AMD Ryzen 7000 Series "Raphael" Zen 4 Processor IHS Design Gets Leaked

[AleksandarK]

AMD is preparing to switch things up a bit with its upcoming AM5 platform. The new platform is said to bring significant changes to the design of the socket and the CPU package, where we will see some new design choices and decisions. For starters, all of the processors made for the AM5 platform will come in a land grid array (LGA) configuration, very similar to that of Intel. Thanks to the rendering of ExecutableFix, we got to see exactly how will the new LGA design look like. And today, we get to see more details of the AMD's upcoming Raphael processor's integrated heat spreader (IHS) design.

The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.



As you can see, the IHS is very similar to that found on Intel's now discontinued Skylake-X HEDT design, pictured below. Underneath Skylake-X lies a double substrate setup, which is protected by the spider-like IHS. Could that be the same reason that AMD decided to use this IHS design, or is there something else at play here? We just have to wait for more information to find out.


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[Caring1]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

 

[z1n0x]

What's the purpose of that double substrate setup?

 

[zlobby]

I hope AMD stay true to themselves and use LM TIM here as well.

 

[silentbogo]

That reminds me of chinese Intel mobile chip engineering samples off aliexpress (laptop SoC on an LGA1151 substrate). Always wanted to get one for experiments )))
Maybe AMD got inspired and decided to optimize manufacturing by making the same BGA assembly for everything, and only adding a second layer and tweaking PL/boost for desktop versions?

 

[Mussels]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

Yep, those legs look like a retention clip is meant to sit over them

 

[DeathtoGnomes]

Those gaps provide that extra 1% heat dissipation.

 

[natr0n]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

Now we can retire from emergency cpu surgery.... Razor, toothpick and debit cards

 

[Mysteoa]

What's the purpose of that double substrate setup?

I think it was some sort of adaptor to a different socket.

 

[deu]

The only thing i have to say is that intels cpu looks 'glued together' (5 years more and that joke will start to die...)

 

[Legacy-ZA]

It's not an IHS, it's simply an HS, it's an AMD CPU after all...

 

[Dammeron]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

It's been known for a while that it will be LGA-type socket, so no problems with pulling the cooler with CPU stuck to it (LGA sockets have an in-built frame that pushes the CPU onto the spring-type contacts).

 

[INSTG8R]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

One can hope they retire the decades old slot that has always been poor…

 

[Max(IT)]

well, it's almost time...
5800X is the demonstration on how difficult is to cool a MCM chip, and I think the 5nm node will makes things even worst.

 

[TechLurker]

I wonder if they're going to adapt a variant of their EYPC/TR mounting system, making it as idiot-resistant as possible, and also ensuring a proper torque spec. Maybe tweak the spider legs such that it can only be inserted in one way, like a puzzle piece.

 

[zlobby]

I wonder if they're going to adapt a variant of their EYPC/TR mounting system, making it as idiot-resistant as possible, and also ensuring a proper torque spec. Maybe tweak the spider legs such that it can only be inserted in one way, like a puzzle piece.

Sadly, it will still pose a challenge to many...

 

[Steevo]

What's the purpose of that double substrate setup?

Trace density and conductor thickness, for the thickness of conductors for power supply to the cores they probably need a substrate of its own to prevent voltage sag and also to help isolate frequency domains between all the I/O

 

[dicobalt]

I was thinking the shape provides more structural strength. Perhaps to help prevent uneven pressure that leads to damaged pins in the socket?

 

[TheoneandonlyMrK]

Meh, a HS is it me who's getting jaded, perhaps.

 

[user556]

That reminds me of chinese Intel mobile chip engineering samples off aliexpress (laptop SoC on an LGA1151 substrate). ...

Probably because the photos are of an Intel chip. The fully cased photo even has the Intel engravings.

 

[mtcn77]

well, it's almost time...
5800X is the demonstration on how difficult is to cool a MCM chip, and I think the 5nm node will makes things even worst.

It is just heat flux density...
Future IHS'es will have an integrated cold plate "vapour chamber" in my honest opinion. It is such a small, but effective fix. That and liquid metal: small coolers will suffer while big towers take the spotlight.
MCM has +1GHz potential - we have seen it even as far back from Intel Clarkdale - AMD is in no hesitancy to let it sit idle. They will have that much more nails to hammer home.

 

[WhitetailAni]

It looks like someone took their current IHS and chopped holes in it.
I'm curious - does it actually have holes in it or is it just cutouts and the IHS is fully sealed?

 

[Caring1]

It's not an IHS, it's simply an HS, it's an AMD CPU after all...

I'll call it an AHS just for you.
Added Heat Sink instead of Integrated.

 

[lexluthermiester]

Those renders imply a new mounting system that should prevent the CPU from being pulled out with the cooler.

That would be very nice. However, AM5 is going to an LGA type socket not a PGA type, so that really wouldn't be a problem..

 

[close]

Yep, those legs look like a retention clip is meant to sit over them

That's pretty much the only way to hold an LGA in place without putting too much strain on the interface between the IHS and the substrate. So the retention clip sith on the edges of the IHS. I guess the question is why the "spider" design instead of a continuous edge? It could be to save material and weight since the extra support and structural integrity are certainly not required.