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Proper thermal application on HDT

Discussion in 'Overclocking & Cooling' started by Sanhime, Jul 30, 2009.

  1. Sanhime

    Sanhime

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    Whats the the proper way of applying thermal compound to heatsinks with HDT or heatpipe-direct-touch (ie: Xigmatek and Kingwin heatsinks)?
     
  2. hat

    hat Enthusiast

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    2 ways:
    apply a thin line of paste on each heatpipe

    or...

    apply a thin layer on the cpu

    I prefer the first meathod
     
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  3. erocker

    erocker Super Moderator Staff Member

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    Like this:

    [​IMG]

    Make sure the cracks are filled in with thermal paste first and wipe away the excess, then two small lines where it's depicted in the picture.
     
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  4. Beertintedgoggles

    Beertintedgoggles

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    I'm a big fan of use a little too much, make up for it by constructing your own mounting plate and have a lot of mounting force. I recently used a Xig on a build for my brother on an AM3 rig. Their mounting mech. would have had the fan facing either up or down instead of front to back so I fashioned my own, spread a thin layer of TIM on the CPU then ran a line down each of the pipes before mounting.... then screwed that bastard down so it won't budge at all when he picks it up and drives it from Ohio to Virginia.
     
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  5. Sanhime

    Sanhime

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    hmm, 2 different ways: so one is one the pipe, and the other is between the pipes. lol
     
  6. BazookaJoe

    BazookaJoe

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    I'm PRETTY sure your only supposed to put compound on the actual pipes... To help conduct the heat into them...

    But I have a TRUE120 :) - so what do I know.

    Edit : Filling in the cracks does make sense tho - HDT coolers do lose a lot of efficiency by air in the cracks preventing proper heat spread (to the outer pipes) - so thermal compound in there would help with that.
     
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  7. erocker

    erocker Super Moderator Staff Member

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    The way it is done in the pic I provided is the best way to do it. Benchmark Reviews tried a bunch of different ways, as did I.
     
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  8. Dragonsmurf New Member

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    I found on my CPU's to use a 5 dot pattern works best. my suggestion would be is to try different ways and see what works best for you. you go through a lot of thermal paste at first. also make sure u have a retention plate as well.
     
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  9. crazy pyro

    crazy pyro New Member

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  10. BazookaJoe

    BazookaJoe

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    Yeah - I suppose no matter where you look there's somebody claiming one way works better than another - erocker / Arctucas method looks good.

    And erocker is looking very "Dr Steel".

    What makes it more complicated still is exactly what KIND of compound you are using. Many more exotic variants have quite different spreading & curing behavior as well - so the exact same method may yield different results depending on compound :\
     
    Last edited: Jul 30, 2009
  11. Sanhime

    Sanhime

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    Can you use isopropanol (aka IPA, rubbing alcohol, 2propanol) to remove the TIM off the NB if I decide to switch from stock NB cooling to after market?
    And why do manufacturer use so much TIM on the NB, I popped my EVGA x58 NB heatsink and its trenched in Artic Ceramique.
    And why did they use something non-conductive like ceramique? Whats wrong with arctic silver 5 on NB?
     
    Last edited: Jul 31, 2009
  12. Dragonsmurf New Member

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    yea it will work or get the job done. nothing wrong with as5 but there are better compounds that require no curing time and are cheaper. gc xtreme is one of them. noctua nth1, cm thermal fusion 400 to name a few
     

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