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G.SKILL Announces New Ultra Low-Latency DDR4 32GB-Module Kits

btarunr

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G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.



Pushing the Latency Limits of AMD Platforms
Optimized to extract every bit of memory performance out of the latest 3rd Gen AMD Ryzen Threadripper platform, G.SKILL is also bringing the low-latency DDR4-3200 CL14-18-18-38 256 GB (32GBx8) specification to the AMD-compatible Trident Z Neo series. In the following screenshot, this high-efficient kit is validated with the latest AMD Ryzen Threadripper 3960X processor on the ASUS ROG ZENITH II EXTREME motherboard.

Under the Trident Z Neo series, this new DDR4 memory specification will also be brought onto the AMD X570 platform in kit capacities of 128 GB (32GBx4) and 64 GB (32GBx2). In the screenshot below, the DDR4-3200 CL14-18-18-38 128 GB (32GBx4) memory kit is validated with the AMD Ryzen 5 3600 processor and the ASUS PRIME X570-P motherboard.



Availability & XMP 2.0 Support
These high-capacity and low-latency memory specifications support Intel XMP 2.0 for easy overclocking and will be available via G.SKILL worldwide distribution partners in Q1 2020.

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that's ultra low latency maybe for ryzen
 
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that's ultra low latency maybe for ryzen

Why do you say this?

Click on third image.



One thing : Ryzen/TR is CR1 while Intel = CR2
 
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that's ultra low latency maybe for ryzen
You do realize those are 32GB sticks of memory, right? A quick look on Newegg is showing the only DDR3200 32GB sticks available are 16-20-20-38; the platform isn't really relevant.

Cause secondary timings are bad
In the context of a 32GB module, the secondary timings are also low.
 
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Nice for those needing high capacity ddr4 to complete their work quickly.

------

For the rest of us. When will we get the 5000Mhz and 5200Mhz Trident Z kits?

Must we wait for the Comet Lake launch? That's how Gskill normally coordinates availability. Will the 5400Mhz sticks be XMP'd and QVL'd for Apex 12 only? (double wink) ;) ;)

...and only really achievable with 2% of the Comet Lake CPUs? :p

Gskill says: "We have to test hundreds of CPUs simply to find one capable of reaching those speeds we advertise on the box. " :roll:
 
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especially on ryzen 3xxx and/or if you dont want to mess with stuff, having a 3600 kit is still the best since your running IF at 1:1.
nor will high capacity be relevant for most ppl that game (only), as 16gb is plenty if you dont do content/editing etc.
 
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They still haven't delivered on their last 32GB announcements from months ago.
 
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They still haven't delivered on their last 32GB announcements from months ago.

:D

Gskill maintains an 18month paper launch pre-schedule along with a 10:1 announcement to availability ratio. :)
 

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Finally a worthy ram sticks. This should have been on market since 2 or more years, not 2 years before end of ddr4. Well, better late than never.
 
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