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IBM developing more efficient way to transfer heat away from the processor

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#1
Most of the time, when people see cuts or grooves in their heatsinks or Integrated Heat Spreader (IHS), they think that it will really reduce thermal transfer. However, IBM is working on a technology that actually uses those grooves, and organizes them into a system of canals. By carving these canals into the IHS of a processor, or a heatsink, IBM actually increases the efficiency of thermal paste. The technology is still in prototype stage.


Source: The Register
 
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#3
i'll believe it when i see actual results
 
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#4
Probably nothing huge I'd expect, but we'll see. IBM have done good stuff in the past (obviously :D).
 
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#5

tigger

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#6
thats it,i'm slicing up my ihs.:D
 
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#7

tigger

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#8
nah,it aint got no rights man.
 
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#10

cdawall

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#11
thats nice so ibm is making a way to cool down there chips since they happen to be some of the hottest runnning since prescott problem meet solved
 
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#12
Hmm, i found that a smooth IHS yielded the lowest cpu temps vs. ihs with grooves or unfinished ihs.
 
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#13
Wow i'm going to cut my IHS into bits and pieces like those 1MM sizes. Weeeeee.
 

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#14
time to start cut my IHS :D

*gone look for a chainsaw*
 
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#16

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#17
Make sense to me
 

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#18
Copper conducts heat far better than thermal grease, i don't see how cutting groves in the copper is going to help.
 

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#19
i think it is to reduce the amount of thermal paste between the highpoints on the ihs and the cooler. that way if too much tim is used it will be squished into the channels and wont interfear with the heat transfer.
 

kakazza

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#20
More area = More heat can be transfered. The same way heaters work, just that his is for cooling ;p

So if there is more area on the IHS it can transport more heat to the copper cooler. And yes I think this will work. Not like -20°C but it will give some advantage.
Why? a) IBM scientists better know what they are doing, b) the 'more area = more heat dispense' has been used for decades anywhere where heat dispension is important.
 

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#21
I think kenny's got it figured. Nice thinking mate ;)
 
S

Slater

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#22
i'll believe it when i see actual results
Actually when you look at it on a molecular level yes, because they are removing a little bit they increase the surface area, and since it doesnt require a thicker layer of thermal paste, it will increase thermal transfer.

__________________ vs. ~~~~~~~~~~~~~~


Thats how it prob is



My way is right. :)
 
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#23
In some test of an Arctic Cooling CPU-cooler it was said that in its manual Arctic says they use the same method on the bottom of this Cooler.
 
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#24
well i guess it'd make more surface area between the thermal paste & IHS.....
but wouldn't it also make more air pockets?

We'll see what they manage to do with it!
 
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#25
Probably no air pockets if it's applied correctly.