- Joined
- Feb 20, 2007
- Messages
- 372 (0.06/day)
- Location
- Where the beer is good
System Name | Karl Arsch v. u. z. Abgewischt |
---|---|
Processor | i5 3770K @5GHz delided |
Motherboard | ASRock Z77 Professional |
Cooling | Arctic Liquid Freezer 240 |
Memory | 4x 4GB 1866 MHz DDR3 |
Video Card(s) | GTX 970 |
Storage | Samsung 830 - 512GB; 2x 2TB WD Blue |
Display(s) | Samsung T240 1920x1200 |
Case | Bitfenix Shinobie XL |
Audio Device(s) | onboard |
Power Supply | Cougar G600 |
Mouse | Logitech G500 |
Keyboard | CMStorm Ultimate QuickFire (CherryMX Brown) |
Software | Win7 Pro 64bit |
I started with the following situation when it came to overclocking my CPU
And that is using a 240mm AIO cooler running full tilt (with 2 fans - have to mod my case first a little, before I can mount the other 2 fans the way I want) . As you can see I m nearing the 80°C mark, making any further tinkering a wasted effort. The reason for this is Intel's infamous cost saving measure on all mainstream platforms since Z77 (Ivybridge, Haswell, Broadwell and Skylake) replacing the solder between the CPU Die and the heatspreader (IHS) with some kind of thermal paste (TIM). My personal believe is they 're using the cheapest toothpaste they can get their hands on. On the enthusiast platforms X79 and X99 CPUs are still soldered, which means the following procedure is pointless with these CPUs and will even damage it (IHS removal) in most cases.
The solution to this problem is removing the IHS from your CPU and replacing the original Intel gunk (it's probably brick hard by now) with Liquid Metal (LM).
There are several methods to do this including: razer, vice and the lastest and best imo a delid tool like the one below which I choose.
You can also 3d-print your own btw
After CPU and IHS are seperated they both are cleaned and the LM (Thermal Grizzly - Conductonaut in my case, any other LM will do) is applied to the CPU Die and the inside of the IHS. Afterward everything is glued back together. LM application in the video below.
In my case I also lapped the IHS of my CPU during that process resulting in a flat surface area between CPU cooler and CPU cooler.
How to:
After everything is put back together I now get the following results:
Nearly 20°C lower temperatures leave much more room for overclocking.
If you want to read an in depth article about this topic hardwareluxx.de recently published this one. Google translate works pretty well for german -> english.
Was it worth it?
Hell yes! Despite my CPU not being a golden OC sample judging from the voltage needed to run 4.5GHz, I now can at least find out what the limits are for my CPU and at the same time lower the rpms on my fans.
Beside overclocking is there an other use case for this whole operation?
A hot running noisy living room / media PC comes to mind, otherwise it doesn't make much sense and even there other avenues should be explored first.
Linustechtips also made a video on this topic, worked sloppy and choose the wrong use case. You can admire the fail here. A good example why you should consider that channel more as entertainment and less as a serious source for pc tech information.
The only thing left to do, is to thank "Stullen Andi" from Hardwareluxx.de for deliding my CPU as I didn't want to spend 90€ on a delite mate and don't have a 3d-printer to print one myself.
And that is using a 240mm AIO cooler running full tilt (with 2 fans - have to mod my case first a little, before I can mount the other 2 fans the way I want) . As you can see I m nearing the 80°C mark, making any further tinkering a wasted effort. The reason for this is Intel's infamous cost saving measure on all mainstream platforms since Z77 (Ivybridge, Haswell, Broadwell and Skylake) replacing the solder between the CPU Die and the heatspreader (IHS) with some kind of thermal paste (TIM). My personal believe is they 're using the cheapest toothpaste they can get their hands on. On the enthusiast platforms X79 and X99 CPUs are still soldered, which means the following procedure is pointless with these CPUs and will even damage it (IHS removal) in most cases.
The solution to this problem is removing the IHS from your CPU and replacing the original Intel gunk (it's probably brick hard by now) with Liquid Metal (LM).
There are several methods to do this including: razer, vice and the lastest and best imo a delid tool like the one below which I choose.
You can also 3d-print your own btw
After CPU and IHS are seperated they both are cleaned and the LM (Thermal Grizzly - Conductonaut in my case, any other LM will do) is applied to the CPU Die and the inside of the IHS. Afterward everything is glued back together. LM application in the video below.
In my case I also lapped the IHS of my CPU during that process resulting in a flat surface area between CPU cooler and CPU cooler.
How to:
After everything is put back together I now get the following results:
Nearly 20°C lower temperatures leave much more room for overclocking.
If you want to read an in depth article about this topic hardwareluxx.de recently published this one. Google translate works pretty well for german -> english.
Was it worth it?
Hell yes! Despite my CPU not being a golden OC sample judging from the voltage needed to run 4.5GHz, I now can at least find out what the limits are for my CPU and at the same time lower the rpms on my fans.
Beside overclocking is there an other use case for this whole operation?
A hot running noisy living room / media PC comes to mind, otherwise it doesn't make much sense and even there other avenues should be explored first.
Linustechtips also made a video on this topic, worked sloppy and choose the wrong use case. You can admire the fail here. A good example why you should consider that channel more as entertainment and less as a serious source for pc tech information.
The only thing left to do, is to thank "Stullen Andi" from Hardwareluxx.de for deliding my CPU as I didn't want to spend 90€ on a delite mate and don't have a 3d-printer to print one myself.