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"For AMD" memory

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Is this some marketing talk is is such memory really better for Ryzens?
 
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not better but at least tested for compability.
 
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Ryzens are super picky with memory. Specifically, they like single rank Samsung B-Dies.

But the 'for AMD' stuff is mostly marketing.

AMD Memory compatibility is a combination of the IMC function and the Motherboard's BIOS. Some cheaper motherboards won't work with all 4 dimms populated with a large majority of kits (ASUS B350 pro comes to mind) where there is a list of 80+ kits that work with dual channel configuration and like 15 that work with all dimms populated.
 
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The problem is the motherboard compatibility lists can never have all the possible combinations so they are mostly useless anyway.
 
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Yes the Ryzen platform can be picky. It's better now than initially, if I were buying I would stay away from corsair and kits in the 3000-3200 range with timings like 15-17-17
 
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Yes the Ryzen platform can be picky. It's better now than initially, if I were buying I would stay away from corsair and kits in the 3000-3200 range with timings like 15-17-17
yep, but only you can change the timing to even number and then these kits works flawless!
 
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The Ryzen platform is much better polished by now, and nowhere near as picky about system RAM nowadays. However Ryzen is still intimately tied to memory speed and especially latency for which Samsung B-die memory is the tightest currently available. Using low latency fast ram like a Samsung b-die 3200 CL14 will measurably make a significant difference to overall system speed.

Is it absolutely needed? No, but it will make a difference.
 
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First gen Ryzen was the big issue, the current gen can handle most ram.
 
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yep, but only you can change the timing to even number and then these kits works flawless!
Not always, from my readings across the forums these seem to be the most troublesome kits even after setting manual timings they can be unstable. There are timings in RAM kits that aren't available to be manipulated and no matter what amount of tinkering you do they can be a serious PITA. I find it best if you haven't bought your kit yet just avoid them
 
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Buy memories modules with Samsung b-die . They are the ones with which you can achieve high memory clock speeds and low latency. Also, you should pick a higher end CPU for example 1800X instead of 1700 or 2700X instead of 2700 because they have better memory controllers.
 
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Buy memories modules with Samsung b-die . They are the ones with which you can achieve high memory clock speeds and low latency. Also, you should pick a higher end CPU for example 1800X instead of 1700 or 2700X instead of 2700 because they have better memory controllers.
The 1700X does very well against the 1800X. I haven't heard that before, where the 1800 would have better memory controllers..
 
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Ryzens are super picky with memory. Specifically, they like single rank Samsung B-Dies.

But the 'for AMD' stuff is mostly marketing.

AMD Memory compatibility is a combination of the IMC function and the Motherboard's BIOS. Some cheaper motherboards won't work with all 4 dimms populated with a large majority of kits (ASUS B350 pro comes to mind) where there is a list of 80+ kits that work with dual channel configuration and like 15 that work with all dimms populated.
they can use most its just the Better speeds come with Bdie same on intel(the b die bit)
 

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i've got crappy hynix stuff and have no issues reaching rated speeds

first gen ryzen on early BIOS/agesa had issues, the modern stuff doesnt
 
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The 1700X does very well against the 1800X. I haven't heard that before, where the 1800 would have better memory controllers..

In my post I did not say 1700X had a bad memory controller. It is 1700 with which you might have a problem. The pricier ones are supposed to have a better memory controller so you are more likely to hit high ram frequencies. Am I wrong?
 
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Yes. The IMC is the same across all Gen1 Ryzen CPU's. Compatibility is dependent on BIOS settings and RAM configuration on the modules themselves.

Well, that's simply not true. Memory controller differs from CPU to CPU. Binning typically impacts everything. This includes the IMC for that particular die.
 

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not better but at least tested for compability.

I mean I guess if you don't call running at higher speeds better... Doesn't matter first or second Gen single sided b die clocks higher.

i've got crappy hynix stuff and have no issues reaching rated speeds

first gen ryzen on early BIOS/agesa had issues, the modern stuff doesnt

What is the rated speed? Normally the issues arise when trying to hit 3200+ at that point they are rather picky.

I have a quite good kit of hynix, a second Gen chip with in theory some of the best binning amd does and it will not hit 3200+ on the current AGESA update, the kit does 3600+ on my Intel chips. The OEM Samsung b die kit I have does hit it just fine.

I did a lot of testing with an 1800X pre release chip and it took a large amount of time to make headway with anything other than Samsung b die. I did have some hynix kits I could push to decent speeds, but it certainly wasn't the 3866 I got out of the Sammy's.
 
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Well, that's simply not true. Memory controller differs from CPU to CPU. Binning typically impacts everything. This includes the IMC for that particular die.
That statement only displays a misunderstanding of how the process of "binning" is conducted. The IMC on every CPU die must meet minimum performance specs in order for the die to be considered viable for resale. If the IMC doesn't perform or there is a defect detected, the die in question is rejected. So yes, all CPU IMC's perform at a minimum operational performance level and they perform identically to each other, by design.
 

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I mean I guess if you don't call running at higher speeds better... Doesn't matter first or second Gen single sided b die clocks higher.



What is the rated speed? Normally the issues arise when trying to hit 3200+ at that point they are rather picky.

I have a quite good kit of hynix, a second Gen chip with in theory some of the best binning amd does and it will not hit 3200+ on the current AGESA update, the kit does 3600+ on my Intel chips. The OEM Samsung b die kit I have does hit it just fine.

I did a lot of testing with an 1800X pre release chip and it took a large amount of time to make headway with anything other than Samsung b die. I did have some hynix kits I could push to decent speeds, but it certainly wasn't the 3866 I got out of the Sammy's.

I had no issues with 3200Mhz on hynix dual rank ram with a ryzen 1400, 1700, and now 2700x on X370

If you want extreme OCing, sure you need the samsung... but to achieve rated/XMP speeds its a non-issue except in rare cases with boards that have outdated AGESA support
 

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I had no issues with 3200Mhz on hynix dual rank ram with a ryzen 1400, 1700, and now 2700x on X370

If you want extreme OCing, sure you need the samsung... but to achieve rated/XMP speeds its a non-issue except in rare cases with boards that have outdated AGESA support

I wouldn't really call 3800 extreme when we have dozens of kits shipping with an xmp profile for that.
 

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I built my first AMD system since the 939 days last month. It was plagued with issues and only completed last week. ran a load of benchmarks which it kept getting kicked out of. games would CTD or freeze completely. All that changed when i consulted the board manufacturers QVL and bought ram from that list.

Before that I had gone through 2 dead/faulty PSUs and wasnt sure if they had fried something but the system seems to be working okay. completed all benchmarks and realbench stress tests without fail
 
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That statement only displays a misunderstanding of how the process of "binning" is conducted. The IMC on every CPU die must meet minimum performance specs in order for the die to be considered viable for resale. If the IMC doesn't perform or there is a defect detected, the die in question is rejected. So yes, all CPU IMC's perform at a minimum operational performance level and they perform identically to each other, by design.

I have no idea how to convince you. It is a fact that with an 1800X your RAM is much more likely to reach higher frequency levels.

That statement only displays a misunderstanding of how the process of "binning" is conducted.

No.

The IMC on every CPU die must meet minimum performance specs in order for the die to be considered viable for resale.

The minimum specs here is the advertised speed. It does not mean it will be better overclocked.

If the IMC doesn't perform or there is a defect detected, the die in question is rejected.

Yes, but, again, this has nothing to do with overclocking cabability.

all CPU IMC's perform at a minimum operational performance level and they perform identically to each other, by design.

No. Again, the minimum operational performance level is the advertised ones, not overclocking capability.
 
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It is a fact that with an 1800X your RAM is much more likely to reach higher frequency levels.

Or not.

What's the point of arguing about all this when you just simply cannot prove any of it ? My 1700X needs just 1.35V for 4 Ghz but can't go over 2400mhz on the RAM. What does this mean ? Absolutely nothing, stop trying to speculate patterns when there is no reliable way of doing so.
 
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Or not.

What's the point of arguing about all this when you just simply cannot prove any of it ? My 1700X needs just 1.35V for 4 Ghz but can't go over 2400mhz on the RAM. What does this mean ? Absolutely nothing, stop trying to speculate patterns when there is no reliable way of doing so.

Yes, I have no proof and there is no reliable way of doing so but there is statistics. You probably can't go over 2400MHz because you have 1700X. Perhaps if you had 1800X, you would reach over 2400MHz.
 
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