AMD (NYSE: AMD) today announced that AMD Fusion ’12 will be held June 11-14, 2012 in Bellevue, Washington. The company’s annual developer summit will return to the Meydenbauer Center and the Hyatt Regency in Bellevue. This event will build on the success of AMD Fusion ’11, where more than 700 leaders from industry, academia, and government converged on the forefront of heterogeneous computing. The summit offers an engaging opportunity to learn more about next-generation software development and AMD Fusion System Architecture (FSA), Accelerated Processing Unit (APU) technology, central processing unit (CPU) and graphics processing unit (GPU) processor technologies, and programming methods using industry-standard application programming interfaces (APIs) such as OpenCL, OpenGL, Microsoft DirectCompute and C++ AMP. “AMD exceeded my expectations with their AMD Fusion Developer Summit this past June,” said Jon Peddie, principal and founder, Jon Peddie Research. “I saw an open and instructive exchange of ideas on software development, tools and APIs, free from the marketing hype that you get at many conferences.” “As the only provider of world-class APUs, GPUs and CPUs, AMD is leading advancement of heterogeneous computing and OpenCL, both of which have reached a tipping point as demand grows for new user interfaces and immersive computing experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “AMD has a history of customer-driven innovation based on industry standards and AMD Fusion ‘12 will be the ideal place for developers, academics and innovators to collaborate around that software innovation.” Call for Presentation Proposals AMD invites pioneers of next-generation software and the rapidly growing field of heterogeneous computing to share their latest work and research findings in the form of presentations. Presenters will have an opportunity to advocate new methodologies and paradigms, garner support for industry standards, and network with developers, innovators and academics who will help define the course of this technology. Presentation proposals are invited on the following topics: Browsers Cloud Computing – Servers and Data Center Gaming and Consumer Graphics Heterogeneous Computing Innovative Client Experiences Multimedia Processing Professional Graphics and Visual Computing Programming Languages and Models Programming Tools Security Presentation proposals must be submitted by February 17, 2012. All proposals will be reviewed by a summit board composed of researchers, academics and practitioners in the field. Selected candidates will be notified by March 15, 2012. Speakers will be offered free conference admission, three nights of compensated hotel accommodations and an invitation to a special speaker reception. AMD Fusion ’11 by the Numbers Approximately 700 attendees were present at AMD Fusion ’11 where Microsoft first announced C++ AMP. Attendees engaged in industry keynotes, interactive technical sessions, pre-summit tutorials and hands-on labs to explore advanced parallel processing programmability and tools. The results from a post-event survey reinforced this focus with more than 80 percent of respondents saying they attended to learn about the latest advances and trends in heterogeneous computing. Moreover, when choosing an application programming interface for parallel processing, 75 percent of attendees reported that they either are deploying OpenCL now, or plan to do so in their future software development.1 AMD Fusion ’11 featured keynotes from Microsoft, ARM and Corel, as well as AMD. Additionally, there were many technical sessions and presentations about a range of topics including developer tools, enterprise computing, security, professional graphics and visual computing, and a roundtable discussion addressing “Why Industry Standards Foster Innovation.” Morgan Kaufmann publishers also used AMD Fusion ’11 as a backdrop to promote their new book about OpenCL and application programming interfaces (APIs) titled, “Heterogeneous Computing with OpenCL,” which is now available.