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Micron Introduces the World’s First 1 Gigabit DDR3 Memory for Computing Applications

Darksaber

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#1
Boise, Idaho, September 25, 2006 – Memory performance is becoming increasingly critical for a wide range of applications including PC gaming, servers, super computing and high-definition television (HDTV). All of these applications process a large amount of data that needs to be accessed quickly and efficiently. To enable the next level of memory performance for these applications, Micron Technology, Inc., is introducing today a 1 gigabit (Gb) double data rate (DDR)3 device that provides these key applications with faster speed, lower power and increased memory density.

"We are excited to introduce the world's first 1Gb DDR3 components," said Brian Shirley, vice president of Micron's memory group. "Micron's strength in advanced DRAM technology has given us the industry leading position in high density memory solutions."

Micron's DDR3 products will support data rates of 800 megatransfers per second (MT/s) to 1,600 MT/s with clock frequencies of 400 megahertz (MHz) to 800 MHz respectively, doubling the speed from DDR2. At DDR3's top speed, a 100,000-page document can be transferred in approximately one second. The DDR3 supply voltage has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30 percent; the device is manufactured on Micron's 78nm process technology. These DDR3 benefits will help enable the next level of performance in a wide array of computing devices.

"Early 2007 should bring memory thirsty computing and consumer applications, such as Microsoft's anticipated Vista operating system. DDR3 will initially benefit the server, notebook, and desktop markets and will then reach consumer applications such as graphics and HDTVs," said Shane Rau, senior analyst of IDC, a market intelligence firm.

Evaluation samples of Micron's leading-edge 1Gb DDR3 components are available to select customers with production expected to begin early next year. Micron's 1Gb DDR3 components will be available in various output configurations (x4, x8 and x16), and will be fully compliant to the most recent JEDEC DDR3 specifications (JEDEC is the leading developer of standards for the semiconductor industry). These components will support module densities from 512 megabytes (MB) through 4 gigabytes (GB) and a variety of module types including FBDIMMs, UDIMMs, SODIMMs, and RDIMMs.

A 2Gb DDR3 device is also expected to be available from Micron early next year, helping to enable even higher density applications.

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAM, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

This press release contains forward-looking statements regarding the production of DDR3 memory. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Company files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically the Company's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.

Source: Micron
 

cdawall

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#2
wow "doubling the speed of ddr2" thats insane
 
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#3
"A 2Gb DDR3 device is also expected to be available from Micron early next year" just intime to lure us to build new rigs for DX10...sweet
 
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#4
While you all move to DDR3, I'm stuck w/ DDR1...damn!
 
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#5
"A 2Gb DDR3 device is also expected to be available from Micron early next year" just intime to lure us to build new rigs for DX10...sweet
Sorry to do any bubble-bursting but Gb = gigabit as in referring to the FBGA chips, not the full memory dimms. It will likely be at the earliest 3rd quarter next year before we see availability of DDR3 platforms.
 
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#6
Sorry to do any bubble-bursting but Gb = gigabit as in referring to the FBGA chips, not the full memory dimms. It will likely be at the earliest 3rd quarter next year before we see availability of DDR3 platforms.
2Gbit = 256MB -> double sided dimm w/ 16 chips * 256MB = 4096MB = 4GB / dimm

I think there's no reason for anyone's bubble to burst. :D
 
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#7
Nephilim = Giant
666 = Satan


Or it could be turd, I get confused. Nice first post BTW.
 
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#8
Hey Steevo, thanks mate.

Largon, samsung have had ddr3 for several months now, intel have had it for longer, and I still don't see any modules (granted, there are no boards yet).

The demand won't pick up until mid 2007 at the earliest, look at the transition from DDR to DDR2, was there much non-DDR SDRAM around when DDR2 was introduced? Not in the enthusiast sector, not at all. The market doesn't change that rapidly.