zekrahminator
McLovin
- Joined
- Jan 29, 2006
- Messages
- 9,066 (1.36/day)
- Location
- My house.
Processor | AMD Athlon 64 X2 4800+ Brisbane @ 2.8GHz (224x12.5, 1.425V) |
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Motherboard | Gigabyte sumthin-or-another, it's got an nForce 430 |
Cooling | Dual 120mm case fans front/rear, Arctic Cooling Freezer 64 Pro, Zalman VF-900 on GPU |
Memory | 2GB G.Skill DDR2 800 |
Video Card(s) | Sapphire X850XT @ 580/600 |
Storage | WD 160 GB SATA hard drive. |
Display(s) | Hanns G 19" widescreen, 5ms response time, 1440x900 |
Case | Thermaltake Soprano (black with side window). |
Audio Device(s) | Soundblaster Live! 24 bit (paired with X-530 speakers). |
Power Supply | ThermalTake 430W TR2 |
Software | XP Home SP2, can't wait for Vista SP1. |
Most of the time, when people see cuts or grooves in their heatsinks or Integrated Heat Spreader (IHS), they think that it will really reduce thermal transfer. However, IBM is working on a technology that actually uses those grooves, and organizes them into a system of canals. By carving these canals into the IHS of a processor, or a heatsink, IBM actually increases the efficiency of thermal paste. The technology is still in prototype stage.
View at TechPowerUp Main Site
View at TechPowerUp Main Site