• Welcome to TechPowerUp Forums, Guest! Please check out our forum guidelines for info related to our community.

Microsoft Unveils First Intel "Lakefield" Device and Surface Lineup with 10th Gen Core

btarunr

Editor & Senior Moderator
Staff member
Joined
Oct 9, 2007
Messages
39,217 (8.42/day)
Location
Hyderabad, India
Processor AMD Ryzen 7 2700X
Motherboard ASUS ROG Strix B450-E Gaming
Cooling AMD Wraith Prism
Memory 2x 16GB Corsair Vengeance LPX DDR4-3000
Video Card(s) Palit GeForce RTX 2080 SUPER GameRock
Storage Western Digital Black NVMe 512GB
Display(s) BenQ 1440p 60 Hz 27-inch
Case Corsair Carbide 100R
Audio Device(s) Creative Sound Blaster Recon3D PCIe
Power Supply Cooler Master MWE Gold 650W
Mouse ASUS ROG Strix Impact
Keyboard Microsoft Sidewinder X4
Software Windows 10 Pro
Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be powered by Intel's unique processor, code-named "Lakefield," that features an industry-first architecture combining a hybrid CPU with Intel's Foveros 3D packaging technology. It offers device-makers more flexibility to innovate on design, form factor and experience.

"The innovation we've achieved with Lakefield gives our industry partners the ability to deliver on new experiences, and Microsoft's Neo is trailblazing a new category of devices. Intel is committed to pushing the boundaries of computing by delivering key technology innovations for partners across the ecosystem," said Gregory Bryant, Intel executive vice president and general manager of the Client Computing Group.



Surface Neo is the culmination of deep engineering collaboration between Intel and Microsoft to drive innovation in new form factors, such as dual-screen devices. It exemplifies the companies' shared vision of advancing the PC industry by delivering remarkable new usages and experiences without compromising on performance, design and the full Windows experience.

Leveraging Intel's latest 10nm process and Foveros advanced packaging technology, Lakefield achieves a dramatic reduction in package area - a miniscule 12x12x1 mm - that is necessary for pushing the limits of form factor design. Its hybrid CPU architecture combines power efficient "Tremont" cores with a performance scalable "Sunny Cove" core to deliver computing performance and next-generation graphics at low power for long battery life. Lakefield is symbolic of the strategic shift in Intel's design and engineering model that underpins the company's future product roadmaps: enabling workload-optimized PC platforms through the right mix of leadership performance, architectures, manufacturing technologies and intellectual properties.

In addition, Microsoft announced new Surface devices based on 10th Gen Intel Core processors: the Surface Pro 7 and the Surface Laptop 3. The new Surface devices bring the intelligent performance, rich and immersive Intel Iris Plus graphics experience and best-in-class connectivity1 of 10th Gen Intel Core to consumers and businesses in beautiful premium designs.

The new Surface devices are based on 10th Gen Intel Core processors, code-named "Ice Lake." Both are available for pre-order today in select markets.
  • The Surface Pro 7 was redesigned from the inside out, offering great performance and improved graphics with the versatility of a 2 in 1 form factor.
  • Surface Laptop 3 delivers style and speed with a 13.5-inch display and new colors and finishes.

View at TechPowerUp Main Site
 
Joined
Jun 28, 2016
Messages
3,595 (2.45/day)
This makes me think just for how long they had Foveros ready - gathering dust until 10nm becomes sensible.

Great news. Surface Neo is both excellent and... kind of obvious. I can't believe there are so few devices of this kind.
 
Joined
Oct 17, 2014
Messages
4,605 (2.20/day)
Location
USA
System Name Paladius Tacet
Processor Ryzen 4800x (upgrade from 3600 @ 4.4 all core no downclock)
Motherboard MSI X570 Tomahawk
Cooling Arctic Freezer 34 DUO (custom aggressive fan curve)
Memory G.Skill 2x8 (16gb) 3800 cas 16--- 1:1 Infinity Fabric
Video Card(s) Big Navi (upgrade for rx 580)
Storage Micron 2TB SSD
Display(s) Pixio Px7 27" 2560x1440 165hz IPS DCI-P3 95% HDR400
Case Corsair 110Q Silent + NZXT Aer-P fans
Audio Device(s) Logitech THX 2.1 and Schiit Modi 3 DAC
Power Supply EVGA 700w Gold
Mouse Logitech G305
Keyboard Kingston Hyperx Cherry Mx Blue
Software Linux Ubuntu, Libreoffice, Steam
so with this has all hardware security issues been resolved? or will we still see a security article every 2 months about intel...
 
Joined
Feb 3, 2017
Messages
2,433 (1.95/day)
Processor i5-8400
Motherboard ASUS ROG STRIX Z370-I GAMING
Cooling Alpenföhn Black Ridge
Memory 2*16GB DDR4-3200 CL16
Video Card(s) Gainward GeForce RTX 2080 Phoenix
Storage 1TB Samsung 970 Pro, 2TB Intel 660p
Display(s) ASUS PG279Q, Eizo EV2736W
Case Dan Cases A4-SFX
Power Supply Corsair SF600
Mouse Logitech G700
Keyboard Corsair K60
so with this has all hardware security issues been resolved? or will we still see a security article every 2 months about intel...
Cascade Lake and latest stepping of other CPUs have pretty much all the fixes in hardware:

Sunny Cove and Lakefield are definitely recent enough to have the same fixes.
 
Joined
Nov 13, 2007
Messages
7,975 (1.73/day)
Location
Austin Texas
System Name _
Processor 8700K @ 5.1 24/7
Motherboard MSI Z370-A PRO
Cooling 120mm Custom Liquid
Memory 32 GB 4000 Mhz DDR4 17-18-18-34-400 trfc - 2T
Video Card(s) Gigabyte GTX 2080 Ti Windforce (Undervolted OC 1905MHz)
Storage 3x1TB SSDs
Display(s) Alienware 34" 3440x1440 120hz, G-Sync
Case Jonsbo U4
Audio Device(s) Bose Solo
Power Supply Corsair SF750
Mouse logitech hero
Keyboard tenkeyless
Software Windows 10 64 Bit
Benchmark Scores pretty fast!
Yeah it looks like everything was delayed by the 10nm catastrophe.

On the other hand they are facing heavy competition from ARM and GF/TSMC in terms of packaging:
Apparently they have been working on the 3D stacking for some time now in the background. That's what Keller has been alluding to in his latest statements about chip sizes and Moore's law.

I think the 2021 chips are going to be a 3d stacked design (just a guess).

Not sure how it will affect clockspeeds and power though; there might be a heavy tradeoff for the additional density.
 
Top