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Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF

btarunr

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Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.

As a result of rapid growth in multi-core processing and computing virtualization, today’s data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.

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