Discussion in 'Overclocking & Cooling' started by SonDa5, Oct 3, 2012.
I wish I could do this to my 3930K
Wouldn't the benefits be marginal. The 3930k doesn't use a paste does it?
nope its soldered if he trys ti delid it will kill it
I have read the fluxless solder is much better for conducting heat than any TIM that can be bought.
The only thing that would be better than fluxless solder would be a soft thermal pad of graphene cut perfectly to fit over the die and lay flat on PCB of CPU for a direct mount with a water block. That would be awesome!!
Somebody make it now!
No but many IB delidders use the IHS because it is easier to do. Some mother boards don't have the clearance around the cpu socket to do direct contact mount.
I really think thermal conductivity is better with out the IHS.
I don't plan on using IHS because my die has great contact with my water block and my IHS has poor contact with my block. At the start of this thread I posted contact paper pressure test photos that show this.
Will not run with IHS.
Yeah I saw the op
I wanted to try it with out the ihs but knowing my luck ill crack the die
But since I already know its no good under ln2 I going to test it under the ss
And yes you need a larger Rad
Double. post. sorry.
Updating temp post.
My IC Diamond seems to be cooling better after a few days.
Also I have been able to tweak my voltage a little more than before for stability.
Under load at 4.5 GHZ my 3570k is stable with 1.13v.
10 pass in diagnostic mode with maximum memory Intel Burn Test
Ambient Temps 24C.
Temps under IBT 63C 72C 71C 66C
My temps at 4.5 GHZ have now lowered to 68C average per core. That is a 19.25C per core average temperature drop so far since I de-lidded.
I didn't think IC Diamond had a break in period. The only things I have done is lower my CPU voltage from 1.17v to 1.15v in BIOS and I have raised my PLL voltage from 1.5v to 1.60v and lastly I hand tightened my cpu mount set screws just a little where they felt lose. I'm being as careful as possible to not crack the die with the block. (NO IHS)
As I tweak it for lower temps I will update with changes.
Fascinating concept mate, who would have thought aye, what if instead of leaving the metal cap off altogether, you replaced the internal thermal paste with good quality Tim and then put the lid back on?
Or if you got your hands on some flux less solder and soldered a layer inside the lid etc, something like that? Just thinking of alternatives etc, how not to void warranty and or break chip by too much pressure,accident etc, very tempting idea tho, thank for posting, I can't believe my latest chip(ib i5 3570k) is idling at 14-16 c whereas last sb i5k idled at 25-30 with same cooler etc, I thought ib ran hotter, even oc, whilst gaming it's not hittin much over 40 c. Musta got a good one hopefully.
The Tim definitely takes few days if not weeks to settle I noticed,
Ps that's a big temp drop.
I wonder if you could heat it up with soldering iron or the like, just enough to melt the solder, without destroying the chip?
Then it may come off? Have to find out the melting point of solder, and compare that to the upper thermal limit of your chip, if the solder is lower, it may be possible .? After all, if it was soldered on in the first place? Just thinking?
Probably done by machine I'd guess, I know lots of components like diodes and resistors etc are easy to cook if over soldered.
U could maybe use a large tipped solder iron and a thermometer.
No, I've seen a few people that tried to delid their soldered chips and they all destroyed the CPU, either by heat or by not heating enough and breaking the chip.
That makes sense. Wouldnt be worth the risk.
Would you prefer to have a chip that could be delidded, or a chip that had fluxless solder? I personally would go for the fluxless solder because I don't want to take the risk.
I think the i5 3570 k i have can be delidded, and when i read this post/thread, it became a very tempting idea, but,,,,, it idles really low, doesnt get that hot under load surprisingly, , goes like hell anyways, so, dont think il bother,
But its good to know you can, id be more reciprocal to the idea of taking the lid off, removing the intel thermal glue, and putting some better paste in then put the lid back on?
Just sand through the IHS. Plenty of people have done it.
Do you know how effective at heat transfer the fluxless solder used on SB-E is? Somebody... I forget who or where stated that it worked much better than any TIM available in retail.
Don't know don't particularly care. Last chip I had that was delidded was a 6+ghz celeron 352
Is it there own proprietary fluxles solder or is it just, fluxles solder, is something id like to know. you used to be able to buy it in sticks.
reminds of a hand iron hehe, youd heat it over your gas stove.
I wonder if this latest chip i have appears to have lower idle temp, because the heat transfer rate from chip to lid is less efficient than my old sandybridge i5? hmmm, does that sound logical?[using same cooler]
gr8 fotos. whats the black compound holding the lid around the edges?
I believe you are 100% correct and logical. Physics back up your logic as well.
There have been many people delid IB CPUs and replace TIM and improve thermal heat transfer so part of the problem does appear to be ineffective TIM but Idontcare from Anandtech has discovered by experimentation that the gap between the IHS and DIE is the weakest link in the factory Intel IHS design.
That chart is excellent info, big thanx, reason i asked questions about all this is you have given me an idea !!!!, im going to try it when i get the chance, i have a background in metal casting so why the hell not already, really interesting post you made here too, and i loved those close -up fotos, gave me a chance to inspect the chip without having to rip apart mine yet. im gr8ful.
Looking at temp differences on the chart, i can see why you would do it.
Idontcare wrote another great bit of information on the dimensions of the IB CPU which I have found helpful in designing some of my own mods for IB cooling.
I think this will help you at as well.
Well if somebody were to plan on de-lidding/removing fluxless solder I think there should be a planned TIM to be used. Makes no sense to destroy the factory IHS design if an improved method of cooling isn't possible.
Not all CPUs would benefit from de-lidding but IB does because of Intel's poor IHS design.
I just got done doing my first 27 hour Prime95 v27, with AVX long FFTs (hot selection).
Ambient temps ranged from low 20C to high 27C.
Hottest temps were recorded during the 15th hour of testing.
Max Temps recorded
64C 72C 69C 64C
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