MediaTek Launches 6nm Dimensity 1200 Premium 5G SoC

[btarunr]

MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6 nm Dimensity 1200 and 1100 chipsets to MediaTek's 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier," said JC Hsu, Corporate Vice President and General Manager of MediaTek's Wireless Communications Business Unit. "Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements."



Key features of MediaTek Dimensity 1200 and 1100 5G chipsets include:

• The Most Out of 5G Every Day: The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek's 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless, reliable 5G connection across networks.
• Flagship AI Multimedia: The Dimensity 1200 supports 200MP photos for stunning photography with its five-core HDR-ISP. It boasts staggered 4K HDR video capture for significantly greater dynamic range. The chipset integrates an updated version of MediaTek's hexa-core AI processor (MediaTek APU 3.0), which has an enhanced multi-task scheduler that reduces latency and improves power-efficiency. The Dimensity 1100 also packs impressive camera capabilities with its 108MP camera support, and integrates MediaTek's existing APU 3.0 for high performance computing that's also super power-efficient. Both chipsets support AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.
• Premium Performance: The Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz for extreme performance, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. With a nine-core GPU and six-core MediaTek APU 3.0, the Dimensity 1200 delivers a new level of premium performance. The Dimensity 1100 is designed with an octa-core CPU which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with a nine-core Arm Mali-G77 GPU. Both chipsets are manufactured on TSMC's advanced 6nm process technology.
• Incredible Displays: The Dimensity 1200 supports ultra-fast 168Hz refresh rates for a fast, fluid user experience. The Dimensity 1100 also supports cutting-edge displays with 144Hz refresh rates for ultra-sharp, zero-lag visuals. Both chipsets support MediaTek's HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity, plus multi-touch boost touchscreen responsiveness. The new chipsets also support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.
• Dual-Link True Wireless Stereo Audio: Dimensity 1200 and 1100 both support Bluetooth 5.2, which lets users stream to multiple wireless devices simultaneously. The chipsets also support ultra-low latency true wireless stereo audio and LC3 encoding for higher quality, lower latency streaming audio that's also very power-efficient to prolong the battery life of wireless earbuds.

Dimensity 1200 has already received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios. The certification verifies that the chipset provides reliable, high-performance 5G connectivity and offers users high-quality 5G experiences across a wide variety of scenarios.

Many OEMs, including Xiaomi, Vivo, OPPO and realme, expressed support for MediaTek's new Dimensity chip. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year.

Other industry collaborators and supporters of the new MediaTek 5G chipsets include Arm, China Mobile, Tetras.AI, ArcSoft and Tencent Games.

For more information, visit this page.

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[LemmingOverlord]

Is this the TSMC 6nm node? Jeebus. Everyone is sourcing from TSMC. Not only does this result in a bunch of paper launches, but also the fact that one single company holds all of the most advanced fabrication nodes...

 

[ZeppMan217]

Is this the TSMC 6nm node? Jeebus. Everyone is sourcing from TSMC. Not only does this result in a bunch of paper launches, but also the fact that one single company holds all of the most advanced fabrication nodes...

Not their fault everyone's behind. Turns out pumping money into R&D pays off, who coulda known (not Intel).

 

[mtcn77]

It is important that the technology advances otherwise we would still need to upload vaccine selfies in the future for the necessary 5G activation to proceed. I for one welcome our 6nm Overlords.

 

[Sybaris_Caesar]

Not their fault everyone's behind. Turns out pumping money into R&D pays off, who coulda known (not Intel).

Having Apple as the main customer doesn't hurt either. Apple also pays for at least a few months of exclusivity of TSMC's most advanced nodes.

 

[_Flare]

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[mtcn77]

You are a very intelligent person. I've been saying this over the couple of years a lot.

Huawei's Loss AMD's Gain, TSMC Develops Special 5nm Node

With Mainland Chinese tech giant Huawei being effectively cut off from contracting Taiwanese TSMC to manufacture its next-generation HiSilicon 5G mobile SoCs, and NVIDIA switching to Samsung for its next-generation GPUs, TSMC is looking to hold on to large high-volume customers besides Apple and...

www.techpowerup.com

 

[RandallFlagg]

Having Apple as the main customer doesn't hurt either. Apple also pays for at least a few months of exclusivity of TSMC's most advanced nodes.

That's a huge factor in TSMCs success. Apple isn't just a big customer, they give TSMC a guaranteed customer for their new nodes, which mitigates / distributes a lot of the risk . That allows them to invest heavily into new nodes, knowing exactly who their customer is and what they need to do (make that chip). Apple has been doing this for about 7 or 8 years now with TSMC. The same thing is happening with 3nm, and even now Apple is reportedly sucking up most of TSMCs 5nm node for 2021. This is why 5nm will be a non factor for AMD until 2022, at the earliest:

Apple Reportedly Hogging TSMC 5nm Fab Capacity For 2021 To Fuel iPhone And Mac Production

Reports are surfacing once again of Apple having booked up the bulk of 5-namometer chip production from Taiwan Semiconductor Manufacturing Company (TSMC), leaving not a lot of 5nm capacity for other customers.

hothardware.com

Apple actually did try to invest directly into TSMC by paying for part of TSMCs 12nm node at one time, but was spurned by TSMC who wanted to remain somewhat independent.

With other manufacturers, Apple does that (invest directly into manufacturing / tech) all the time, helping to fund building new factories and developing new tech in exchange for exclusive access. I wouldn't doubt that there is some degree of that happening with TSMC.

For example :

"Apple secretly came to Taiwan to spend tens of billions of yuan to expand its investment. It will build a new factory in Zhuke Longtan Park to lock in the two new-generation display technologies of Mini LED and Micro LED, and cooperate with Epistar and AUO to supply iPhone, iPad and other hard体用。 Body use."

蘋果加碼百億 祕密在台擴廠 | 產業熱點 | 產業 | 經濟日報

蘋果祕密來台砸百億元擴大投資，在竹科龍潭園區蓋新廠，鎖定Mini LED與Micro LED這兩大新世代顯示器技術，並與晶電、友達合作，未來將供應iPhone、iPad等硬體使用。這是台廠首度在蘋果顯示器技術開發與導入扮演要角，打破過往相關技術長期由韓、日業者寡占的局面。

money.udn.com

 

[lexluthermiester]

Dimensity

What a stupid name for a product line. Let's hope that the product lines perform better than the naming scheme implies.

 

[xSneak]

Interested in these for the av1 support.