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Intermolecular, Inc. today announced that GLOBALFOUNDRIES and IBM will leverage Intermolecular's High Productivity Combinatorial (HPC) technology, as the companies work to speed development of manufacturing technologies down to the 10 nm node.
Intermolecular's combinatorial technology allows many more tests to be done using a single wafer. This enables experimental data to be generated and analyzed with significantly greater speed and efficiency than a traditional development line, accelerating innovation in materials, processes, and device architectures.
"IBM and GLOBALFOUNDRIES are committed to pushing forward the leading-edge of IC logic manufacturing with new materials and device structures," said Gary Patton, VP Semiconductor Research for IBM. "Intermolecular's HPC technology will help to more rapidly explore materials and processing options for advanced logic manufacturing."
"We are pleased that IBM and GLOBALFOUNDRIES will be able to leverage our HPC platform to address GLOBALFOUNDRIES' high-volume manufacturing R&D challenges," said David Lazovsky, Intermolecular president and CEO.
"Our business model is built on collaboration, both in customer engagements and technology development," commented David Bennett, vice president of alliances for GLOBALFOUNDRIES. "Collaborating with Intermolecular has strengthened our R&D pipeline and improved R&D efficiency."
Intermolecular's mission is to drive our customers' success by transforming R&D and accelerating innovation in markets that derive competitive advantage from the interaction of materials science, processes, integration and device architecture.
View at TechPowerUp Main Site
Intermolecular's combinatorial technology allows many more tests to be done using a single wafer. This enables experimental data to be generated and analyzed with significantly greater speed and efficiency than a traditional development line, accelerating innovation in materials, processes, and device architectures.
"IBM and GLOBALFOUNDRIES are committed to pushing forward the leading-edge of IC logic manufacturing with new materials and device structures," said Gary Patton, VP Semiconductor Research for IBM. "Intermolecular's HPC technology will help to more rapidly explore materials and processing options for advanced logic manufacturing."
"We are pleased that IBM and GLOBALFOUNDRIES will be able to leverage our HPC platform to address GLOBALFOUNDRIES' high-volume manufacturing R&D challenges," said David Lazovsky, Intermolecular president and CEO.
"Our business model is built on collaboration, both in customer engagements and technology development," commented David Bennett, vice president of alliances for GLOBALFOUNDRIES. "Collaborating with Intermolecular has strengthened our R&D pipeline and improved R&D efficiency."
Intermolecular's mission is to drive our customers' success by transforming R&D and accelerating innovation in markets that derive competitive advantage from the interaction of materials science, processes, integration and device architecture.
View at TechPowerUp Main Site