- Aug 30, 2006
- 6,374 (1.55/day)
|System Name||ICE-QUAD // ICE-CRUNCH|
|Processor||Q6600 // 2x Xeon 5472|
|Memory||2GB DDR // 8GB FB-DIMM|
|Video Card(s)||HD3850-AGP // FireGL 3400|
|Display(s)||2 x Samsung 204Ts = 3200x1200|
|Audio Device(s)||Audigy 2|
|Software||Windows Server 2003 R2 as a Workstation now migrated to W10 with regrets.|
they actually do. I de-IHS'd a lot of my CPU's, and there was always reports of certain CPU's being soldered on. A quick google oughta find you results on it.
Whereas, the IHS thermal attachment method we see on CPUs or other components with IHS, can be using one of two methods:
1./ Adhesive TIM, similar to those heatsinks you see on PCBs that are not attached via clips but "glued" to the chip. The adhesive can soften or indeed melt at higher temperatures.
2./ Indium foil. It is a thin sheet of metal (foil) that is inserted between the die and the IHS and is a low-temperature, controlled thickness material, used for thermal attachment.
However, the point still stands, that if the CPU is so hot as to melt the thermal attachement materials, the temperature is probably high enough to damage the CPU (first) rather than just melting the TAM, reducing the cooling ability, so that overclocks are lower.
I span the google machine and found this: http://www.indium.com/blogs/TIM-Blog/Indium-Foil-a-Thermal-Interface-Material/20081003,27,2938/ . Lots of interesting reads on the site.