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Mushkin Announces Ascent Memory Modules With eVCI Cooling

malware

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#1
Mushkin, a global leader in high-performance computer products, announced the launch of a new high performance line of memory modules aimed at the power gamer market. Called Ascent, the new line raises the bar on its Redline and XP premium memory offering by using eVCI (enhanced Vapor Chamber Interface) cooling technology, the current state-of-the-art in heat spreaders.




“By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance,” said Brian Flood, director of product development for Mushkin. “The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia’s new eVCI technology.”

At the heart of Mushkin’s eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies (www.celsiatech.com) that are encased on the outer dimensions by high conductivity 6063 aluminum alloy. In direct contact with 95% of the memory chip surface area, the vapor chambers effectively eliminate hot spots on the chip and quickly transfer heat to the aluminum where it is dissipated into the surrounding air.

eVCI, Celsia’s unique vapor chamber solution, was exclusively designed for the Mushkin Ascent line of Redline and XP memory modules, and the new line is among the first to use this innovative approach to rapid cooling of high performance chips. Additionally, the low profile, thin design allows full usage of all memory slots while complementing many of the largest CPU coolers, which often limit memory module height.

“The gamers we’re targeting with this new product line are extremely sensitive to the available memory slots they have for upgrades so the slim design of this new line will be particularly attractive to them as well,” added Flood.

Ascent XP Series – Available now through Mushkin authorized resellers

Two new products are being announced today in the Ascent XP series:
  • The Ascent 4GB (2x2GB) XP2-8500 5-5-5-15 offers the ideal 1066MT/s rating which provides extreme memory performance in both overclocked and non-overclocked FSB scenarios for DDR2 users. The high 4GB density allows users to heavily multitask and get maximum performance from their Vista-based machines.
  • The Ascent XP3-16000, coupled with an NVIDIA 790i-chipset motherboard, reach blazing speeds of DDR3-2000 for ultimate gaming and benchmarking performance. The Ascent XP3-16000 also features new EPP 2.0 SPD performance extensions for plug-and-play operation on enabled platforms.

Ascent Redline Series – Available within sixty days through select Mushkin resellers

Configurations in the Ascent Redline series promise to offer the most extreme frequency options for the most performance oriented PC enthusiast.

Available Part Numbers:
991619 – 2GB XP2-8500 5-5-5-15 2.0-2.1V Ascent XP Series
996619 – 4GB (2x2GB) XP2-8500 5-5-5-15 2.0-2.1V Dual Pack Ascent XP Series
991620 – 1GB XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
996620 – 2GB (2x1GB) XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series

Source: Legit Reviews
 

hat

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#2
Finally they actually dissipate heat and not just trap them under the heatspreader -_-
 
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#3
Same deal as the Sapphire Toxic/other names 3870?
 

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#4
How does the 3870 relate to desktop memory?
 
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#5
He probably thought they took a chapter out of Sapphire's book and just slapped a few new words here and there and you got eVCI cooling!
 

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#6
Vapor Champer seem to be the new Heat Pipe, shouldn't be long until someone makes a CPU cooler with a Vapor Champer base.
 

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#7
Shame it's only the high density DDR2 modules they're doing with this heatspreader. They don't even need it imo because they don't work well at voltages above 2.2v

Now if they did the 128x64 modules with this heatspreader it would be awesome!
 
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#9
Why to hell are they using 6063 aluminum alloy?!? It has lower thermal conductivity than regular aluminum! 6063 is what my bike frame is made of!!! :banghead:
 

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#10
Perhaps the liquid/vapor coolant stuff is under pressure, or a vaccume?

Only reason i can think of.
 
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#11
Can't wait until electronics manufacturers run out of four letter words to call their patents.
 
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#14
Heck, I can't wait until electronics manufacturers make products good enough WE don't have to USE four letter words!:roll:

Regarding the design, I like the direction it is heading......
God if I see another ram stick cooled with w/c I'm going to shoot myself.
 

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#15
Looks pretty slick to me. I guess the Redline is the awesome overclocking solution?
 

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#16
Its just funny to see you guys get tricked by simple marketing :rolleyes:

They are the same thing.
No they are not and I'm not that stupid you think with that post.

"Heatpipes already use this ‘evaporative cooling’ phenomenon, but while heatpipes require coolant to be forced in one direction along a set path, vapour chambers allow the heat to be transferred in all directions. You could think of them as a large-diameter, flat heatpipe, with the liquid moving through the layers of the chamber, rather than travelling along a restrictive pipe."

It would be the same as stating Ferrari and Volvo the same. Sure they both do the same thing, but get there a bit different. When you are not ristricted to pipe shape you can make the whole cooler base of heatpipe. No need to flatten them or file them down or any other direct contact stuff.

Tricky part will be how to attach high fins to it but HTPC cooler should be possible at least. When it's ready then we can be 'tricked by marketing' (read: TPU review). Or are you saying W1zzard got tricked too, as the Sapphire HD3870 Atomic did ok with it's "same thing"? It's something new and seems to work so it will be used (by manufacturers) and bought (by us 'tricked' ones).
 
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#18

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#19
Picture isnt showing up d4s4
 
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#20
Wtf, works for me...
 
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#22
nice looking ram!
im tempted to try them out!
 

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#23
Wow diamonds are very conductive!!
 
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#24
That's why places sell diamond dust thermal paste :)
 
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#25
That's why places sell diamond dust thermal paste :)
Diamond paste doesnt help because heat transfer can only be so quick through a thin layer...

No they are not and I'm not that stupid you think with that post.

"Heatpipes already use this ‘evaporative cooling’ phenomenon, but while heatpipes require coolant to be forced in one direction along a set path, vapour chambers allow the heat to be transferred in all directions. You could think of them as a large-diameter, flat heatpipe, with the liquid moving through the layers of the chamber, rather than travelling along a restrictive pipe."

It would be the same as stating Ferrari and Volvo the same. Sure they both do the same thing, but get there a bit different. When you are not ristricted to pipe shape you can make the whole cooler base of heatpipe. No need to flatten them or file them down or any other direct contact stuff.

Tricky part will be how to attach high fins to it but HTPC cooler should be possible at least. When it's ready then we can be 'tricked by marketing' (read: TPU review). Or are you saying W1zzard got tricked too, as the Sapphire HD3870 Atomic did ok with it's "same thing"? It's something new and seems to work so it will be used (by manufacturers) and bought (by us 'tricked' ones).
Its still a heatpipe nonetheless. "Vapour chamber" or eVCI cooling is just a marketing name, to trick you into thinking its new-and superior. I'm just pointing out that they are using this just as a method of marketing-its human nature to be more interested in something new.

Sure HD3870 Atomic, the cooler works fine. Even though temps aren't really an improvement vs the original cooler due to the lack of surface area that a vapour chamber has.

Anyway back on topic: How does Mushkin compare to other high end memory?