- May 16, 2011
- 1,430 (0.49/day)
- A frozen turdberg.
|System Name||Runs Smooth|
|Motherboard||Crosshair V Formula Z|
|Cooling||Corsair H110 with AeroCool Shark 140mm fans|
|Memory||16GB G-skill Trident X 1866 Cl. 8|
|Video Card(s)||HIS 7970 IceQ X² GHZ Edition|
|Storage||OCZ Vector 256GB SSD & 1Tb piece of crap|
|Case||NZXT Phantom 820 matte black|
|Power Supply||NZXT Hale90 V2 850 watt|
|Software||Windows 7 Pro|
|Benchmark Scores||Lesbians are hot!!!|
http://www.eurekalert.org/pub_releases/2011-05/nsfc-nim052611.php"Today, higher-power computer chips are available, but they generate too much heat," said Didion, who is leading the technology-development effort also involving Matthew Showalter, associate branch chief of Goddard's Advanced Manufacturing Branch, and Mario Martins of Edge Space Systems, an engineering company specializing in thermal systems in Glenelg, Md. "If I can carry away more heat, engineers will be able to use higher-power components. In other words, they will be able to do more things."
Sounds good to me.