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ATP Reveals 3D NAND SSD Product Line at Embedded World 2017

btarunr

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#1
ATP Electronics Inc reveals its new 3D NAND based SATA product line up on the Embedded World 2017 in Nuremberg. The products have gone through stringent chip as well as module level validation tests and will be manufactured using ATP's in-house self-packaging technology. Available form factors include 2.5", mSATA, SlimSATA and M.2 in various capacities, including intermediate densities such as 192 GB, 384 GB and 768 GB. The products will be showcased at ATP's booth in Hall 1, Booth #1-655.

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Rictorhell

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#2
Hoping that this will lead to the production of affordable higher capacity msata drives and that this company will make a decent profit investing in and supporting the users of that type of SSD that have been looking for NEW products in that form factor.