HellasVagabond
New Member
- Joined
- Jan 19, 2007
- Messages
- 3,376 (0.50/day)
- Location
- Athens , GREECE
| System Name | SECONDARY RIG / PRIMARY RIG / THIRD RIG |
|---|---|
| Processor | i920@3.6GHz / i920@4GHz / AMD Phenom II 955 |
| Motherboard | Gigabyte EX58-UD4P / Gigabyte EX58-UD7 / ASRock 890GX3 |
| Cooling | CoolIT Domino ALC / Thermalright Silver Arrow / Thermalright VenomousX |
| Memory | 12GB DDR3 @ 1800MHZ / 6GB DDR3 @ 2250MHZ / 4GB DDR3 @ 1600MHZ |
| Video Card(s) | XFX ATI RADEON 5970 / GAINWARD NVIDIA GTX 580 / 2xGEFORCE GTX295 |
| Storage | 1550GB / 6TB SAS - SSD / 160GB SSD |
| Display(s) | NEC 26WUXi2 / NEC 3090WQXi / SONY 55A2000 (1080P 55inch) |
| Case | COOLER MASTER HAF 932 / COOLER MASTER ATCS 840 / ANTEC DARKFLEET DF85 |
| Audio Device(s) | Soundblaster X-Fi Xtreme Music / SoundBlaster X-Fi Fatal1ty Pro / Realtek Onboard |
| Power Supply | CWT 1200W / Enermax Revolution 85+ 1250W / Ikonik Vulcan 1200W |
| Software | Windows 7 x64 / Windows 7 x64 / Windows 7 x64 |
With the desktop PC market heading toward SFF (small form factor), Intel makes plans to shrink its newest Penryn processors.
Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller. Penryn will launch first as a 35mm square SV version in the second quarter of 2008 while the LV and ULV are scheduled for the second half.
Intel will launch its next generation Centrino platform, Montevina, in the second quarter of 2008. The platform will consist of 45nm Penryn processors, Cantiga GM/PM northbridge chipsets, and the ICH9M southbridge. The platform will also support the Wi-Fi/WiMAX wireless module codenamed Echo Peak, and the 802.11n wireless module codenamed Shirley Peak. Chipsets will support DDR2/DDR3 memory and the graphics engine will have built-in DisplayPort and HDMI/HDCP support, added the sources.
View at TechPowerUp Main Site
Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller. Penryn will launch first as a 35mm square SV version in the second quarter of 2008 while the LV and ULV are scheduled for the second half.
Intel will launch its next generation Centrino platform, Montevina, in the second quarter of 2008. The platform will consist of 45nm Penryn processors, Cantiga GM/PM northbridge chipsets, and the ICH9M southbridge. The platform will also support the Wi-Fi/WiMAX wireless module codenamed Echo Peak, and the 802.11n wireless module codenamed Shirley Peak. Chipsets will support DDR2/DDR3 memory and the graphics engine will have built-in DisplayPort and HDMI/HDCP support, added the sources.
View at TechPowerUp Main Site
