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Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox

Aug 19, 2017
74 (0.11/day)
What's New: This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel's advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel's world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the computing systems of tomorrow.

"Our vision is to develop leadership technology to connect chips and chiplets in a package to match the functionality of a monolithic system-on-chip. A heterogeneous approach gives our chip architects unprecedented flexibility to mix and match IP blocks and process technologies with various memory and I/O elements in new device form factors. Intel's vertically integrated structure provides an advantage in the era of heterogeneous integration, giving us an unmatched ability to co-optimize architecture, process and packaging to deliver leadership products." -Babak Sabi, Intel corporate vice president, Assembly and Test Technology Development.

Why It's Important: Chip packaging has always played a critical - if under-recognized - role in the electronics supply chain. As the physical interface between the processor and the motherboard, the package provides a landing zone for a chip's electrical signals and power supply. As the electronics industry transitions to the data-centric era, advanced packaging will play a much larger role than it has in the past.

More than just the final step in the manufacturing process, packaging is becoming a catalyst for product innovation. Advanced packaging techniques allow integration of diverse computing engines across multiple process technologies with performance parameters similar to a single die, but with a platform scope that far exceeds the die-size limit of single-die integration. These technologies will improve product-level performance, power and area while enabling a complete rethinking of system architecture.

What are Intel's Updates: Intel is a leader in advanced packaging technology, with current offerings spanning both 2D and 3D approaches. At SEMICON West, Intel unveiled three new technologies that will open a new dimension in product architecture:

Co-EMIB: Intel's EMIB and Foveros technologies leverage high-density interconnects to enable high bandwidth at low power, with I/O density on par with or better than competitive approaches. The company's new Co-EMIB technology enables the linkage of even more computing performance and capability together. Co-EMIB allows for the interconnection of two or more Foveros elements with essentially the performance of a single chip. And designers can also connect analog, memory and other tiles with very high bandwidth and at very low power.
ODI: Intel's new Omni-Directional Interconnect provides even greater flexibility for communication among chiplets in a package. The top chip can communicate horizontally with other chiplets, similar to EMIB. It can also communicate vertically with through-silicon vias (TSVs) in the base die below, similar to Foveros. And ODI leverages large vertical vias to allow power delivery to the top die directly from the package substrate. Much larger than traditional TSVs, the large vias have lower resistance, providing more robust power delivery simultaneously with higher bandwidth and lower latency enabled through stacking. At the same time, this approach reduces the number of TSVs required in the base die, freeing up more area for active transistors and optimizing die size.
MDIO: Building upon its Advanced Interface Bus (AIB) PHY level interconnect, Intel disclosed a new die-to-die interface called MDIO. The technology enables a modular approach to system design with a library of chiplet intellectual property blocks. MDIO provides better power efficiency and more than double the pin speed and bandwidth density offered by AIB.

Collectively, these technologies are complementary tools in a powerful toolbox. When combined with Intel's process technologies, they form the underlying color palette for the creativity of its chip architects - giving them the freedom to dream up new products.

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Nov 15, 2016
249 (0.26/day)
System Name Sillicon Nightmares
Processor Intel i5 4690K (4.7GHZ 1.372vcore, 4.0GHZ 1.192vring, VCCIN 1.84v)
Motherboard Asrock Fatal1ty Z97X Killer BIOS P2.40
Cooling DEEPCOOL Gamer Storm CAPTAIN 360
Memory 2x4GB G.Skill Ripjaws V 2400mhz 10-14-13-32 2T, vDIMM 1.775v
Video Card(s) ASUS GTX 1060 Strix 6GB OC, Core: 2190mhz, Vcore: 1.075v, Mem: 4909mhz (Sillicon Lottery Jackpot)
Storage Samsung 840 EVO 1TB SSD, WD Blue 1TB
Display(s) BenQ XL2430 1080p 144HZ + (2) Samsung SyncMaster 913v 1280x1024 75HZ + A Shitty TV For Movies
Case Deepcool Genome ROG Edition
Audio Device(s) Bunta Sniff Speakers From The Tip Edition
Power Supply Corsair CX430M + CableMod Cables
Mouse Logitech G602
Keyboard Shitty Dell Office Keyboard
Software Windows 7 Ultimate 64 Bit
Benchmark Scores 12 101 Firestrike (3rd for my hardware)
taken from wikichip, those are supposedly 10nm dies

well this article was DoA it seems
Feb 3, 2017
1,507 (1.68/day)
Processor i5-8400
Cooling CRYORIG C7 Cu
Memory 2*16GB DDR4-3200 CL16
Video Card(s) Gainward GeForce RTX 2080 Phoenix
Storage 1TB Samsung 970 Pro, 1TB Samsung 850 EVO, 1TB Crucial MX500
Display(s) ASUS PG279Q, Eizo EV2736W
Case Dan Cases A4-SFX
Power Supply Corsair SF600
Mouse Logitech G700
Keyboard Corsair K60
Intel says: we found some glue!
Oct 18, 2013
1,257 (0.60/day)
Depends.... on where YOU are
System Name The Big RED One
Processor i7-6700k, oc'd to 4.7 ghz
Motherboard Gigabyte G1 Gaming 7- Z170x
Cooling H110i-GT w/3-AF140's in custom config, 4-AF140 (side int) + 3-AF140 (rear/top exh) All w/Red LED's
Memory 32GB Corsair Vengence Red RBG DDR4-3200 (4x 8GB) in XMP 2x
Video Card(s) Zotac GTX 1060/6GB w/15% o/c
Storage 2x WD Black SN750 1TB nvme
Display(s) 2x Samsung 43" LCD's @1920x1280 60hz
Case Thermaltake TT900 Super Tower w/custom paint and trim treatment
Audio Device(s) Bluetooth 4 optical amplifier & Speakers, + standard onboard components
Power Supply EVGA G2 SuperNova 850W Modular
Mouse Logitech MX5500 combo
Keyboard see above
Software Windows 10 pro 64 bit, with all the unnecessary background shiite turned OFF !
Benchmark Scores Quicker than flies on a dung pile
Intel say: now we have yet anutha reason to charge even more outrageous prices for our next gen chips..... :eek: o_O :cry:
Apr 19, 2018
189 (0.41/day)
I'm glad that Intel has also found that inferior, cheap, nasty glue they have been banging AMD about for the last few years...

But Intel can show off renders and non-functional "chips", but all I have to do is look left to the desktop sitting on my desk, and see AMD's advanced packaging living and breathing in real life, in a real application that works flawlessly...
Sep 17, 2014
9,421 (5.34/day)
Too Long to fit in a single line here.
Processor i7 8700k 4.7Ghz @ 1.26v
Motherboard AsRock Fatal1ty K6 Z370
Cooling beQuiet! Dark Rock Pro 3
Memory 16GB Corsair Vengeance LPX 3200/C16
Video Card(s) MSI GTX 1080 Gaming X @ 2100/5500
Storage Samsung 850 EVO 1TB + Samsung 830 256GB + Crucial BX100 250GB + Toshiba 1TB HDD
Display(s) Eizo Foris FG2421
Case Fractal Design Define C TG
Power Supply EVGA G2 750w
Mouse Logitech G502 Protheus Spectrum
Keyboard Sharkoon MK80 (Brown)
Software W10 x64
Intel say: now we have yet anutha reason to charge even more outrageous prices for our next gen chips..... :eek: o_O :cry:
AMD says, hold my beer, let me show you an EPYC
Aug 13, 2010
4,325 (1.33/day)
AMD says, hold my beer, let me show you an EPYC
Hahahah... that's really good dude. great stuff.

uhmm i have one.
Shintel says: uhh count to ten? 2, 4, 6, 8, 8, 8. Get it? they can't count more than 8 dude
hahahaha. really wonder how Intel still exists sometimes you know
Jul 3, 2019
26 (1.73/day)
Processor 6700k
Motherboard Asus M8G
Cooling NH-D15S
Memory 16GB @ 3000c15
Video Card(s) 750Ti, temp.
Storage Samsung 850 Pro
Display(s) Dell U2410
Case Thermaltake
Power Supply Seasonic
Mouse Razer
Keyboard Logitech
Why do i get the feeling, these will be veeery expensive.