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| Processor | Intel Core 2 Quad Q6600 G0 VID: 1.2125 |
|---|---|
| Motherboard | GIGABYTE GA-P35-DS3P rev.2.0 |
| Cooling | Thermalright Ultra-120 eXtreme + Noctua NF-S12 Fan |
| Memory | 4x1 GB PQI DDR2 PC2-6400 |
| Video Card(s) | Colorful iGame Radeon HD 4890 1 GB GDDR5 |
| Storage | 2x 500 GB Seagate Barracuda 7200.11 32 MB RAID0 |
| Display(s) | BenQ G2400W 24-inch WideScreen LCD |
| Case | Cooler Master COSMOS RC-1000 (sold), Cooler Master HAF-932 (delivered) |
| Audio Device(s) | Creative X-Fi XtremeMusic + Logitech Z-5500 Digital THX |
| Power Supply | Chieftec CFT-1000G-DF 1kW |
| Software | Laptop: Lenovo 3000 N200 C2DT2310/3GB/120GB/GF7300/15.4"/Razer |
Mushkin, a global leader in high-performance computer products, announced the launch of a new high performance line of memory modules aimed at the power gamer market. Called Ascent, the new line raises the bar on its Redline and XP premium memory offering by using eVCI (enhanced Vapor Chamber Interface) cooling technology, the current state-of-the-art in heat spreaders.
"By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance," said Brian Flood, director of product development for Mushkin. "The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia's new eVCI technology."
At the heart of Mushkin's eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies (www.celsiatech.com) that are encased on the outer dimensions by high conductivity 6063 aluminum alloy. In direct contact with 95% of the memory chip surface area, the vapor chambers effectively eliminate hot spots on the chip and quickly transfer heat to the aluminum where it is dissipated into the surrounding air.
eVCI, Celsia's unique vapor chamber solution, was exclusively designed for the Mushkin Ascent line of Redline and XP memory modules, and the new line is among the first to use this innovative approach to rapid cooling of high performance chips. Additionally, the low profile, thin design allows full usage of all memory slots while complementing many of the largest CPU coolers, which often limit memory module height.
"The gamers we're targeting with this new product line are extremely sensitive to the available memory slots they have for upgrades so the slim design of this new line will be particularly attractive to them as well," added Flood.
Ascent XP Series - Available now through Mushkin authorized resellers
Two new products are being announced today in the Ascent XP series:
Ascent Redline Series - Available within sixty days through select Mushkin resellers
Configurations in the Ascent Redline series promise to offer the most extreme frequency options for the most performance oriented PC enthusiast.
Available Part Numbers:
991619 - 2GB XP2-8500 5-5-5-15 2.0-2.1V Ascent XP Series
996619 - 4GB (2x2GB) XP2-8500 5-5-5-15 2.0-2.1V Dual Pack Ascent XP Series
991620 - 1GB XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
996620 - 2GB (2x1GB) XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
View at TechPowerUp Main Site
"By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance," said Brian Flood, director of product development for Mushkin. "The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia's new eVCI technology."
At the heart of Mushkin's eVCI cooling solution are two 123mm x 25mm liquid filled copper vapor chambers developed by Celsia Technologies (www.celsiatech.com) that are encased on the outer dimensions by high conductivity 6063 aluminum alloy. In direct contact with 95% of the memory chip surface area, the vapor chambers effectively eliminate hot spots on the chip and quickly transfer heat to the aluminum where it is dissipated into the surrounding air.
eVCI, Celsia's unique vapor chamber solution, was exclusively designed for the Mushkin Ascent line of Redline and XP memory modules, and the new line is among the first to use this innovative approach to rapid cooling of high performance chips. Additionally, the low profile, thin design allows full usage of all memory slots while complementing many of the largest CPU coolers, which often limit memory module height.
"The gamers we're targeting with this new product line are extremely sensitive to the available memory slots they have for upgrades so the slim design of this new line will be particularly attractive to them as well," added Flood.
Ascent XP Series - Available now through Mushkin authorized resellers
Two new products are being announced today in the Ascent XP series:
- The Ascent 4GB (2x2GB) XP2-8500 5-5-5-15 offers the ideal 1066MT/s rating which provides extreme memory performance in both overclocked and non-overclocked FSB scenarios for DDR2 users. The high 4GB density allows users to heavily multitask and get maximum performance from their Vista-based machines.
- The Ascent XP3-16000, coupled with an NVIDIA 790i-chipset motherboard, reach blazing speeds of DDR3-2000 for ultimate gaming and benchmarking performance. The Ascent XP3-16000 also features new EPP 2.0 SPD performance extensions for plug-and-play operation on enabled platforms.
Ascent Redline Series - Available within sixty days through select Mushkin resellers
Configurations in the Ascent Redline series promise to offer the most extreme frequency options for the most performance oriented PC enthusiast.
Available Part Numbers:
991619 - 2GB XP2-8500 5-5-5-15 2.0-2.1V Ascent XP Series
996619 - 4GB (2x2GB) XP2-8500 5-5-5-15 2.0-2.1V Dual Pack Ascent XP Series
991620 - 1GB XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
996620 - 2GB (2x1GB) XP3-16000 9-9-9-24 1.9-2.0V Ascent XP Series
View at TechPowerUp Main Site
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