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Researchers at Stanford University have shown in a recent demonstration that it might be possible to mass-produce chips only three atoms thick.
http://news.stanford.edu/2016/11/29/stanford-engineers-create-prototype-chip-just-three-atoms-thick/
The kind of thin materials that could be made with these chips would be transparent and flexible.
This would enable electronic devices that are not possible to make with silicon, like transparent television, completely bendy phones or electronic displays on glass doors.
Single-atom thick materials were discovered in 2004 when graphene, a single atomic layer of carbon atoms bound in a hexagonal network, was invented.
Since then, scientists have been developing ways to use other similar materials in practical ways.
The researchers started by taking a single layer of another material called molybdenum disulphide.
Previous research had shown molybdenum disulphide made a good switch that could control electricity, which is essential in the function of a computer chip.
The difficulty came when manufacturing a molybdenum disulphide crystal big enough to form a chip.
That required building a crystal roughly the size of a thumbnail, 25 times wider than it is thick, using a process called chemical vapour deposition.
The atoms are incinerated then deposited as an ultra-thin crystalline layer on a 'handle' substrate, which can be glass or silicon.
During chip manufacturing, circuits must be etched into the material.
To demonstrate how a large-scale, single-layer chip manufacturing process might perform this step in the future, the team used standard etching tools to cut the Stanford logo into their prototype.
http://news.stanford.edu/2016/11/29/stanford-engineers-create-prototype-chip-just-three-atoms-thick/
The kind of thin materials that could be made with these chips would be transparent and flexible.
This would enable electronic devices that are not possible to make with silicon, like transparent television, completely bendy phones or electronic displays on glass doors.
Single-atom thick materials were discovered in 2004 when graphene, a single atomic layer of carbon atoms bound in a hexagonal network, was invented.
Since then, scientists have been developing ways to use other similar materials in practical ways.
The researchers started by taking a single layer of another material called molybdenum disulphide.
Previous research had shown molybdenum disulphide made a good switch that could control electricity, which is essential in the function of a computer chip.
The difficulty came when manufacturing a molybdenum disulphide crystal big enough to form a chip.
That required building a crystal roughly the size of a thumbnail, 25 times wider than it is thick, using a process called chemical vapour deposition.
The atoms are incinerated then deposited as an ultra-thin crystalline layer on a 'handle' substrate, which can be glass or silicon.
During chip manufacturing, circuits must be etched into the material.
To demonstrate how a large-scale, single-layer chip manufacturing process might perform this step in the future, the team used standard etching tools to cut the Stanford logo into their prototype.
