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ID-Cooling Introduces their Processor Cooling Lineup for Europe

Over_Lord

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ID-Cooling is a new Brand in Europe founded by Shenzhen Wan Jing Hua Technology co., Ltd. Located in Shenzhen China. The Company has a long History in the OEM Business for Cooling Products. In the 10 Years of Company History create the Company behind the Brand ID-Cooling a lot technologies for Cooling.

ID-Cooling had their first International release on the Computex 2013 in Taiwan. The Fair was very successful for the Brand a lot of contacts was created and the Distribution Channel in Europe is Interested in ID-Cooling Products.


  • High-end Cooling will be released under Finland Flag - short the FI Series
  • The High to Mid Range Tower Series will be released under the Swedish Flag - short the SE Series
  • The Iceland Series will be used for the thin down draft Coolers - short called the IS-Series
  • DK Series is the Traditional open Cooler Series

In the next month will ID-Cooling release the Cooler each Series step by step on the European Market and at the same time we will cooperate with the IT-Media to introduce our Products by Reviews.
All News about the current Status of ID-Cooling in Europe can be seen in the official Blog on Idcooling.eu

View at TechPowerUp Main Site
 
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Poor Norway got left out... ;)

That said, it's pretty lame by a Chinese company to use Scandinavian countries as sub brands for their coolers...

Oh, and the Chinglish is very strong with this one...
 
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I see what appears to be four cold looking locals... Is that how they plan on cooling stuff?
 
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I see what appears to be four cold looking locals... Is that how they plan on cooling stuff?

No. This is how:


Looks not bad. Quite similar to Deepcool and Gelid.
 

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Ahh so they plan on blatantly copying designs

There are a lot of dual fan split rad designs out there, I don't see who this can be classified as copying? :confused:
 

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There are a lot of dual fan split rad designs out there, I don't see who this can be classified as copying? :confused:

I just want to see something new :laugh: Not remakes of one persons good design. At least everyone once in a while someone tries something new CM released a cooler with a TEC in it, Ultra had that weird AIO watercooler tower thing, Sapphire and their vaporX cooler, just would be nice to see some more innovation.
 

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just would be nice to see some more innovation.

Processor TDP has peaked (if you discount that crazy 5Ghz AMD processor), and its on the way down. I seriously doubt that people are going to throw research money at it anymore.
 
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I just want to see something new :laugh: Not remakes of one persons good design. At least everyone once in a while someone tries something new CM released a cooler with a TEC in it, Ultra had that weird AIO watercooler tower thing, Sapphire and their vaporX cooler, just would be nice to see some more innovation.
In that case, you're in for treat, because FI Series use 3D Vapor chambers. That's something new.


http://www.cowcotland.com/news/37079/computex-2013-id-cooling-est-aussi-chambre-vapeur.html
 

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See now that's what I was looking for something different.

Processor TDP has peaked (if you discount that crazy 5Ghz AMD processor), and its on the way down. I seriously doubt that people are going to throw research money at it anymore.

Ah so because TDP's aren't going higher we can't have innovation. Got it everyone has to follow the Intel business plan then I guess?
 

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Ah so because TDP's aren't going higher we can't have innovation. Got it everyone has to follow the Intel business plan then I guess?

No, TDP's are not going higher so we don't really need as much innovation as before. That is not to say that we don't need innovation anymore, just that it will take a back seat (and allowing commoditisation to take over, eg. CM212). Why are we following Intel's business plan even when AMD is decreasing their power consumption too? (discounting that 5ghz chip again).
 

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Aren't they just regular heatpipes?

Follow the link it appears to use a vapor chamber to feed the heatpipes similar to sapphires vapourx but the heatpipes integrate into it.

No, TDP's are not going higher so we don't really need as much innovation as before. That is not to say that we don't need innovation anymore, just that it will take a back seat (and allowing commoditisation to take over, eg. CM212). Why are we following Intel's business plan even when AMD is decreasing their power consumption too? (discounting that 5ghz chip again).

Amd still puts out 125-140w chips for their top tier...
 

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I don't see how much more innovation there is left in air coolers, fins and heat pipes is really the best, simplest way, and works very well.

I also agree that TDP's have probably peaked, hopefully as they start to go down, there will be a distinct lack of massive tower coolers (which i personally don't like)
 

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I don't see how much more innovation there is left in air coolers, fins and heat pipes is really the best, simplest way, and works very well.

I also agree that TDP's have probably peaked, hopefully as they start to go down, there will be a distinct lack of massive tower coolers (which i personally don't like)

You say that, but gpu tdps have done nothing but increase.
 
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Aren't they just regular heatpipes?

No.

Unless you're one of those HW noobs who say every tower cooler is a copy of Hyper 212.
 
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