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I was really hoping that I would be permanently switched over to onboard audio back at Haswell-E, but ALC 4080 was a real disappointment. Not sure what possessed Realtek to go and break something that was working perfectly okay as it was (SupremeFX, in my case). Why USB 2.0, what was the point of that?
Anyway, after more testing, the results are the same -- crash and burn at 1440p in ray tracing mode. Of note is that after the benchmark run my C: drive (a Western Digital SN850X 2Tb) has increased in temperature about 10C, which only happens with extensive writes, so the bench has run out of VRAM and is swapping in and out of storage instead.
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These are the drive temps after the 1440p RT run.
With ALC 4080 I don't incline towards Realtek fault . They made the chip but don't think so they push MOBO manufacturers to run USB trails next to it.
IMO the fault lies with the MOBO manufacturers in implementing ALC 4080 together with USB as crammed as possible. A flawed design from the start.
And they knew the electricity trails will influence negative the sound. Is an old known fact. Some of them added metal casing on top of the sound circuits to provide EMF shield yet the problem was underneath the shield already
Glad that you trying to check everything on your system, but drives temps shouldn't influence the benchmark IMO, specially when your boot drive is very fast and is a good one, is not a P3 to throttle at low temps.
I would run this benchmark x3 @1440P and check memory junction temps for the 3070, maybe the VRAM is throttled by the heat, just a wild guess, I don't know if they coded something in the BIOS of 3070 and 3080 to throttle down VRAM if is too hot. PCBs on this cards are very crammed and thin which will make the heat traverse the PCB faster towards the backplate.
On the other hand the benchmark is at the start. Is an alpha stage I guess.
Your VRAM 256 bit bandwidth should suffice for 1440 P but maybe benchmark is pushing it hard... IDK.
As you can see my 1080 Ti with 352 bit bandwidth doesn't do better on the VRAM side and is got wider bandwidth and +3GB more.
Is also possible that, maybe, you have leaky pads on your 3070, silicon grease/oil will attract moist trough dust collection points on PCB will which will enhance the possibility of unwanted small electrical discharges all over the place(PCB level) in between electrical components which will result in instability of the card, is a chain reaction.
You can see in the picture bellow how dust was piling up, around various components(which is the main issue dust is trapping moisture), on silicon oil leak patches on my 1080Ti PCB under the back plate.
Of course the humidity in the room is an important factor. The black patches where the thermal pads was sitting, the rest is silicon oil with cumulated dust.
I had bad leaky pads but, my card is EVGA. Change them all with thermal putty Upsiren UTP 8 and got 8 C less. That putty is very good and cheaper than thermal pads. It won't leak either.
Other thermal pads will leak, I've seen on Sapphire and other big brands.
Just some insights in "electronic" instability, and obviously poor stability under the stress.