would probably accumulate anyhow, leading to heat problems, so... badly thought out on my part.

And:
http://arstechnica.com/news.ars/post/20061119-8250.html
Seems that's not really AMD's plan anyhow, they want GPU only, integrated into the CPU. Northbridge will still be seperate.
I think that's how AMD will want to do it. I don't think the diagram is specific for AMD, though I skimmed a bit (read it a while back already too, but forgot some details).
 
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