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IBM Cools 3-D Chips with Water

malware

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jbunch07

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#2
hmm very interesting.
IBM is always thinking of new and interesting to use water to cool devices.
 
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#3
I wanna bonk "Moore" on the head for his "law".
 
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#4
Oh what a lot of spinonsense

3-D chip stacks would have an aggregated heat dissipation of close to 1 kilowatt—10 times greater than the heat generated by a hotplate—with an area of 4 square centimeters and a thickness of about 1 millimeter
1./ No way 1 KW in a 3D chipstack that size. It is not tractable. 3D chipstacks are for high-density, low power devices. FLASH memory is a perfect example. L3 cache is (possibly) another example. Or a "matrix" of "atoms". But NOT 10x Xeon Extremes on top of each other, or 10x RV770 GPUs on top of each other, AT CURRENT power requirements.
2./ 2cm x 2cm x 0.1cm WTF? That's not a stack. That's FLAT. Perhaps they mean ONE layer of a stack has those dimensions.
The complexity of such a system resembles that of a human brain, wherein millions of nerves and neurons for signal transmissions
1./ What a lot of blab. A cooling system, consisting of TUBES and WATER, as complex as the brain. LOL
2./ Anyone knows that water is "thick" and laws of fluid dynamics mean that pushing water through small holes is not only difficult but incredible inefficient. So the PRESSURE of this system is going to require some HUGE pump/compressor with high pressure valves and hosing. Right. LOL
In these experiments, scientists piped water through a 1 by 1 cm test vehicle, consisting of a cooling layer between two heat sources...Using simulations...
1./ OMG, this was a high-school theory paper, not even built as a prototype
2./ They used WHAT? A heat source and a honeycomb, two paper cups and a piece of string.


Anyone else get the impression that the article was NOT written by the scientists, but a lady journalist sitting in the audience, writing for some college rag?
 
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russianboy

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#5
Yeah, I agree with lemonade, the spaces would be too small to pump enough water (at a safe pressure) to the chip to cool it enough. Plus it would pose a bunch of problems, like mass fabrication, cost (something like this could very well be extremely expensive) and durability issues.

I really don't think this is feasible.
 
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#6
maybe you guys should work for IBM
 

russianboy

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#7
nah, I'm only good at criticizing at something people have worked for a long time on, I'm not able to create something ingenious myself.
 

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#8
I wonder what happens if a pipe leaks .... new cpu anyone.
 

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#9
this is IBM, theory or not they'll make something from it.

At least they're working on it, rather than slapping a bigger heatsink on.
 
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#10
i like it i want it :D